Patents for C23F 3 - Brightening metals by chemical means (1,427)
08/2003
08/28/2003US20030159362 Applying slurry to soft surface layer
08/27/2003EP1337601A1 Slurry for chemical-mechanical polishing copper damascene structures
08/21/2003WO2003068882A1 Free radical-forming activator attached to solid and used to enhance cmp formulations
08/21/2003WO2003068881A1 Process for chemical-mechanical polishing of metal substrates
08/13/2003EP1334516A2 Slurry and method for chemical mechanical polishing of copper
08/13/2003CN1436225A Polishing composition for metal CMP
08/12/2003US6604987 CMP compositions containing silver salts
08/07/2003WO2003064551A1 Compositions and methods for chemical-mechanical planarization o f noble-metal-featured substrates. these treated substrates
07/2003
07/31/2003WO2003062337A1 Tungsten polishing solution
07/29/2003US6600229 Planarizers for spin etch planarization of electronic components
07/24/2003WO2003060980A2 Methods for planarization of group viii metal-containing surfaces using oxidizing gases
07/24/2003WO2003060028A1 Methods for planarization of metal-containing surfaces using halogens and halide salts
07/24/2003US20030139050 Tungsten polishing solution
07/24/2003US20030139047 Metal polishing slurry having a static etch inhibitor and method of formulation
07/16/2003CN1429930A Solution for chemical machinery brightening of ruthenium
07/15/2003US6593239 Chemical mechanical polishing method useful for copper substrates
07/15/2003US6592776 Imidazole, benzotriazole, benzimidiazole or benzothiazole film-forming agent and such as uriedopropyltrimethoxysilane; reducing defects
07/10/2003WO2003056620A1 Methods for planarization of group viii metal-containing surfaces using complexing agents
07/09/2003EP0909311B1 Post clean treatment
07/03/2003US20030124867 Solution for ruthenium chemical mechanical planarization
07/03/2003US20030121568 Pickling process without nitric acid; phosphoric, sulfuric, sulfurous, hydrofluoric, and hydrochloric acids; peroxy compound; a polyether or an alkoxylated amine or quaternary ammonium surfactant
07/01/2003US6585786 Slurry for chemical mechanical polishing
07/01/2003US6585568 Chemical mechanical polishing slurry
06/2003
06/26/2003US20030119691 Cleaning composition and methods for manufacturing and using
06/26/2003US20030119321 Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
06/26/2003US20030119319 Methods for planarization of group VIII metal-containing surfaces using complexing agents
06/26/2003US20030119316 Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
06/26/2003US20030119304 Methods for planarization of metal-containing surfaces using halogens and halide salts
06/17/2003US6579377 Hydrofluoric acid generating composition and method of treating surfaces
06/11/2003EP1317572A1 Cleaning composition and methods for manufacturing and using
06/05/2003US20030104699 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry
05/2003
05/29/2003US20030098434 Method of fabricating a copper damascene structure
05/27/2003US6569350 An abrasive, urea hydrogen peroxide, tartaric acid, and a film forming agent; use to remove copper alloy, titanium, and titanium nitride
05/27/2003US6568997 Forming a passivating layer copper oxide for reducing the reaction of the copper metal with the polishing mixtures; reducing the problem of dishing of copper circuits of semiconductor devices
05/22/2003US20030094593 Silica and a silica-based slurry
05/15/2003WO2002061824A3 Slurry and method for chemical mechanical polishing of copper
05/15/2003US20030092360 Method for chemical-mechanical polishing of layers made from metals from the platinum group
05/15/2003US20030089456 Apparatus and method for supplying chemicals in chemical mechanical polishing systems
05/08/2003US20030087124 Magnetic recording medium
05/08/2003US20030084815 Polishing composition and polishing method employing it
05/07/2003EP1090082B1 Cmp slurry containing a solid catalyst
04/2003
04/17/2003WO2002059962A3 Viscous protective overlayers for planarization of integrated circuits
04/17/2003US20030073311 For etching surfaces, such as copper and tantalum as would be applicable in the fabrication of integrated circuits
04/16/2003CN1410501A Chemical and mechanical grinding paste material composition
04/15/2003US6547979 Methods of enhancing selectivity of etching silicon dioxide relative to one or more organic substances; and plasma reaction chambers
04/15/2003US6546939 Removal residues from copper or aluminum surfaces; polishing with aqueous acidity solution containing buffers
04/10/2003WO2003029531A2 Electrolytic processing apparatus and method
04/09/2003EP1299489A1 Cmp polishing composition for metal
04/09/2003CN1409776A Machine for localised cleaning with electrolytic and/or ultrasound cell, for pickling and/or polishing
04/02/2003CN1407050A Grinding composition and its grinding method
03/2003
03/20/2003US20030052308 A slurry for chemical mechanical polishing (CMP), containing alumina abrasive, aqueous ozone as oxidant with predetermined concentration and a benzotriazole as corrosion inhibitor
03/20/2003US20030051413 Silicon dioxide or aluminum oxide abrasive; polyether; citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine or histidine accelerant; benzotriazole, benzimidazole, triazole, imidazole or tolyltriazole stabilizer; H2O2 and water
03/13/2003US20030047539 Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same
03/11/2003US6530967 Stabilized slurry compositions
03/11/2003US6530824 Method and composition for polishing by CMP
03/06/2003WO2003018714A1 Abrasive free formulations for chemical mechanical polishing of copper and assocated materials and method of using the same
03/06/2003WO2003018252A2 Metal polishing
03/04/2003US6527622 CMP method for noble metals
02/2003
02/27/2003WO2002062528A3 Chemical mechanical machining and surface finishing
02/26/2003CN1398939A Polishing composition and its polishing method
02/20/2003US20030036267 Copper-based metal polishing solution and method for manufacturing semiconductor device
02/13/2003WO2003012169A1 Metal surface protection film forming agent and application thereof
02/12/2003EP1283250A1 Polishing composition and polishing method employing it
02/06/2003US20030024896 Methods of etching silicon-oxide-containing compositions
01/2003
01/30/2003US20030021908 Gas cluster ion beam process for smoothing MRAM cells
01/30/2003US20030019842 Plasma reaction chamber assemblies
01/30/2003US20030019834 using polishing system comprising an abrasive, a polishing pad, an acid, and a carrier
01/29/2003EP1279708A1 Polishing composition and polishing method employing it
01/23/2003US20030017785 Metal polish composition and polishing method
01/23/2003US20030015221 Preparing a solution containing a source of fluoride ion and an acid of sufficient strength to form hydrofluoric acid when mixed with the source of fluoride ion, and applying the solution onto the surface of metal to be treated
01/22/2003CN1392215A Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it
01/21/2003US6508953 Slurry for chemical-mechanical polishing copper damascene structures
12/2002
12/27/2002WO2002102920A1 A silica and a silica-based slurry
12/26/2002US20020197855 Chemical mechanical polishing slurry and process for ruthenium films
12/17/2002US6495026 Process to sever metal fibers using galvanic cell
12/10/2002US6491837 Mixture of particles; nitric acid or aluminum-, nickel-, magnesium-, zinc-, or ammonium nitrate oxidizer; co-oxidizer; and water; nickel-plated hard disk drives
12/03/2002US6489281 Includes a product of mixing an acid component, a source of phosphoric acid component, and an oxidant component for cleaning aluminum surface
11/2002
11/28/2002US20020177316 Slurry comprising a chelating organic acid buffer system, colloidal silica, and an oxidizer.
11/27/2002CN1382305A Compositions and processes for spin etch planarization
11/21/2002US20020173243 Polishing composition having organic polymer particles
11/21/2002US20020173241 Forming a passivating layer copper oxide for reducing the reaction of the copper metal with the polishing mixtures; reducing the problem of dishing of copper circuits of semiconductor devices
11/12/2002US6478880 Multi-component solvent systems for fluorinated compounds and cleaners and delivery systems based thereon
11/12/2002US6478834 Slurry for chemical mechanical polishing
11/06/2002EP0985059B1 Composition and method for polishing a composite comprising titanium
10/2002
10/31/2002WO2002057382A3 A cmp polishing pad including a solid catalyst
10/31/2002US20020160609 Reducing dishing and erosion during polishing and riding thin films on a substrate planarizing for isolation of trenches by using a first and second liquid containing an oxidizing agent, an organic acid, corrosion inhibitor and water
10/30/2002EP1252248A1 Polishing compositions for noble metals
10/17/2002WO2002081584A1 Polishing composition having organic polymer particles
10/17/2002US20020148997 Slurry for CMP and CMP method
10/10/2002US20020146965 Method and composition for polishing by CMP
10/10/2002US20020145127 Chemical mechanical polishing slurry useful for copper substrates
10/09/2002CN1373241A Chemically polishing method for stainless steel
10/08/2002US6461227 Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition
09/2002
09/25/2002EP1242651A2 Brightening/passivating metal surfaces without hazard from emissions of oxides of nitrogen
09/19/2002WO2002073681A1 Method and composition for polishing by cmp
09/18/2002CN1370208A Chemical mechanical polishing systems and methods for their use
09/12/2002WO2002003883A3 Improving effectiveness of medical stents by gcib
09/12/2002US20020125460 Compositions for chemical mechanical planarization of tungsten
09/10/2002US6448182 Stabilization of peroxygen-containing slurries used in a chemical mechanical planarization
09/10/2002US6447632 Apparatus and nozzle device for gaseous polishing
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