Patents for C23F 3 - Brightening metals by chemical means (1,427) |
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09/05/2002 | US20020121497 Flexible stent and method of manufacture |
09/04/2002 | EP0852615A4 Chemical mechanical polishing composition and process |
09/03/2002 | US6444139 Chemical mechanical polishing |
08/29/2002 | US20020117758 Planarizers for spin etch planarization of electronic components and methods of use thereof |
08/27/2002 | US6440224 Using fluoride ion comprising a water-soluble or an acid-soluble fluoride salt and b) an acid comprising at least one of sulfuric acid, nitric acid, phosphoric acid, hydrochloric acid, sulfamic acid, sulfinic acid, and mixtures |
08/27/2002 | US6440186 Polishing composition and polishing method employing it |
08/22/2002 | WO2000032713A9 Stabilized slurry compositions |
08/21/2002 | EP0958405B1 Metal surface treatment solutions and process |
08/20/2002 | US6435947 CMP polishing pad including a solid catalyst |
08/15/2002 | WO2002062528A2 Chemical mechanical machining and surface finishing |
08/15/2002 | US20020111027 Polishing compositions for noble metals |
08/15/2002 | CA2435732A1 Chemical mechanical machining and surface finishing |
08/14/2002 | EP1230431A2 Machine for localised cleaning with electrolytic and/or ultrasound cell, for pickling and/or polishing |
08/14/2002 | EP1230430A2 Method of producing an aluminium surface with a high total reflectance |
08/08/2002 | WO2002061824A2 Slurry and method for chemical mechanical polishing of copper |
08/08/2002 | US20020106978 Chemical mechanical machining and surface finishing |
08/08/2002 | US20020106900 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures |
08/08/2002 | US20020104269 Polishing composition includes one or more photochemically reactive compounds, especially ketones, alkylhalides, azo compounds, aldehydes, amines, peroxides, titanium oxide, or combinations thereof. |
08/08/2002 | US20020104268 Slurry for chemical mechanical polishing |
08/01/2002 | WO2002059966A1 Planarizers for spin etch planarization of electronic components and methods of use thereof |
08/01/2002 | WO2002059962A2 Viscous protective overlayers for planarization of integrated circuits |
08/01/2002 | WO2002059393A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
08/01/2002 | US20020100895 For polishing multiple metal layers and thin-films where one of the layers or films is comprises of copper or a copper containing alloy |
08/01/2002 | CA2435623A1 Viscous protective overlayers for planarization of integrated circuits |
08/01/2002 | CA2432012A1 Planarizers for spin etch planarization of electronic components and methods of use thereof |
08/01/2002 | CA2431591A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
07/30/2002 | US6425929 For cleanin and polishing fuel tanks of large trucks |
07/25/2002 | WO2002057382A2 A cmp polishing pad including a solid catalyst |
07/25/2002 | US20020096770 Viscous protective overlayers for planarization of integrated circuits |
07/25/2002 | US20020095874 Slurry for chemical mechanical polishing |
07/18/2002 | US20020093002 Chemical mechanical polishing slurry |
07/17/2002 | CN1087870C Improved polishing slurries and method for their use |
07/10/2002 | CN1357585A Chemical and mechanical polishing paste for metal and dielectric structure |
07/09/2002 | USRE37786 Mixture of aminocarboxylic acid, oxidizer and water |
07/03/2002 | EP1218565A1 Cemented carbide wear part and lapping method |
07/03/2002 | EP1218464A1 Chemical mechanical polishing systems and methods for their use |
06/27/2002 | US20020081853 Abrasive slurry and process for a chemical-mechanical polishing of a precious-metal surface |
06/27/2002 | US20020081849 Chemical mechanical polishing compositions for CMP removal of iridium thin films |
06/25/2002 | US6410442 Metallization of semiconductor high-speed integrated circuits by chemical-mechanical polishing; an etching solution comprising a copper(alloy) etchant, water and a surfactant |
06/06/2002 | US20020068456 Method and system to provide material removal and planarization employing a reactive pad |
06/06/2002 | US20020066234 Acidic slurry of an oxidizer, deionized water, a corrosion inhibitor and a surfactant |
06/06/2002 | DE10060343A1 Polierslurry für das chemisch-mechanische Polieren von Metall- und Dielektrikastrukturen Polishing slurry for chemical mechanical polishing of metal and dielectric structures |
06/05/2002 | EP1211719A1 Polishing slurry for the chemical mechanical polishing of metal and dielectric structures |
06/05/2002 | EP1211717A1 Polishing compound for chemimechanical polishing and method for polishing substrate |
06/05/2002 | CN1352703A Methods for wet processing electronic components having copper containing surfaces |
06/04/2002 | CA2364053A1 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures |
05/28/2002 | US6395194 Slurry of abrasive, bromide, bromate, organic acid, and bromine-chloride complex |
05/23/2002 | US20020061635 For use in polishing semiconductor device |
05/16/2002 | US20020056699 Method for eliminating surface roughness in metal lines |
05/14/2002 | US6387812 Ultrasonic processing of chemical mechanical polishing slurries |
05/09/2002 | US20020053656 Cerium as oxidizer, ammonium cerium nitrate, and abrasive for slurry which is environmentally green, and contains slight cyanide not requiring waste treatment |
05/02/2002 | WO2001049899A3 Brightening/passivating metal surfaces without hazard from emissions of oxides of nitrogen |
05/02/2002 | US20020051846 Atomic level surface smoothing of coronary stents to prolong stability within body |
05/01/2002 | CN1346776A High-temp container resisting strong alkali and its production method |
04/25/2002 | WO2002033023A1 Slurry for chemical-mechanical polishing copper damascene structures |
04/25/2002 | WO2002033014A1 Method of polishing a memory or rigid disk with an ammonia and/or halide-containing composition |
04/25/2002 | DE10048477A1 Verfahren zum chemisch-mechanischen Polieren von Schichten aus Metallen der Platingruppe A method for chemical mechanical polishing of layers of metals of the platinum group |
04/24/2002 | EP1198827A1 Compositions and processes for spin etch planarization |
04/24/2002 | EP1198620A1 Methods for wet processing electronic components having copper containing surfaces |
04/24/2002 | EP1198534A1 Polishing liquid composition |
04/23/2002 | US6375693 Chemical-mechanical planarization of barriers or liners for copper metallurgy |
04/18/2002 | US20020043027 Preventing formation of pits in copper wiring in chemical mechanical polishing of substrates for semiconductors, photomasks and memory hard disks |
04/04/2002 | WO2002026906A1 Method for chemical-mechanical polishing of layers made from metals from the platinum group |
04/04/2002 | US20020039839 Polishing compositions for noble metals |
03/26/2002 | US6362106 Chemical mechanical polishing method useful for copper substrates |
03/26/2002 | US6362104 Chemical mechanical polishing of a metal e.g titanium, aluminum, by using an oxidizer, photoactive solid catalyst, comprising a mixture of titanium dioxide and titanium trioxide, water and a pad. |
03/21/2002 | WO2002022911A1 Cleaning composition and methods for manufacturing and using |
03/21/2002 | US20020033382 Chemical mechanical polishing method useful for copper substrates |
03/20/2002 | EP1115584A4 Method of manufacturing enhanced finish sputtering targets |
03/20/2002 | CN1340583A Polishing composition and polishing method for its use |
03/14/2002 | US20020029527 For cleanin and polishing fuel tanks of large trucks |
03/13/2002 | EP0975705B1 Buffer solutions for suspensions used in chemical-mechanical polishing |
03/12/2002 | US6355565 Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers |
02/27/2002 | EP1182242A1 Polishing composition and polishing method employing it |
02/21/2002 | US20020020833 Oxidizing reactant selected from ammonium persulfate, hydrogen peroxide, nitric acid, co-reactant selected from phosphoric acid, sulfuric acid, nitric acid, oxalic acid, acetic acid, organic acids, additives |
02/19/2002 | US6348076 Oxidizing agent, copper corrosion inhibitor, abrasive particles, surface active agent, and polyelectrolyte for polishing or planarizing chip interconnect/wiring material such as al, w and especially cu. |
02/14/2002 | US20020017630 Mixture of oxidizer and film forming agent |
02/06/2002 | CN1334961A Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same |
01/30/2002 | CN1333317A Slurry material for polishing |
01/17/2002 | WO2002003883A2 Improving effectiveness of medical stents by gcib |
01/17/2002 | US20020005017 Aqueous dispersion for chemical mechanical polishing |
01/15/2002 | US6338743 High ph of 9.5-13, used for si and metal surfaces of semiconductor wafers, silica in aqueous solution of a strong base selected from tetramethylammonium hydroxide, koh or naoh. |
01/10/2002 | WO2002002706A1 Polishing composition for metal cmp |
01/02/2002 | EP1165983A1 A friction member and a method for its surface treatment |
12/27/2001 | US20010054706 Compositions and processes for spin etch planarization |
12/20/2001 | US20010052587 Chemical mechanical polishing slurry and method for polishing metal/oxide layers |
12/13/2001 | US20010050142 Chemical-mechanical polishing apparatus with megasonic energy slurry supply system |
12/05/2001 | CN1325540A Abrasive liquid for metal and method for polishing |
11/21/2001 | EP0753083B1 Baths and method for chemically polishing stainless steel surfaces |
11/13/2001 | US6315858 Gas polishing apparatus and method |
11/06/2001 | US6313039 Chemical mechanical polishing composition and process |
11/01/2001 | US20010036804 CMP polishing pad including a solid catalyst |
10/31/2001 | EP1150341A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
10/31/2001 | CN1074035C Chemical mechanical polishing slurry for metal layers |
10/30/2001 | US6309560 Chemical mechanical polishing slurry useful for copper substrates |
10/30/2001 | US6309556 Method of manufacturing enhanced finish sputtering targets |
10/18/2001 | WO2001032960A3 Machine for localised cleaning with electrolytic and/or ultrasound cell, for pickling and/or polishing |
10/09/2001 | US6299795 Polishing slurry |
10/04/2001 | EP1138734A2 Aqueous dispersion for chemical mechanical polishing of metal films |
10/04/2001 | DE10114737A1 Pickling process comprises changing the pH of the pickling liquid consisting of residual pickle, hydrogen peroxide and tap water using a correcting liquid consisting of a sulfuric acid solution, etc. |