Patents for C25F 3 - Electrolytic etching or polishing (4,256)
11/2001
11/22/2001WO2001088229A1 Method and apparatus for end-point detection
11/22/2001CA2409755A1 Method and apparatus for end-point detection
11/20/2001US6319370 Apparatus for photoelectrochemical polishing of silicon wafers
11/15/2001WO2001086031A1 Anode assembly for plating and planarizing a conductive layer
11/14/2001CN1322008A Process for producing semiconductor device
11/14/2001CN1321797A Etching device
11/13/2001US6315885 Method and apparatus for electropolishing aided by ultrasonic energy means
11/01/2001US20010036746 Methods of producing and polishing semiconductor device and polishing apparatus
10/2001
10/24/2001EP1146984A1 Method for electrochemically processing material
10/18/2001WO2001077011A1 Metal bearing membranes
10/18/2001CA2403164A1 Metal bearing membranes
10/17/2001EP1145792A2 Method and apparatus for machining the inner surface of high grade steel containers
10/17/2001EP1144735A1 Method and apparatus for low energy electron enhanced etching and cleaning of substrates
10/17/2001CN1318207A Methods and appts. for electropolishing metal intennections on semiconductor devices
10/11/2001DE10016920A1 Plating of a tubular workpiece with a netting structure for medical implants maintains a constant gap between the head end of the workpiece as an anode and the electrode within the electrolyte bath
10/10/2001CN1316338A Method for making offset printing plate supporting body, affset printing plate supporting body and offset printing plate
10/10/2001CN1072737C Etching method
10/04/2001WO2001073833A1 Wet etching apparatus for semiconductor circuit and method for manufacturing etching needle used in apparatus
10/04/2001EP1139400A1 Method for machining/cleaning by hydroxide ion in ultrapure water
09/2001
09/27/2001WO2001071796A2 Method for electrochemical polishing of a conductive material
09/27/2001WO2001071068A1 Method for the electrolytic polishing of a metal in the presence of an electrolyte composition, as well as a moulded element obtained by using such a method
09/27/2001US20010023829 Method for anisotropic etching of structures in conducting materials
09/20/2001WO2001032959A3 Method of producing an aluminium surface with a high total reflectance
09/20/2001DE10037337A1 Electropolishing of titanium alloy and nickel-titanium alloy articles, especially Nitinol stents, is carried out in anhydrous electrolyte, preferably sulfamic acid in formamide, with article as anode
09/18/2001US6291081 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
09/18/2001US6290461 Method and tool for electrochemical machining
09/13/2001WO2001038222A8 Silicon nanoparticle and method for producing the same
09/12/2001EP0904427B1 Galvanized aluminium sheet
09/11/2001US6287449 Method of electrolytic texturing and electrolytic liquid slurry
09/06/2001US20010018877 Heat sensitive printing plate precursors
09/05/2001EP0941373B1 Method for obtaining well-defined edge radii by electropolishing
08/2001
08/23/2001WO2001061080A1 Electro-polishing fixture and electrolyte solution for polishing nitinol stents and method of using same
08/23/2001CA2400200A1 Electro-polishing fixture and electrolyte solution for polishing nitinol stents and method of using same
08/22/2001EP1126532A2 Method of forming tunnel oxide film
08/21/2001US6277264 System and method for using multiple lead connections in an electropolishing process
08/01/2001EP1120483A2 Method for etching GaN material
08/01/2001CN1306201A Process for preparing nm probe of scan-type electrochemical microscope
07/2001
07/31/2001US6267870 Treating aluminum workpieces
07/26/2001US20010010014 Low pressure stent
07/26/2001DE10002415A1 Production of an inner surface of a stainless steel tank comprises inserting a tube into the tank, placing a cathode and electrolyte in the tank and connecting the tube and cathode
07/12/2001US20010007306 Electrolytic cells
07/05/2001WO2001047649A1 Method for producing an aluminium strip for lithographic printing plates
07/05/2001CA2395166A1 Method for producing an aluminium strip for lithographic printing plates
07/03/2001CA2081235C Low-iron loss grain oriented electromagnetic steel sheet and method of producing the same
06/2001
06/27/2001EP1110631A1 Method for producing an aluminium strip for lithographic printing plates
06/27/2001EP1109954A1 Electrochemical marking stencil, method and system
06/26/2001US6250340 For chemical processing industry, especially for petrochemicals; centrifugally cast, creep resistant tubes comprising carbon, chromium, nickel, niobium, silicon, tungsten, and iron having non-circular internal profile
06/13/2001EP1106382A1 Heat sensitive printing plate precursors
06/12/2001US6245687 Precision wide band gap semiconductor etching
06/12/2001US6245213 Concentrated solution is usable for isotopic etching,
06/12/2001US6245212 Method of providing a metal bearing component with a pattern by electrochemical machining and an apparatus therefor
06/07/2001WO2001031374A8 Silicon nanoparticle stimulated emission devices
05/2001
05/31/2001WO2001038222A1 Silicon nanoparticle and method for producing the same
05/30/2001CN1297390A Method of mfg. cutting member having auxiliary layer
05/29/2001US6238810 Process for using surface active agents to produce high etch gains for electrolytic capacitor manufacturing
05/25/2001WO2001036138A1 Combined electrolytic polishing and abrasive super-finishing process
05/23/2001EP1101840A1 Process for manufacturing stainless steel strips with improved surface characteristics
05/23/2001EP1101839A2 Methods and apparatus for forming metal layers on substrates
05/10/2001WO2001032959A2 Method of producing an aluminium surface with a high total reflectance
05/10/2001DE19951325A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitenden Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens Method and apparatus for electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of electrically insulating foil material, as well as applications of the method
05/10/2001CA2389029A1 Method of producing an aluminium surface with a high total reflectance
05/09/2001EP1097474A1 Methods and apparatus for electropolishing metal interconnections on semiconductor devices
05/08/2001US6228445 Austenitic stainless steel article having a passivated surface layer
05/08/2001US6228246 Removal of metal skin from a copper-Invar-copper laminate
05/03/2001WO2001031374A1 Silicon nanoparticle stimulated emission devices
05/01/2001US6224972 Method of making a PVD-coated HSS drill
05/01/2001US6224738 Method for a patterned etch with electrolytically grown mask
04/2001
04/26/2001WO2001029807A1 Inspection and repair of active substrate
04/26/2001WO2001029289A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method
04/26/2001CA2384244A1 Method and device for the electrolytic treatment of electrolytically conducting structures which are insulated from each other
04/25/2001CN1292434A Medium, high-pressure anode aluminium foil face-expanding erosion method
04/25/2001CN1292433A Low-pressure anode aluminium foil face-expanding erosion method
04/24/2001US6221236 Electrolysis, etching a metal web with alternating current and frequency
04/17/2001US6217787 The printed circuit board, together with an electrode, is placed in an electrolytic liquid, voltages of different potential are applied to circuit board and the electrode, and electroconductive material is removed from the circuit board
04/11/2001CN1064414C Electrolytic copper foil for printed circuit board and its producing method
04/04/2001EP0993513A4 Impedance-assisted electrochemical technique and electrochemistry for removing material, particularly excess emitter material in electron-emitting device
03/2001
03/28/2001CN1289225A Electro-deposition copper foil through surface-processing, its mfg. method and use thereof
03/21/2001EP1084285A1 Perforated silicon membrane provided by an electrochemical etching method
03/20/2001US6203690 Process of reworking pin grid array chip carriers
03/20/2001US6203689 For polishing inner face of deep hole of article
03/14/2001EP1083248A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use therof
03/06/2001US6198300 Silicided silicon microtips for scanning probe microscopy
03/01/2001DE19936569A1 Production of a porous silicon surface for making thin layer solar cells involves passing silicon strip through electrolyte bath
02/2001
02/28/2001EP1079003A2 Electrolytic machining method and apparatus
02/22/2001WO2001012372A1 Method and tool for electrochemical machining
02/14/2001EP1075900A2 Blade re-sharpener
02/14/2001CN2418987Y Electrochamically polishing device for internal surface of stainless steel pipe
02/13/2001US6187446 In chemical sensors, biochemical sensors, enzyme reactors
02/13/2001CA2178324C Porous semiconductor material
02/06/2001US6183570 Surface treatment process of metallic material and metallic material obtained thereby
01/2001
01/30/2001US6179982 Introducing and reclaiming liquid in a wafer processing chamber
01/18/2001DE19931230A1 Production of bipolar pulsed streams in electrolytic apparatus comprises using a pulse regulator between the exits of two direct current intermediate circuits and electrolytic cells
01/10/2001CN1060541C Method for etching nitride material
01/09/2001US6171467 Silicon wafers in electrolytic baths, applying voltage and planarizing
01/04/2001WO2001000906A1 Bath composition for electropolishing of titanium and method for using same
01/02/2001US6168706 Process for producing high etch gains for electrolytic capacitor manufacturing
12/2000
12/27/2000EP1062384A1 Process and device for the electrolytic polishing of surgical needles
12/26/2000US6165630 Electrolytic graining; anodizing; immersion in zinc solution
12/20/2000EP1060299A1 Method of etching
12/13/2000EP1058592A1 Method of manufacturing a cutting member having an auxiliary layer
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