Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 7 - Electroplating characterised by the article coated
Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
04/2012
04/18/2012CN101451255B Electrochemically deposited indium composites
04/12/2012WO2012047102A2 Device for single-sided electrolytic treatment of a flat substrate
04/12/2012WO2012046804A1 Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
04/12/2012WO2012020947A3 Wire tool
04/12/2012WO2012007522A3 Separation of master electrode and substrate in ecpr
04/12/2012US20120085654 Coating mask for electrolytically coating a peripheral region on an outer surface of a cylindrical body
04/12/2012DE102010047906A1 Verfahren zur elektrochemischen individuellen Beschichtung eines Bauteils sowie Vorrichtung Process for the electrochemical coating of a component, as well as individual device
04/11/2012EP2438216A1 Electrodeposited metallic materials comprising cobalt
04/11/2012CN102409378A 薄板电镀铜生产工艺的工装 Thin copper plating production process tooling
04/05/2012WO2012043717A1 Method for forming electric copper plating film on surface of rare earth permanent magnet
04/05/2012WO2012043514A1 Cylinder plating method and device
04/05/2012WO2012043513A1 Apparatus for plating cylinder
04/05/2012WO2012043182A1 Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board, and printed wiring board
04/04/2012CN202181360U 一种化金挂篮 One kind of gold hanging basket
04/04/2012CN1540040B Reverse pulse electroplating composition and method thereof
04/04/2012CN102400201A 一种电镀防皱板 One kind of plating wrinkle board
04/04/2012CN102400196A By-product mitigation in through-silicon-via plating
03/2012
03/30/2012CA2754263A1 Gas turbine blade and method of protecting same
03/29/2012WO2012039285A1 Method for manufacturing copper foil for printed circuit board and copper foil for printed circuit board
03/29/2012US20120073977 Plating apparatus and plating method
03/28/2012EP2432921A2 Method and device for controlling electrochemical surface processes
03/28/2012EP2432920A2 Method and device for the controlled electrolytic treatment of thin layers
03/28/2012CN202175729U 一种钢带连续镀铜的电镀槽 One kind of a continuous strip of copper plating bath
03/28/2012CN1935391B Method for lowering the coefficient of friction of the surface of metal bands with a coating and device for applying a metallic coating onto a steel band
03/28/2012CN102395713A Conductive member and manufacturing method thereof
03/28/2012CN102395712A A process for electroplating of copper
03/28/2012CN102392292A Electroplating method for encapsulation substrates
03/28/2012CN102392286A Device for preparing diamond wire saw and method for preparing diamond wire saw by device
03/28/2012CN102392281A PCB copper electroplating groove
03/28/2012CN102392280A Full-automatic electroplating production line for semi-conductor lead frames
03/28/2012CN101662892B Ultra-thin copper foil with carrier, method for producing ultra-thin copper foil with carrier and printed circuit board
03/27/2012US8142906 Sn-plated copper or Sn-plated copper alloy having excellent heat resistance and manufacturing method thereof
03/22/2012WO2012035701A1 Spark plug and main fitting for spark plug
03/22/2012US20120071074 Grinding stone, manufacturing method of grinding stone, and manufacturing apparatus of grinding stone
03/22/2012US20120070683 Manufacturing method of aluminum structure and aluminum structure
03/22/2012US20120067731 Manufacturing method of aluminum structure and aluminum structure
03/22/2012US20120067730 Manufacturing method of aluminum structure and aluminum structure
03/22/2012US20120067729 Nickel electroplating solution and chip parts using the same
03/22/2012US20120067728 Colloidal sphere templates and sphere-templated porous materials
03/22/2012US20120067425 Aluminum base material, metal substrate having insulating layer employing the aluminum base material, semiconductor element, and solar battery
03/21/2012EP2430890A1 Method and system for the treatment of flat feedstock, and device for removing or keeping away treatment liquid
03/21/2012EP2430889A1 Method, treatment station, and system for the treatment of flat feedstock
03/21/2012EP2430375A2 Vacuum collector tube and method for producing said type of vacuum collector tube
03/21/2012CN102383174A Electroplating anode
03/21/2012CN102383170A Anti-wrinkling board
03/21/2012CN102383160A Electroplating electric-conducting device for integrated circuit lead frame
03/21/2012CN101935856B Back face treatment process of electrolytic copper foil
03/21/2012CN101775637B Static-pressure horizontal electroplating bath
03/15/2012US20120064293 Extrusion-coated strip for rigid packagings
03/15/2012US20120064227 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes
03/15/2012US20120061246 Front referenced anode
03/15/2012US20120061245 Method and device for the electrolytic treatment of high-resistance layers
03/15/2012US20120061244 Method and device for the controlled electrolytic treatment of thin layers
03/15/2012US20120060869 Single workpiece processing chamber
03/15/2012DE102010044934A1 Device, useful for electrolytic coating of flat product comprising composite material, comprises a cell traversed by flat product, coupling electrodes for electrically coupling cover layers and two counter electrodes
03/14/2012EP2427593A1 Continuous electrolytic surface finishing of bars.
03/14/2012EP1646746B8 Water-permeable drum for the hydrodynamic needling of webs of textile materials, and method for the production of said drum
03/14/2012CN102373496A Electrode for mold electroplating and process thereof
03/14/2012CN101667566B Gold-coated-sliver base bonding silk thread and manufacture method thereof
03/14/2012CN101550574B Selective plating device
03/13/2012US8133376 Substrate holder, plating apparatus, and plating method
03/08/2012WO2012029865A1 Method for manufacturing multilayer wiring board
03/08/2012WO2012029162A1 Method for producing electrode for hydrogen generation and electrode for hydrogen generation
03/08/2012WO2011110682A3 Photovoltaic cell with porous semiconductor regions for anchoring contact terminals, electrolitic and etching modules, and related production line
03/08/2012US20120058216 Method For Forming An Anodized Layer, Method For Manufacturing A Mold, and Mold
03/08/2012US20120055800 Method for forming plating layer of printed circuit board
03/08/2012US20120055612 Electrodeposition methods of gallium and gallium alloy films and related photovoltaic structures
03/07/2012CN102369447A Spring wire, contact probe, and probe unit
03/07/2012CN102369315A Composition for metal plating comprising suppressing agent for void free submicron feature filling
03/07/2012CN102031552B Device for plating chrome on belt material
03/07/2012CN101911257B ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer
03/01/2012US20120052417 Circuit Apparatus Having a Rounded Trace
03/01/2012US20120048727 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
03/01/2012US20120048600 Circuit Apparatus Having a Rounded Differential Pair Trace
03/01/2012DE102010035606A1 Fabricating microstructure with inner metal structure, comprises preparing substrate structure with internal fluid channel, introducing electrolyte solution into fluid channel, and forming internal metal structure
02/2012
02/29/2012EP1820667B1 Pneumatic tire
02/29/2012EP1795336B1 Electrolytic copper foil with carrier foil furnished with primer resin layer and process for producing the same
02/29/2012CN102365396A Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/29/2012CN102365165A Metal foil with electric resistance film and production method therefor
02/29/2012CN102363891A Double photoelectrolysis copper foil replacing rolled copper foil and used for production of flexible copper clad laminate, and production process of double photoelectrolysis copper foil
02/29/2012CN101824558B Methods for preparing strip-like foamed resin substrate and porous metallic material
02/29/2012CN101752470B Method for improving plating product process of luminous diode structure
02/29/2012CN101688312B Metal material, method for producing the same, and electrical electronic component using the same
02/28/2012US8123926 Electrolytic copper process using anion permeable barrier
02/23/2012WO2011117256A3 Method and device for producing a highly selectively absorbing coating on a solar absorber component, and solar absorber having such a coating
02/23/2012US20120045030 Method for forming roughness on surface of nuclear fuel rod cladding including zirconium
02/23/2012US20120043218 Copper electrodeposition in microelectronics
02/23/2012US20120043216 Working electrode design for electrochemical processing of electronic components
02/23/2012US20120043121 Printed circuit board and method of manufacturing the same
02/22/2012CN202148362U Conductive roller
02/22/2012CN202148361U 一种可拆卸的螺丝挂钩式的首饰电镀挂具 A removable screw hook style jewelry plating rack
02/22/2012CN202148358U Device for screening chromeplated electroplated part of inner hole of tubular member
02/22/2012CN102362559A Copper foil for printed wiring board and method for producing same
02/22/2012CN102362014A Device and method to conduct an electrochemical reaction on a surface of a semiconductor substrate
02/22/2012CN102362013A Electrodeposition of copper in microelectronics with dipyridyl-based levelers
02/22/2012CN102361026A Copper-based bonding wire with anti-oxidation function
02/22/2012CN101783285B 使用薄的、高速液体层处理晶片表面的方法 The use of a thin, high speed method for processing the liquid layer surface of the wafer
02/22/2012CN101538730B 电解处理装置和电解处理方法 An electrolytic treatment method and electrolytic treatment device
02/21/2012US8118044 Single workpiece processing chamber with tilting load/unload upper rim
02/16/2012WO2012021695A2 Deplating contacts in an electrochemical plating apparatus
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