Patents for C23F 3 - Brightening metals by chemical means (1,427)
06/2006
06/14/2006CN1786275A Mechanical chemical polishing method
06/13/2006USRE39126 Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs
06/07/2006CN2786149Y Strip steel surface treatment device
05/2006
05/30/2006US7052620 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
05/24/2006CN1777706A Surface treatment of magnesium and its alloys
05/23/2006US7049237 Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
05/18/2006WO2005012451A3 Slurries and methods for chemical-mechanical planarization of copper
05/17/2006CN1256765C Method for forming copper interconnection wire
05/11/2006US20060099817 Novel slurry for chemical mechanical polishing of metals
05/11/2006US20060097347 Novel slurry for chemical mechanical polishing of metals
05/11/2006US20060096952 Plasma processing method
05/10/2006CN1769523A Silver and silver alloy fastness method
05/09/2006US7041231 Method of refurbishing a transition duct for a gas turbine system
05/02/2006US7037350 adding polymeric abrasive particles carrying electrostatic charge to the aqueous solution, wherein the polymeric particles in the aqueous solution have an electrical charge sufficient to create an electrostatic repulsive force between proximate particles
04/2006
04/26/2006EP1648974A2 Slurries and methods for chemical-mechanical planarization of copper
04/26/2006CN1764739A Solution for etching copper surfaces and method of depositing metal on copper surfaces
04/25/2006US7033942 Chemical mechanical polishing composition and process
04/18/2006US7029508 Catalyst attached to solid and used to promote free radical formation in CMP formulations
04/13/2006US20060076247 Pickling or brightening/passivating solution and process for steel and stainless steel
04/11/2006US7025891 Method of polishing C4 molybdenum masks to remove molybdenum peaks
03/2006
03/30/2006DE10313517B4 Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens Solution for etching copper, method for pretreating a layer of copper as well as application of the method
03/29/2006EP1639053A1 Cmp of noble metals
03/29/2006CN1753961A Cmp composition comprising a sulfonic acid and a method for polishing noble metals
03/29/2006CN1752290A Multifunctional maintaniing agent for defatting, washing and forming oright film on surface of stainless steel products
03/21/2006US7014669 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
03/16/2006US20060057472 Method for making chrome photo mask
03/15/2006CN1245466C Polishing composition and its polishing method
03/09/2006US20060049382 Metal surface protective film forming agent and use thereof
03/08/2006EP1631416A2 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
03/07/2006US7008553 Method for removing aluminide coating from metal substrate and turbine engine part so treated
03/02/2006WO2006023105A1 Polishing composition for noble metals
03/01/2006CN1742065A Selective barrier metal polishing solution
02/2006
02/23/2006US20060037251 abrasives; for wirings of semiconductor devices
02/22/2006CN1739192A Methods for planarization of group VIII metal-containing surfaces using complexing agents
02/22/2006CN1739066A Electron beam processing technology for mask repair
02/22/2006CN1738928A Compositions for copper, tantalum and tantalum nitride chemical mechanical method complanation
02/22/2006CN1243071C Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it
02/16/2006US20060036312 Flexible stent and method of manufacture
02/15/2006CN1735671A Passivative chemical mechanical polishing composition for copper film planarization
02/14/2006US6998204 patterning the non-transparent film using the etch stop layer to expose areas of the transparent substrate, forming a mask on the non-transparent film to protect selected areas of the transparent substrate and forming a phase shift oxide
02/14/2006US6998066 and a chelating agent forming a chemical mechanical polishing emulsion; chemical stability, improved selectivity, corrosion inhibition, broad pH operating range
02/14/2006US6998060 Flexible stent and method of manufacture
02/09/2006US20060027534 Chemical mechanical machining for polishing surfaces such as semiconductors and oxidizers and/or abrasives
02/08/2006CN1240484C Bond enhancement antitarnish coatings
02/02/2006US20060024967 Polishing composition for noble metals
02/02/2006US20060021971 Method for plasma treatment of a carbon layer
02/01/2006CN1727519A Army green passivation technology for weldness steel tube in high precision
01/2006
01/26/2006WO2006009641A1 Method of polishing a tungsten-containing substrate
01/26/2006WO2005033234A3 Novel slurry for chemical mechanical polishing of metals
01/25/2006EP1570015A4 Passivative chemical mechanical polishing composition for copper film planarization
01/25/2006CN1726266A Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
01/25/2006CN1726265A Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
01/25/2006CN1724707A Fast chemical grinding polishing bath liquid for stainless steel surface and its method
01/25/2006CN1238560C Solution used for platinum chemical mechanical polishing
01/18/2006CN1721574A Aqueous solution composition for treating metal surface
01/11/2006CN1718859A Acidic chemical nickel plating composite brightening agent and its use method
01/03/2006US6982241 Cleaning composition comprising an inorganic acid mixture and a cationic surfactant
12/2005
12/22/2005US20050282473 Surface treatment method for vacuum member
12/22/2005US20050282391 Method of polishing a tungsten-containing substrate
12/22/2005US20050282387 Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
12/22/2005US20050279964 Chemical mechanical polishing slurry for polishing copper layer on a wafer
12/21/2005EP1606431A1 Solution for etching copper surfaces and method of depositing metal on copper surfaces
12/14/2005EP0852615B1 Chemical mechanical polishing composition and process
12/07/2005CN1705733A Slurry for chemical-mechanical polishing copper damascene structures
12/01/2005US20050266689 Chemical mechanical polishing composition and process
12/01/2005US20050263490 Method of passivating chemical mechanical polishing compositions for copper film planarization processes
11/2005
11/30/2005EP1599555A2 Cmp composition comprising a sulfonic acid and a method for polishing noble metals
11/24/2005WO2005110286A1 Method for reducing stent weld profiles and a stent having reduced weld profiles and a closed-end wire configuration
11/24/2005DE102004020213A1 Zusammensetzung für das Chemisch-Mechanische Polieren (CMP) Composition for chemical-mechanical polishing (CMP)
11/24/2005CA2565877A1 Method for reducing stent weld profiles and a stent having reduced weld profiles and a closed-end wire configuration
11/23/2005EP1597066A2 Heat treatable coated article with chromium nitride ir reflecting layer and method of making same
11/17/2005WO2004101221A3 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
11/17/2005US20050256563 Method for reducing stent weld profiles and a stent having reduced weld profiles and a closed-end wire configuration
11/17/2005US20050256025 Includes alkali metal hydroxide; a mono-, di- or trinitrilo polycarboxylic acid; sodium gluconate or sodium glucoheptonate; a first amphoteric surfactant; a second betaine surfactant; and a third nonionic surfactant; provides etching of aluminum without adversely effecting other non-metallic surfaces
11/17/2005US20050255693 Passivative chemical mechanical polishing composition for copper film planarization
11/09/2005EP1485440A4 Free radical-forming activator attached to solid and used to enhance cmp formulations
11/03/2005WO2005102932A1 Composition for chemo-mechanical polishing (cmp)
11/02/2005EP1590413A1 Selective barrier metal polishing solution
10/2005
10/27/2005DE10393234T5 Oberflächenbehandlung von Magnesium und seinen Legierungen Surface treatment of magnesium and its alloys
10/19/2005EP1586007A2 Electron beam processing for mask repair
10/12/2005EP1485439A4 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
10/12/2005CN1680511A Abrasive liquid for metal and method for polishing
10/11/2005US6953531 Methods of etching silicon-oxide-containing materials
10/06/2005US20050218117 Chemically assisted surface finishing process
10/05/2005CN1676563A Compositions and methods for chemical mechanical planarization of tungsten and titanium
09/2005
09/29/2005US20050211953 Polishing slurries and methods for chemical mechanical polishing
09/29/2005US20050211952 Compositions and methods for chemical mechanical planarization of tungsten and titanium
09/29/2005US20050211951 Compositions and methods for polishing copper
09/28/2005EP1580247A1 Polishing composition and polishing method
09/22/2005US20050208761 Polishing composition and polishing method
09/22/2005US20050205522 Chemical mechanical polishing; carbonyl derivative of benzotriazole forms a protective film on the surface of the metal layer; hydrogen peroxide, buffer, amine; etching agent includes hydrofluoric acid; micro processing step for semiconductor device
09/15/2005US20050199589 Aminoacetic acid, oxidizer, and water
09/14/2005EP1572821A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
09/14/2005EP1572820A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
09/14/2005EP1337601A4 Slurry for chemical-mechanical polishing copper damascene structures
09/07/2005EP1570015A2 Passivative chemical mechanical polishing composition for copper film planarization
09/01/2005US20050189319 One step copper damascene CMP process and slurry
08/2005
08/31/2005CN1217032C Machine for localised cleaning with electrolytic and/or ultrasound cell, for pickling and/or polishin
08/31/2005CN1216953C Polishing composition for metal CMP and method of polishing susbstroote
08/24/2005CN1216112C Polishing composition and polishing method for its use
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