| Patents for C23F 3 - Brightening metals by chemical means (1,427) |
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| 01/07/2009 | CN100448941C Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| 12/16/2008 | US7465408 Solutions for controlled, selective etching of copper |
| 12/11/2008 | US20080305357 Color matching process for maximizing hiding and workability with waterborne coating compositions |
| 12/03/2008 | EP1358044B1 Chemical mechanical machining and surface finishing |
| 12/03/2008 | CN101316950A Composition and method for enhancing pot life of hydrogen peroxide-containing cmp slurries |
| 11/19/2008 | CN201151223Y Metal slide fastener with environment-protecting dye layer |
| 11/18/2008 | US7452473 Laser marking of raw aluminum anode foil to induce uniform patterning etching |
| 11/13/2008 | US20080277378 Method for Chemical-Mechanical Planarization of Copper |
| 11/05/2008 | CN101297777A Preparation for processing biodegradable magnesium alloy intravascular stent |
| 10/15/2008 | CN101285188A Process for preventing diamond scratch in process of CMP |
| 10/15/2008 | CN100425395C Method for preparing anode copper ball and apparatus thereof |
| 10/08/2008 | CN100424227C Aqueous solution composition for treating metal surface |
| 10/01/2008 | CN101275231A Method for spray pickling, polishing and passivating stainless steel composite board and devices thereof |
| 09/30/2008 | CA2500308C Heat treatable coated article with chromium nitride ir reflecting layer and method of making same |
| 09/24/2008 | EP1485440B1 Free radical-forming activator attached to solid and used to enhance cmp formulations |
| 09/23/2008 | US7427305 Free radical-forming activator attached to solid and used to enhance CMP formulations |
| 09/17/2008 | CN101265580A Pre-conditioning a sputtering target prior to sputtering |
| 09/10/2008 | CN100417747C Strip steel surface treatment device |
| 09/02/2008 | US7419911 high polishing efficiency, uniformity, and removal rate, and leaves a high quality polish with minimal surface defects; uses an oxidizer, preferably a per-type oxidizer such as a peroxide, periodic acid, and peracetic acid; abrasives |
| 09/02/2008 | US7419910 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 08/20/2008 | EP1218464B1 Chemical mechanical polishing systems and methods for their use |
| 08/14/2008 | WO2008097984A1 Formed core sandwich structure and method and system for making same |
| 08/14/2008 | WO2008048240A3 Copper chelating agent, composition including the agent, and methods of forming and using the agent and composition |
| 08/13/2008 | EP1606431B1 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 08/07/2008 | WO2008094702A1 Method of polishing a tungsten-containing substrate |
| 08/06/2008 | CN100408648C Selective barrier metal polishing solution |
| 07/30/2008 | EP1950326A1 Method for removal of bulk metal contamination from III-V semiconductor substrates |
| 07/30/2008 | CN100406198C Method for finish machining metal product |
| 07/16/2008 | CN100403497C Methods for planarization of group VIII metal-containing surfaces using complexing agents |
| 07/09/2008 | CN101215694A High pure aluminum alloy chemical nickel-plating activated liquid and activating technique thereof |
| 07/03/2008 | DE10048477B4 Verfahren zum chemisch-mechanischen Polieren von Schichten aus Metallen der Platingruppe A method for chemical mechanical polishing of layers of metals of the platinum group |
| 06/25/2008 | CN101205617A Surface treating method for metal workpieces |
| 06/25/2008 | CN101205616A Surface treating method for metal workpieces |
| 06/11/2008 | EP1929071A1 Composition and method for enhancing pot life of hydrogen peroxide-containing cmp slurries |
| 06/11/2008 | CN100393912C Magnesium-zirconium alloy |
| 06/11/2008 | CN100393911C Preparation process of magnesium alloy supported nanometer TiO2 photocatalyst film |
| 06/10/2008 | US7384902 Metal brightener and surface cleaner |
| 05/29/2008 | US20080121840 mixing oxidizers, oxidized-metal etchants, protective film-forming agents and diluents, used for polishing semiconductors |
| 05/22/2008 | US20080119052 Selective barrier metal polishing method |
| 05/21/2008 | CN100389228C Polishing agent |
| 05/14/2008 | CN101177591A Metal polish and method for preparing the same |
| 05/07/2008 | CN101173362A Magnesium alloy chemical milling and processing technique |
| 05/07/2008 | CN101173361A Non-equilibrium liquid condition composite pulse plasma polishing method |
| 04/29/2008 | US7364667 Slurry for CMP and CMP method |
| 04/23/2008 | EP1648974A4 Slurries and methods for chemical-mechanical planarization of copper |
| 04/22/2008 | US7361603 Passivative chemical mechanical polishing composition for copper film planarization |
| 04/16/2008 | CN101164121A Plasma oxidation and removal of oxidized material |
| 04/16/2008 | CN100381537C Abrasive liquid for metal and method for polishing |
| 04/09/2008 | CN101159189A Super capacitor collection liquid surface treating method |
| 04/09/2008 | CN100379898C Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 04/08/2008 | US7354530 Chemical mechanical polishing systems and methods for their use |
| 03/26/2008 | EP1903081A2 Stabiliser for acid, metallic polishing baths |
| 03/26/2008 | CN101148766A Method for increasing medical embedded stainless steel tube inner surface quality |
| 03/20/2008 | US20080067149 Mixture of urea and alkanediphosphonic acid(s) optionally substituted with one or more hydroxyl or amino groups or salt; stabilization of an acidic, metal- and peroxide-containing solution |
| 03/19/2008 | CN101144164A Method for preparing copper product polishing agent |
| 02/27/2008 | CN100371497C Acidic chemical nickel plating composite brightening agent and its use method |
| 02/06/2008 | CN101117713A Method for preparing super-hydrophobic modified SiO2-polyurethane composite coating by using immersion-self-assembly |
| 02/05/2008 | US7327034 Compositions for planarization of metal-containing surfaces using halogens and halide salts |
| 01/24/2008 | US20080020578 Composition for Chemical-Mechanical Polishing (Cmp) |
| 01/16/2008 | CN101104936A Method for removing oxidizing layer formed on surface of tungsten plug after alloying treatment |
| 01/15/2008 | US7319072 Polishing medium for chemical-mechanical polishing, and method of polishing substrate member |
| 01/09/2008 | EP1875003A2 Superfinishing of high density carbides |
| 01/09/2008 | CN101103089A Polishing slurries and methods for chemical mechanical polishing |
| 01/01/2008 | US7314823 Chemical mechanical polishing composition and process |
| 12/26/2007 | CN200996050Y Aluminum-material surface treatment continuous processor with chemical polishing sequence |
| 12/21/2007 | WO2006098888A3 Plasma oxidation and removal of oxidized material |
| 12/19/2007 | CN100355858C Slurry for chemical-mechanical polishing copper damascene structures |
| 12/12/2007 | EP1447461B1 Product and method for cleaning titanium surfaces |
| 12/12/2007 | CN101085901A Passivative chemical mechanical polishing composition for copper film planarization |
| 11/27/2007 | US7300602 Selective barrier metal polishing solution |
| 11/27/2007 | US7300601 Passivative chemical mechanical polishing composition for copper film planarization |
| 11/22/2007 | US20070266641 Method of polishing a tungsten-containing substrate |
| 11/21/2007 | EP1856229A2 Polishing slurries and methods for chemical mechanical polishing |
| 11/13/2007 | US7293526 Plasma reaction chamber liner consisting essentially of osmium |
| 11/07/2007 | EP1773959B1 Method of polishing a tungsten-containing substrate |
| 10/30/2007 | US7287314 One step copper damascene CMP process and slurry |
| 10/24/2007 | CN101058884A Magnesium alloy etching agent and using method thereof |
| 10/17/2007 | CN100343420C Fast chemical grinding polishing bath liquid for stainless steel surface and its method |
| 10/17/2007 | CN100343362C Polishing fluid for metal and polishing Method |
| 10/09/2007 | US7279119 Silica and silica-based slurry |
| 10/03/2007 | CN100341122C Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| 10/02/2007 | US7276180 Chemical mechanical polishing composition and process |
| 09/25/2007 | US7273060 Removal of undesired matter from a semiconductor wafer by contacting the surface with a foam forming composition comprising: a fluoride, an organic polar solvent, a surfactant, water, and alkanolamine; forming a foam with a gas |
| 09/20/2007 | US20070214728 Method of polishing a tungsten-containing substrate |
| 09/18/2007 | US7270762 Polishing compositions for noble metals |
| 09/12/2007 | EP1833085A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
| 09/12/2007 | EP1832370A1 Process of manufacturing involute gear tooth system |
| 09/04/2007 | US7264641 Polishing pad comprising biodegradable polymer |
| 08/09/2007 | WO2007024556A3 Methods and compositions for acid treatment of a metal surface |
| 08/09/2007 | US20070181852 Passivative chemical mechanical polishing composition for copper film planarization |
| 08/08/2007 | CN101012558A Production method of solar energy optical-thermal conversion material |
| 08/07/2007 | US7252891 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
| 08/01/2007 | EP1813657A2 Metal-polishing liquid and chemical-mechanical polishing method using the same |
| 08/01/2007 | CN1329467C Passivative chemical mechanical polishing composition for copper film planarization |
| 08/01/2007 | CN101008083A Preparation method of anticorrosion film of energy-saving type heater condenser |
| 07/31/2007 | US7250369 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
| 07/24/2007 | US7247567 Method of polishing a tungsten-containing substrate |
| 07/19/2007 | US20070167017 a mixture of oxidizers, oxidized-metal etchants, protective film-forming agents and diluents, used for polishing semiconductors |
| 07/17/2007 | US7244678 Methods for planarization of Group VIII metal-containing surfaces using complexing agents |
| 07/11/2007 | CN1326212C Process for chemical-mechanical polishing of metal substrates |