Patents for C25F 3 - Electrolytic etching or polishing (4,256)
03/2003
03/20/2003WO2002078903A3 Method and apparatus for avoiding particle accumulation during an electrochemical process
03/20/2003US20030054729 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
03/13/2003US20030047464 Electrochemically roughened aluminum semiconductor processing apparatus surfaces
03/12/2003EP1290249A1 Method and apparatus for end-point detection
03/12/2003CN1401826A Method and apparatus for pollution-less electromachining metal printing cylinder
03/11/2003US6531048 Electrochemical process to sever metal fibers
03/06/2003WO2003019641A1 Dummy structures to reduce metal recess in electropolishing process
03/06/2003US20030042146 Method of plating and pretreating aluminium workpieces
03/06/2003CA2456301A1 Dummy structures to reduce metal recess in electropolishing process
03/05/2003EP1287185A1 Anode assembly for plating and planarizing a conductive layer
03/05/2003CN1400335A Method for making die with stereo pattern
02/2003
02/27/2003WO2003017330A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
02/27/2003WO2003015870A2 Radioactive implantable devices and their production methods
02/27/2003CA2456225A1 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
02/26/2003EP1285278A1 Silicon nanoparticles microcrystal nonlinear optical devices
02/18/2003US6521118 Semiconductor etching process and apparatus
02/13/2003WO2003012162A1 Electrochemically roughened aluminum semiconductor processing apparatus surfaces
02/12/2003CN1396316A Anode oxidizing process for treating surface of porous silicon
02/12/2003CN1396315A Cathode reduction process for treating surface of porous silicon
02/04/2003US6514400 Method for producing a fuel cell separator
01/2003
01/30/2003WO2003009321A1 Aluminum foil for electrolytic capacitor
01/30/2003US20030019761 Immersing brazed nickel-base alloy components joined by nickel alloy brazing composition in electrolyte, applying potential at magnitude wherein nickel base alloy components are electrochemically passive and brazing alloy dissolves
01/30/2003US20030019756 Reaction is executed in a reaction vessel containing matter in a supercritical or subcritical state and an electrolytic solution; free of generated liquid waste, no need to clean the electrode
01/29/2003EP1279520A1 Lithographic printing plate precursor
01/23/2003US20030015435 An electro-etching process for a semiconductor wafer
01/16/2003US20030010648 Electrochemically assisted chemical polish
01/15/2003CN1391243A Process for preparing 35Vw and 50Vw anode foil with high specific capacity and low contact resistance
01/07/2003US6502833 Metal C-shaped ring gasket
01/03/2003WO2003001582A2 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
01/03/2003WO2003001581A2 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
01/02/2003EP1270129A2 Selective removal of brazing compound from joined assemblies
01/01/2003CN1388274A Physiochemical electron beam polishing method
12/2002
12/31/2002US6500281 Fe-Ni alloy material used for shadow mask having improved formability of through-holes by etching
12/27/2002WO2002103085A1 Method and electrode for defining and replicating structures in conducting materials
12/27/2002CA2462098A1 Method and electrode for defining and replicating structures in conducting materials
12/19/2002US20020189784 Process for manufacturing a strip of aluminium alloy for lithographic printing plates
12/19/2002US20020189725 Method for producing an aluminium strip for lithographic printing plates
12/18/2002EP1264202A4 Silicon nanoparticle stimulated emission devices
12/18/2002CN1385271A Selectively removing braze composition from conneted assembly
12/12/2002DE10149928C1 Process for treating the surface of a workpiece made from aluminum or aluminum alloy used in the manufacture of car trims comprises polishing the workpiece in an aqueous electrolyte by applying an electrical direct voltage
12/11/2002EP1264202A1 Silicon nanoparticle stimulated emission devices
12/10/2002US6491808 Electrolytic cells
12/05/2002DE10127026A1 Process for removing nickel from the surface of metal parts e.g. permanent magnets comprises using chemical or electro-chemical etching
12/03/2002US6488834 Blade re-sharpener and method
12/03/2002US6487969 Heat sensitive printing plate precursors
11/2002
11/28/2002US20020175419 Electropolishing metal layers on wafers having trenches or vias with dummy structures
11/27/2002CN1382231A Method and device for electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on surface of electrically insulating film materials and use of
11/21/2002US20020171198 Star wheel surface enhancement and process of manufacture
11/13/2002EP1255880A1 Electro-polishing fixture and electrolyte solution for polishing nitinol stents and method of using same
11/13/2002CN1379124A Process for treating surface of Mg alloy
11/12/2002US6478936 Anode assembly for plating and planarizing a conductive layer
11/07/2002WO2002088431A1 Anode assembly and process for supplying electrolyte to a planar substrate surface
11/07/2002US20020162750 Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs
11/05/2002US6475646 Electrocleaning, electropolishing, removing inclusions, rinsing, and forming multi-plated layers on the surface of a thin plate
11/05/2002US6475233 Stent having tapered struts
10/2002
10/31/2002WO2002086961A1 Electropolishing metal layers on wafers having trenches or vias with dummy structures
10/31/2002WO2002086197A1 Method of plating and pretreating aluminium workpieces
10/31/2002US20020157952 Adding sulfuric acid to an acid treatment solution which contains a non-alkaline metal ions to produce sulfate, and recovering the regenerated acid treatment solution by separating the sulfate (aluminum sulfate)
10/31/2002CA2440756A1 Method of plating and pretreating aluminium workpieces
10/24/2002WO2002084748A2 Method for producing optically transparent regions in a silicon substrate
10/24/2002US20020153246 Method and apparatus for electropolishing metal interconnections on semiconductor devices
10/24/2002US20020153097 Electroetching process and system
10/23/2002CN2517755Y Novel graphite plate electrode for mfg. electrolytic corrosion aluminium foil
10/22/2002US6468413 Electrochemical etch for high tin solder bumps
10/17/2002DE10118568A1 Production of optically transparent regions in a silicon substrate used for optical investigations of small amounts of liquid in medicine and analysis comprises etching and oxidizing the defined transparent regions in the substrate
10/10/2002WO2002078903A2 Method and apparatus for avoiding particle accumulation during an electrochemical process
10/10/2002WO2002058113A3 Electrochemical methods for polishing copper films on semiconductor substrates
10/03/2002US20020139682 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits
10/02/2002EP1146984B1 Method and apparatus for electrochemically processing material
09/2002
09/24/2002US6456423 Silicon nanoparticle microcrystal nonlinear optical devices
09/12/2002WO2002070792A1 Method for etching layers deposited on transparent substrates such as a glass substrate
09/12/2002CA2437886A1 Method for etching layers deposited on transparent substrates such as a glass substrate
09/11/2002CN1090687C Low-pressure anode aluminium foil face-expanding erosion method
09/10/2002US6447668 Methods and apparatus for end-point detection
09/05/2002US20020121497 Flexible stent and method of manufacture
08/2002
08/29/2002US20020119671 Controlled potential anodic etching process for the selective removal of conductive thin films
08/29/2002US20020119394 Lithographic printing plates; radiation sensitivity
08/27/2002US6440295 Method for electropolishing metal on semiconductor devices
08/27/2002US6439295 Process for manufacturing a strip of aluminum alloy for lithographic printing plates
08/22/2002US20020115283 Planarization by selective electro-dissolution
08/21/2002EP1232997A1 Method of treating an acid treatment solution, device for treating the solution, and method of fabricating a support for a planographic printing plate
08/21/2002EP1232116A1 Silicon nanoparticle and method for producing the same
08/15/2002US20020108867 Selectively turning on a chiller and heater to controll the temperature of electrolyte
08/14/2002EP1231510A2 Printing plate having a radiation-sensitive recording layer on a rolled and embossed aluminium support, and process for the production thereof
08/14/2002EP1230441A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method
08/14/2002EP1230430A2 Method of producing an aluminium surface with a high total reflectance
08/13/2002US6432295 Process and device for electrolytic polishing of surgical needles
08/08/2002US20020104764 Applying a voltage across a polishing pad and the substrate, while an electropolishing electrolyte is dispensed at an interface of the substrate and the polishing pad, and while pooling the electrolyte about the substrate
08/06/2002US6428682 Chemically etching substrate material, subjecting etched substrate to electrochemical polishing using solution, repeating both steps, wherein surface of substrate is not exposed to air between steps
08/06/2002US6428681 Of a pipe, includes detector of the position of a cathode within the pipe, so that when cathode is traveling downward, electrolyte flow is reversed e.g. by valves or pumps to carry any bubbles away from the cathode
07/2002
07/25/2002WO2002058113A2 Electrochemical methods for polishing copper films on semiconductor substrates
07/25/2002WO2002042030A3 Fluted electrochemical machining
07/24/2002EP0827631B1 Process for structuring porous silicon
07/23/2002US6423636 Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer
07/23/2002US6423207 Method and apparatus for etching
07/23/2002US6423206 Method for electrochemical roughening of a substrate
07/18/2002US20020092777 Method of manufacturing electrode foil for aluminum electrolytic capacitor and AC power supply unit
07/18/2002US20020092776 Part fabricating method
07/11/2002WO2002023616A8 Integrating metal with ultra low-k dielectrics
07/11/2002US20020091438 Stent design
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