C23F 3 - Brightening metals by chemical means

Patents for C23F 3 - Brightening metals by chemical means (1,427)
09/2004
09/10/2004	WO2004076574A2 Cmp composition comprising a sulfonic acid and a method for polishing noble metals
09/09/2004	US20040173574 CMP composition containing organic nitro compounds
09/09/2004	US20040173307 Apparatus and method for supplying chemicals in chemical mechanical polishing systems
09/02/2004	WO2004053008A3 Passivative chemical mechanical polishing composition for copper film planarization
08/2004
08/19/2004	WO2004070072A2 Heat treatable coated article with chromium nitride ir reflecting layer and method of making same
08/12/2004	WO2004067660A1 Selective barrier metal polishing solution
08/12/2004	US20040157458 Methods for planarization of metal-containing surfaces using halogens and halides salts
08/10/2004	US6774041 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
08/10/2004	US6773476 Silicon dioxide or aluminum oxide abrasive; polyether; citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine or histidine accelerant; benzotriazole, benzimidazole, triazole, imidazole or tolyltriazole stabilizer; h2o2 and water
08/05/2004	WO2004066027A2 Electron beam processing for mask repair
08/05/2004	US20040152308 heating a rare earth carboxylates with alkoxyalcoholst to form solutions, then adding a silicon alkoxide and activators, mixing with water to form gels and thermal decomposition under slightly reductive atmosphere, to form rare earth element-activated rare earth silicate phosphors
08/04/2004	EP1443129A1 Method for treating a metallic workpiece
07/2004
07/29/2004	WO2004063083A2 Apparatus for transfer of an array of liquids and methods for manufacturing same
07/29/2004	US20040147118 Selective barrier metal polishing solution
07/27/2004	US6767476 Polishing composition for metal CMP
07/22/2004	WO2004061028A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
07/22/2004	WO2004061027A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
07/21/2004	CN1514862A CMP polishing pad including solid catalyst
07/21/2004	CN1158694C Material for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same
07/15/2004	US20040134873 Abrasive-free chemical mechanical polishing composition and polishing process containing same
07/08/2004	US20040129676 Apparatus for transfer of an array of liquids and methods for manufacturing same
06/2004
06/30/2004	EP1432852A2 Electrolytic processing apparatus and method
06/24/2004	WO2004053008A2 Passivative chemical mechanical polishing composition for copper film planarization
06/22/2004	US6752844 Ceric-ion slurry for use in chemical-mechanical polishing
06/17/2004	US20040112759 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
06/17/2004	US20040112753 Using a perfluoro(sulfone or imidosulfone)compound
06/10/2004	US20040108302 Mixture of 5-aminotetrazole, oxidizer, abrasives, chelate compound and solvent
06/01/2004	US6743268 Acidic slurry of an oxidizer, deionized water, a corrosion inhibitor and a surfactant
06/01/2004	CA2254362C Composition and method for reducing copper oxide to metallic copper
05/2004
05/27/2004	WO2004044264A1 Method for finishing shot
05/27/2004	US20040102049 Method and system to provide material removal and planarization employing a reactive pad
05/25/2004	US6740591 Slurry and method for chemical mechanical polishing of copper
05/21/2004	WO2004041477A1 Surface treatment method for vacuum member
05/13/2004	US20040092102 Chemical mechanical polishing composition and method
05/11/2004	US6734103 Method of polishing a semiconductor device
05/06/2004	US20040084414 Polishing method and polishing composition used for polishing
05/05/2004	CN1494740A SLurry and method for chemical mechanical polishing of copper
05/04/2004	US6730592 Methods for planarization of metal-containing surfaces using halogens and halide salts
04/2004
04/29/2004	WO2004035861A1 Pickling or brightening/passivating solution and process for steel and stainless steel
04/28/2004	EP1413650A1 Metal surface protection film forming agent and application thereof
04/22/2004	WO2003029531A3 Electrolytic processing apparatus and method
04/21/2004	CN1491146A Chemical mechanical machining and surface finishing
04/15/2004	US20040072439 Chemical mechanical polishing composition and process
04/13/2004	US6720250 Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper
04/08/2004	US20040067649 Silica and silica-based slurry
04/08/2004	US20040065346 Hydrofluoric acid generating composition and method of treating surfaces
04/07/2004	CN1488170A Planarizers for spin etch planarization of electronic components and methods of use thereof
04/07/2004	CN1488167A Viscous protective overlayers for planarization of integrated circuits
03/2004
03/30/2004	US6713149 Magnetic recording medium
03/18/2004	WO2004022818A1 The surface treatment of magnesium and its alloys
03/17/2004	EP1397458A1 A silica and a silica-based slurry
03/17/2004	CN1142322C Chemically polishing method for stainless steel
03/11/2004	US20040046148 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
03/10/2004	CN1481283A Bond enhancement antitarnish coatings
03/04/2004	WO2002102920A8 A silica and a silica-based slurry
03/04/2004	US20040043702 Chemical-mechanical polishing slurry for polishing metal films
03/02/2004	US6699402 Chemical mechanical polishing (cmp) slurry of abrasive polishing particles, a bromide compound, a bromate compound for providing free bromine oxidizing agent and an organic acid for mediating bromate decomposition; capacitors
02/2004
02/24/2004	US6696358 Viscous protective overlayers for planarization of integrated circuits
02/12/2004	US20040029495 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
02/12/2004	US20040025444 Mixture of oxidizer and abrasive; activation free radicals; for semiconductors, integrated circuits
01/2004
01/29/2004	DE10229564A1 Verfahren und Vorrichtung zum chemischen Entgraten und Polieren Method and apparatus for chemical polishing and deburring
01/15/2004	US20040006924 For chemical mechanical polishing (CMP) of semiconductors
01/14/2004	EP1380048A1 Method and composition for polishing by cmp
01/13/2004	US6676989 Atomic level surface smoothing of coronary stents to prolong stability within body
12/2003
12/18/2003	WO2003104350A1 Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
12/17/2003	CN1131125C Composition and slurry used for metal CMP
12/09/2003	US6660639 Method of fabricating a copper damascene structure
12/04/2003	US20030224236 Stainless steel separator for low-temperature fuel cell
11/2003
11/27/2003	US20030217518 Abrasive, a method of polishing with the abrasive, and a method of washing a polished object
11/18/2003	US6649523 Method and system to provide material removal and planarization employing a reactive pad
11/13/2003	WO2003060980A3 Methods for planarization of group viii metal-containing surfaces using oxidizing gases
11/13/2003	WO2003018252A3 Metal polishing
11/13/2003	US20030211745 Slurry and method for chemical mechanical polishing of copper
11/13/2003	US20030209523 Planarization by chemical polishing for ULSI applications
11/05/2003	EP1358044A2 Chemical mechanical machining and surface finishing
10/2003
10/30/2003	US20030203635 Polishing composition for metal CMP
10/30/2003	US20030203624 Manufacturing method of semiconductor device
10/23/2003	US20030199112 Copper wiring module control
10/22/2003	EP1354355A1 Planarizers for spin etch planarization of electronic components and methods of use thereof
10/22/2003	EP1354347A2 Viscous protective overlayers for planarization of integrated circuits
10/22/2003	EP1354012A2 A cmp polishing pad including a solid catalyst
10/21/2003	US6635186 Chemical mechanical polishing composition and process
10/16/2003	WO2002059966A8 Planarizers for spin etch planarization of electronic components and methods of use thereof
10/16/2003	US20030194879 Compositions for chemical-mechanical planarization of noble-metal-featured substrates, associated methods, and substrates produced by such methods
10/15/2003	EP1352109A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
10/14/2003	US6632377 Chemical-mechanical planarization of metallurgy
10/09/2003	WO2002061824A9 Slurry and method for chemical mechanical polishing of copper
10/09/2003	US20030189186 Chemical-mechanical polishing composition for metal layers
10/08/2003	CN1447401A Mfg. method of semiconductor device
10/07/2003	US6630433 Oxidizing reactant selected from ammonium persulfate, hydrogen peroxide, nitric acid, co-reactant selected from phosphoric acid, sulfuric acid, nitric acid, oxalic acid, acetic acid, organic acids, additives
10/01/2003	EP1165983B1 A friction member and a method for its surface treatment
09/2003
09/25/2003	US20030181142 CMP method for noble metals
09/25/2003	US20030180546 Heat treatable coated article with chromium nitride IR reflecting layer and method of making same
09/18/2003	US20030176072 Polishing compositions for noble metals
09/18/2003	US20030176068 Chemical mechanical polishing composition and process
09/18/2003	US20030173329 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
09/11/2003	US20030171239 Methods and compositions for chemically treating a substrate using foam technology
09/04/2003	WO2003072670A1 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
09/04/2003	US20030166337 Chemical mechanical polishing systems and methods for their use
08/2003
08/28/2003	US20030162398 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same

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