Patents
Sitemap › C23 - Coating metallic material; Coating material with metallic material; Chemical surface treatment; Diffusion treatment of metallic material; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general; Inhibiting corrosion of metallic material or incrustation in general › C23F - Non-mechanical removal of metallic material from surfaces; Inhibiting corrosion of metallic material; Inhibiting incrustation in general; Multi-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass  or or class › C23F 3 - Brightening metals by chemical means
Patents for C23F 3 - Brightening metals by chemical means (1,427)
08/2005
08/18/2005US20050178742 Compositions and methods for rapidly removing overfilled substrates
08/17/2005EP1563952A1 Surface treatment method for vacuum member
08/17/2005CN1215199C Solution for chemical machinery brightening of ruthenium
08/11/2005US20050173670 Slurry for polishing copper film and method for polishing copper film using the same
08/03/2005EP1559762A2 Chemical mechanical polishing slurry useful for copper substrates
07/2005
07/28/2005US20050164610 Chemical mechanical machining and surface finishing
07/27/2005CN1646650A Free radical-forming activator attached to solid and used to enhance CMP formulations
07/27/2005CN1644644A Compositions and methods for low downforce pressure polishing of copper
07/21/2005US20050159086 Methods for planarization of group VIII metal-containing surfaces using complexing agents
07/13/2005EP1552035A1 Pickling or brightening/passivating solution and process for steel and stainless steel
07/07/2005US20050148187 Chemical mechanical polishing systems and methods for their use
07/07/2005US20050148182 Compositions for planarization of metal-containing surfaces using halogens and halide salts
07/07/2005US20050147841 Influence of surface geometry on metal properties
07/06/2005CN1636270A Methods for planarization of group VIII metal-containing surfaces using oxidizing gases
07/06/2005CN1209430C Chemical mechanical polishing systems and methods for their use
06/2005
06/30/2005WO2004066027A3 Electron beam processing for mask repair
06/29/2005EP1548076A1 Compositions and methods for low downforce pressure polishing of copper
06/29/2005CN1633486A Process for chemical-mechanical polishing of metal substrates
06/23/2005US20050136671 Compositions and methods for low downforce pressure polishing of copper
06/16/2005US20050126588 Contacting the chemically mechanically polished metal-containing substrate with an oxidizer; a salicylic acid compound and water to remove the residues from the substrate
06/15/2005CN1626600A Slurry for CMP, polishing method and method of manufacturing semiconductor device
06/09/2005US20050121141 Real time process control for a polishing process
06/02/2005US20050118821 Slurry for CMP, polishing method and method of manufacturing semiconductor device
06/01/2005CN1622985A 钨抛光溶液 Tungsten polishing solution
06/01/2005CN1204602C Abrasive liquid for metal and method for polishing
05/2005
05/31/2005US6899821 Mixture of oxidizer and film forming agent
05/25/2005CN1618909A Novel slurry for chemical mechanical polishing of metals
05/24/2005US6896825 Oxidizing agent for a metal and a dissolving agent, first and second film forming agents
05/19/2005US20050106472 patterning the non-transparent film using the etch stop layer to expose areas of the transparent substrate, forming a mask on the non-transparent film to protect selected areas of the transparent substrate and forming a phase shift oxide
05/12/2005WO2005042658A1 Abrasive-free che.mical mechanical polishing composition and polishing process containing same
05/12/2005US20050101150 Methods of enhancing selectivity of etching silicon dioxide relative to one or more organic substances; and plasma reaction chambers
05/12/2005US20050098540 for use in chemical mechanical polishing; abrasion
05/11/2005CN1200984C Slurry material for polishing
05/05/2005US20050095860 Abrasive liquid for metal and method for polishing
04/2005
04/28/2005US20050090104 Slurry compositions for chemical mechanical polishing of copper and barrier films
04/26/2005US6884723 Methods for planarization of group VIII metal-containing surfaces using complexing agents
04/26/2005US6884338 Etching by using a bis(perfluoroalkanesulfonyl) imide acids or a tris(perfluoroalkanesulfonyl) methide, having acidity properties, providing smooth surface
04/21/2005US20050085166 Process for chemical-mechanical polishing of metal substrates
04/20/2005CN1608116A Methods for planarization of metal-containing surfaces using halogens and halides salts
04/14/2005WO2005033234A2 Novel slurry for chemical mechanical polishing of metals
04/14/2005US20050079703 Method for planarizing an interconnect structure
04/14/2005US20050076580 Acidic aqueous slurry comprising silica abrasive particles, oxidizer (hydrogen peroxide), quaternary ammonium hydroxide, phosphoric acid, and water; semiconductors; integrated circuits; photolithography; chemical mechanical polishing
04/13/2005EP1522565A2 Polishing composition and use thereof
04/06/2005CN1603063A Method for preparing anode copper ball and apparatus thereof
03/2005
03/31/2005US20050070109 Novel slurry for chemical mechanical polishing of metals
03/23/2005CN1598062A Particle-free polishing fluid for nickel-based coating planarization
03/03/2005US20050045852 Particle-free polishing fluid for nickel-based coating planarization
03/03/2005US20050045591 Patterning contactors on wafer; holes extending through mask; applying adhesive tape; puilling vacuum; polishing
03/01/2005US6861353 Methods for planarization of metal-containing surfaces using halogens and halide salts
02/2005
02/24/2005WO2005016822A1 Silica and silica-based slurry
02/22/2005US6858124 Electrochemical mechanical deposition comprising a perfluorinated sulfonic acid compounds solution, controlling the etching and dissolving copper from copper foil, electrodepositing copper on connector
02/22/2005US6858097 Brightening/passivating metal surfaces without hazard from emissions of oxides of nitrogen
02/10/2005WO2005012451A2 Slurries and methods for chemical-mechanical planarization of copper
02/03/2005US20050026444 Slurry and method for chemical-mechanical planarization of copper
02/03/2005US20050026437 Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same
02/03/2005US20050022456 Polishing slurry and method for chemical-mechanical polishing of copper
01/2005
01/20/2005WO2005005561A1 Cmp of noble metals
01/20/2005US20050014890 Composition for chemical-mechanical polishing and method of using same
01/12/2005CN1184272C Stablizing method of polishing liquid containing peroxide for plane woring of chemical machinery
01/11/2005US6840971 Chemical mechanical polishing systems and methods for their use
12/2004
12/30/2004US20040266196 CMP of noble metals
12/30/2004US20040266188 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
12/30/2004US20040266183 Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low K dielectrics
12/23/2004WO2004111157A1 Polishing fluid for metal and polishing method
12/23/2004WO2004076574A3 Cmp composition comprising a sulfonic acid and a method for polishing noble metals
12/23/2004US20040256237 Ion exchanger between a pair of electrodes and a section for supplying a liquid to the ion exchanger; can flatten or clean a workpiece, especially a semiconductor wafer, while eliminating or reducing a load upon a CMP treatment
12/22/2004EP1198620A4 Methods for wet processing electronic components having copper containing surfaces
12/15/2004EP1485440A1 Free radical-forming activator attached to solid and used to enhance cmp formulations
12/15/2004EP1485439A1 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
12/09/2004WO2004063083A3 Apparatus for transfer of an array of liquids and methods for manufacturing same
11/2004
11/25/2004WO2004101221A2 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
11/23/2004US6821447 Friction member and a method for its surface treatment
11/23/2004US6821351 Cleaning and brightening metal on vehicles; separately spraying water on solid fluoride salt and strong acid concentrates; combining to form aqueous acid stream; reduced toxic exposure
11/23/2004US6821309 Applying slurry to soft surface layer
11/23/2004US6821187 Method for chemical-mechanical polishing of a layer which is a substrate and is a metal selected from a platinum group
11/18/2004US20040229461 Chemical mechanical polishing compositions for copper and associated materials and method of using same
11/18/2004US20040226814 Electron beam processing for mask repair
11/17/2004EP1476519A1 Process for chemical-mechanical polishing of metal substrates
11/11/2004US20040224511 Metal polishing
11/09/2004US6814835 Apparatus and method for supplying chemicals in chemical mechanical polishing systems
11/09/2004US6814766 Polishing composition and polishing method employing it
10/2004
10/28/2004WO2004070072A3 Heat treatable coated article with chromium nitride ir reflecting layer and method of making same
10/28/2004US20040214444 Chemical mechanical polishing slurry and process for ruthenium films
10/21/2004US20040209172 Defect correction method for a photomask
10/20/2004EP1468057A1 Tungsten polishing solution
10/20/2004CN1539000A Silica and silica-based slurry
10/14/2004US20040203245 Ceric-ion slurry for use in chemical-mechanical polishing
10/14/2004US20040203227 Ceric-ion slurry for use in chemical-mechanical polishing
10/14/2004DE10313517A1 Lösung zum Ätzen von Kupferoberflächen und Verfahren zum Abscheiden von Metall auf Kupferoberflächen Solution for etching copper surfaces and methods for depositing metal on copper surfaces
10/13/2004EP1198534B1 Polishing liquid composition
10/13/2004CN1170494C Method for production of slide fastener or stringers thereof
10/07/2004WO2004085707A1 Aqueous metal finishing solution, methods for finishing metal components, system for cleaning metal components and finished brass products
10/07/2004WO2004085706A1 Solution for etching copper surfaces and method of depositing metal on copper surfaces
10/05/2004US6800218 Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same
10/05/2004US6800105 Abrasive for metal
09/2004
09/30/2004US20040192052 Viscous protective overlayers for planarization of integrated circuits
09/28/2004US6797624 Solution for ruthenium chemical mechanical planarization
09/22/2004EP1459371A1 Methods for planarization of group viii metal-containing surfaces using complexing agents
09/22/2004EP1459370A2 Methods for planarization of group viii metal-containing surfaces using oxidizing gases
09/22/2004EP1458829A1 Methods for planarization of metal-containing surfaces using halogens and halide salts
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