| Patents for C25F 3 - Electrolytic etching or polishing (4,256) |
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| 12/30/2004 | US20040262168 Methods of electopolishing patterned substrates |
| 12/29/2004 | WO2004113595A1 Portable electrolytic marking unit |
| 12/29/2004 | CN1182766C Electro-deposition copper foil through surface-processing, its mfg. method and use thereof |
| 12/29/2004 | CN1182441C Supporting body for lithographic printing plate and the lithographic printing plate |
| 12/28/2004 | US6835300 Electropolishing solution and methods for its use and recovery |
| 12/23/2004 | WO2004112066A1 Method for producing aluminum material for electrolytic capacitor electrode, aluminum material for electrolytic capacitor electrode, method for producing electrode material for electrolytic capacitor, and aluminum electrolytic capacitor |
| 12/23/2004 | WO2004112065A1 Method for producing aluminum material for electrolytic capacitor electrode, aluminum material for electrolytic capacitor electrode, method for producing electrode material for electrolytic capacitor, and aluminum electrolytic capacitor |
| 12/23/2004 | WO2004111314A2 Algorithm for real-time process control of electro-polishing |
| 12/23/2004 | WO2004111146A1 Polishing composition and method for polishing a conductive material |
| 12/23/2004 | US20040259365 Polishing method polishing system and method for fabricating semiconductor device |
| 12/23/2004 | US20040256245 Moveable nozzle moves from a first to apply a stream of electrolyte to a first portion of the metal layer to a second position to apply the stream of electrolyte to a second portion when the wafer is rotated by the wafer chuck; shorter polishing time and uses less quantity of slurry |
| 12/23/2004 | US20040256244 Selective electrochemical etching method for two-dimensional dopant profiling |
| 12/23/2004 | US20040256237 Ion exchanger between a pair of electrodes and a section for supplying a liquid to the ion exchanger; can flatten or clean a workpiece, especially a semiconductor wafer, while eliminating or reducing a load upon a CMP treatment |
| 12/23/2004 | US20040256224 First electrode wafer of an interlayer dielectric having a feature, an underlayer on the layer, a barrier layer on the underlayer and a conductive layer in the feature and a second electrode; both electrodes immersed in an electrolyte and have a potential difference between them |
| 12/22/2004 | EP1489204A1 Electrochemical machine and electrochemical machining method |
| 12/21/2004 | US6833063 Electrochemical edge and bevel cleaning process and system |
| 12/16/2004 | US20040253810 Dummy structures to reduce metal recess in electropolishing process |
| 12/16/2004 | US20040253809 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
| 12/15/2004 | CN1555428A Method and electrode for defining and replicating structures in conducting materials |
| 12/09/2004 | WO2004100283A3 Electrolyte for electrochemically polishing metallic surfaces |
| 12/09/2004 | US20040248412 Method and composition for fine copper slurry for low dishing in ECMP |
| 12/09/2004 | US20040245119 Dispensing an electrolyte through an opening that is at least as long as the wafer and effecting relative movement between the opening and the wafer; wafer can be moved linearly across the opening and can also be rotated |
| 12/09/2004 | DE10344315B3 Electrochemical etching process for removing foreign phases on the surface of a chalcopyrite semiconductor in an aqueous electrolyte comprises applying a potential profile to the working electrode in the positive potential region |
| 12/08/2004 | CN1554215A A method of etching copper on cards |
| 12/02/2004 | US20040238492 Planarization with reduced dishing |
| 12/02/2004 | US20040238481 Rotating wafer chuck with sufficient speed that electrolyte fluid flows towards edge; eliminates unwanted metal removal and overpolishing |
| 12/02/2004 | US20040237307 Dynamic pressure bearing and method of manufacturing the same |
| 12/01/2004 | EP1480784A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 12/01/2004 | EP1230441B1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 11/25/2004 | US20040231989 Substrate processing appartus and method |
| 11/25/2004 | DE10318995A1 Etching permeable membranes made from semipermeable membranes by electrochemical etching of macro-pores on a plane side of a flat semiconductor |
| 11/24/2004 | EP1305836B1 Stainless steel substrate treatment |
| 11/24/2004 | EP0998597B1 Field emitter fabrication using open circuit electrochemical lift off |
| 11/23/2004 | US6821409 Electroetching methods and systems using chemical and mechanical influence |
| 11/18/2004 | WO2004100283A2 Electrolyte for electrochemically polishing metallic surfaces |
| 11/18/2004 | WO2004099469A2 High resolution electrolytic lithography, apparatus therefor and resulting products |
| 11/18/2004 | DE10320909A1 Elektrolyt zum elektrochemischen Polieren von Metalloberflächen Electrolyte for the electrochemical polishing of metal surfaces |
| 11/18/2004 | CA2525138A1 Electrolyte for electrochemically polishing metallic surfaces |
| 11/17/2004 | CN2656434Y Graphite electrode plate used for condenser aluminium foil expanding surface erosion |
| 11/17/2004 | CN1547763A Dummy structures to reduce metal recess in electropolishing process |
| 11/11/2004 | WO2004097907A2 Method for the production of permeable membranes from semiconductor materials using macro- and micro-pore etching |
| 11/11/2004 | WO2004097078A1 Electrolytic processing apparatus and method |
| 11/11/2004 | WO2004097077A2 Method for the etching of permeable membranes made from semiconductor materials using macro- and meso-pore etching |
| 11/11/2004 | US20040224509 Method to remove copper without pattern density effect |
| 11/11/2004 | US20040224171 Electrochemically roughened aluminum semiconductor chamber surfaces |
| 11/11/2004 | US20040223090 Liquid crystal display device, manufacturing method thereof, and fabrication apparatus therefor |
| 11/11/2004 | US20040221956 Semiconductor processing methods of removing conductive material |
| 11/11/2004 | DE10318732A1 Electrochemical preparation process for depositing a layer suspends a metal work piece between two electrodes with different electrolytes in the gaps between work piece and electrode |
| 11/10/2004 | EP1475448A1 Aluminum alloy plate for lithographic printing form and method for production thereof and lithographic printing form |
| 11/10/2004 | CN2654622Y Running water mould electrolysis carving machine |
| 11/04/2004 | WO2004095571A1 Substrate processing method and substrate processing apparatus |
| 11/04/2004 | US20040217013 Apparatus and method for electropolishing a metal wiring layer on a semiconductor device |
| 11/03/2004 | EP1472710A1 Method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon |
| 11/03/2004 | CN1543668A Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
| 11/03/2004 | CN1542881A Etching technique of hard foil |
| 11/02/2004 | US6811658 Apparatus for forming interconnects |
| 10/28/2004 | US20040214431 Electropolishing endpoint detection method |
| 10/27/2004 | EP1470576A1 Electrolytic processing apparatus and substrate processing apparatus and method |
| 10/27/2004 | EP1470269A1 Electrolytic processing apparatus and method |
| 10/26/2004 | US6809029 Semiconductor production device and production method for semiconductor device |
| 10/26/2004 | US6808617 Measuring thickness equivalent data of a film on wafer, making cathode member smaller than surface face region thereof, interposing electrolytic solution between surface and cathode member, applying voltage, electrolytic polishing |
| 10/21/2004 | US20040206634 Electrolytic processing apparatus and substrate processing apparatus and method |
| 10/14/2004 | WO2004088004A1 Method for reducing degradation of reactive compounds during transport |
| 10/14/2004 | US20040200732 Method and apparatus for eliminating defects and improving uniformity in electrochemically processed conductive layers |
| 10/14/2004 | US20040200728 Improved flatness when fine and large holes are present in the surface of a substrate and when subsequent chemical mechanical polishing is used; plating a film of a conductive material on the substrate surface in a plating liquid and electrolytic-etching a surface of the plated film formed |
| 10/14/2004 | DE10259934B3 Verfahren zur Herstellung von Formteilen aus Niob oder Tantal durch elektrochemisches Ätzen und so erhältliche Formteile A process for producing moldings made of niobium or tantalum by electrochemical etching and thus obtainable molded parts |
| 10/14/2004 | CA2514527A1 Method for reducing degradation of reactive compounds during transport |
| 10/07/2004 | US20040197255 for blue, green, red, and infrared emission; uniformity; formed from electrochemical etch |
| 10/07/2004 | US20040195109 Electrochemical machining method and apparatus |
| 10/06/2004 | EP1464514A1 Lithographic printing plate precursor |
| 10/06/2004 | EP1464513A1 Lithographic printing plate precursor |
| 10/06/2004 | CN1534113A Plasma body polishing method of titanium and titanium alloy product |
| 10/05/2004 | CA2387142C Silicon nanoparticle stimulated emission devices |
| 09/30/2004 | US20040188273 Measurement electrical resistance of electroconductive coatings on substrate; detection of end-points |
| 09/30/2004 | US20040188272 Method for reducing degradation of reactive compounds during transport |
| 09/29/2004 | EP1032726A4 Selective removal of material using self-initiated galvanic activity in electrolytic bath |
| 09/28/2004 | US6797623 Methods of producing and polishing semiconductor device and polishing apparatus |
| 09/23/2004 | US20040182720 Measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, electrolytic polishing |
| 09/23/2004 | US20040182715 Process and apparatus for air bubble removal during electrochemical processing |
| 09/23/2004 | US20040182712 Process and system for eliminating gas bubbles during electrochemical processing |
| 09/22/2004 | CN1530472A Improvement of electric paste etching frame |
| 09/21/2004 | US6793793 High reactability; reduced generation of liquid waste; eliminates electrode cleaning |
| 09/16/2004 | WO2004079809A1 Electropolishing endpoint detection method |
| 09/16/2004 | WO2004078411A2 Method and apparatus for local polishing control |
| 09/16/2004 | US20040178081 Process for the production of shaped articles of niobium or tantalum by electrochemical etching |
| 09/16/2004 | US20040178059 Controlled potential anodic etching process for the selective removal of conductive thin films |
| 09/15/2004 | EP1456868A2 Electrochemical process and system for cleaning edge and bevel of workpieces |
| 09/15/2004 | CN1529769A Anode Assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte |
| 09/14/2004 | US6790340 Method and apparatus for radiation assisted electrochemical etching and etched product |
| 09/14/2004 | US6790130 Semiconductor processing methods of removing conductive material |
| 09/10/2004 | WO2004077526A2 Coated spherical silicon nanoparticle thin film uv detector with uv response and method of making |
| 09/09/2004 | US20040173461 Method and apparatus for local polishing control |
| 09/08/2004 | EP1453991A1 Electrolytic processing apparatus and method |
| 09/02/2004 | DE10307746A1 Electrochemical method for defining an electrochemically active surface on an electrically conductive work-piece connected as an electrode operates during a electrochemical machining process |
| 09/01/2004 | CN2638063Y Electrolytic cell with imitation local corrosion |
| 08/31/2004 | US6783658 Electropolishing method |
| 08/31/2004 | US6783657 Dissolution, etching, or polishing; semiconductors |
| 08/26/2004 | WO2004072332A1 Polishing fluid, method of polishing, and polishing apparatus |
| 08/26/2004 | US20040163963 Filter divides internal housing volume; fluid flow to second chamber is higher speed than to first chamber; flows are blended in second chamber; rotates at controlled speed |
| 08/26/2004 | DE20023514U1 Production of an inner surface of a stainless steel tank comprises inserting a tube into the tank, placing a cathode and electrolyte in the tank and connecting the tube and cathode |