Patents for C23F 3 - Brightening metals by chemical means (1,427) |
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08/28/2003 | US20030159362 Applying slurry to soft surface layer |
08/27/2003 | EP1337601A1 Slurry for chemical-mechanical polishing copper damascene structures |
08/21/2003 | WO2003068882A1 Free radical-forming activator attached to solid and used to enhance cmp formulations |
08/21/2003 | WO2003068881A1 Process for chemical-mechanical polishing of metal substrates |
08/13/2003 | EP1334516A2 Slurry and method for chemical mechanical polishing of copper |
08/13/2003 | CN1436225A Polishing composition for metal CMP |
08/12/2003 | US6604987 CMP compositions containing silver salts |
08/07/2003 | WO2003064551A1 Compositions and methods for chemical-mechanical planarization o f noble-metal-featured substrates. these treated substrates |
07/31/2003 | WO2003062337A1 Tungsten polishing solution |
07/29/2003 | US6600229 Planarizers for spin etch planarization of electronic components |
07/24/2003 | WO2003060980A2 Methods for planarization of group viii metal-containing surfaces using oxidizing gases |
07/24/2003 | WO2003060028A1 Methods for planarization of metal-containing surfaces using halogens and halide salts |
07/24/2003 | US20030139050 Tungsten polishing solution |
07/24/2003 | US20030139047 Metal polishing slurry having a static etch inhibitor and method of formulation |
07/16/2003 | CN1429930A Solution for chemical machinery brightening of ruthenium |
07/15/2003 | US6593239 Chemical mechanical polishing method useful for copper substrates |
07/15/2003 | US6592776 Imidazole, benzotriazole, benzimidiazole or benzothiazole film-forming agent and such as uriedopropyltrimethoxysilane; reducing defects |
07/10/2003 | WO2003056620A1 Methods for planarization of group viii metal-containing surfaces using complexing agents |
07/09/2003 | EP0909311B1 Post clean treatment |
07/03/2003 | US20030124867 Solution for ruthenium chemical mechanical planarization |
07/03/2003 | US20030121568 Pickling process without nitric acid; phosphoric, sulfuric, sulfurous, hydrofluoric, and hydrochloric acids; peroxy compound; a polyether or an alkoxylated amine or quaternary ammonium surfactant |
07/01/2003 | US6585786 Slurry for chemical mechanical polishing |
07/01/2003 | US6585568 Chemical mechanical polishing slurry |
06/26/2003 | US20030119691 Cleaning composition and methods for manufacturing and using |
06/26/2003 | US20030119321 Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases |
06/26/2003 | US20030119319 Methods for planarization of group VIII metal-containing surfaces using complexing agents |
06/26/2003 | US20030119316 Methods for planarization of group VIII metal-containing surfaces using oxidizing agents |
06/26/2003 | US20030119304 Methods for planarization of metal-containing surfaces using halogens and halide salts |
06/17/2003 | US6579377 Hydrofluoric acid generating composition and method of treating surfaces |
06/11/2003 | EP1317572A1 Cleaning composition and methods for manufacturing and using |
06/05/2003 | US20030104699 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry |
05/29/2003 | US20030098434 Method of fabricating a copper damascene structure |
05/27/2003 | US6569350 An abrasive, urea hydrogen peroxide, tartaric acid, and a film forming agent; use to remove copper alloy, titanium, and titanium nitride |
05/27/2003 | US6568997 Forming a passivating layer copper oxide for reducing the reaction of the copper metal with the polishing mixtures; reducing the problem of dishing of copper circuits of semiconductor devices |
05/22/2003 | US20030094593 Silica and a silica-based slurry |
05/15/2003 | WO2002061824A3 Slurry and method for chemical mechanical polishing of copper |
05/15/2003 | US20030092360 Method for chemical-mechanical polishing of layers made from metals from the platinum group |
05/15/2003 | US20030089456 Apparatus and method for supplying chemicals in chemical mechanical polishing systems |
05/08/2003 | US20030087124 Magnetic recording medium |
05/08/2003 | US20030084815 Polishing composition and polishing method employing it |
05/07/2003 | EP1090082B1 Cmp slurry containing a solid catalyst |
04/17/2003 | WO2002059962A3 Viscous protective overlayers for planarization of integrated circuits |
04/17/2003 | US20030073311 For etching surfaces, such as copper and tantalum as would be applicable in the fabrication of integrated circuits |
04/16/2003 | CN1410501A Chemical and mechanical grinding paste material composition |
04/15/2003 | US6547979 Methods of enhancing selectivity of etching silicon dioxide relative to one or more organic substances; and plasma reaction chambers |
04/15/2003 | US6546939 Removal residues from copper or aluminum surfaces; polishing with aqueous acidity solution containing buffers |
04/10/2003 | WO2003029531A2 Electrolytic processing apparatus and method |
04/09/2003 | EP1299489A1 Cmp polishing composition for metal |
04/09/2003 | CN1409776A Machine for localised cleaning with electrolytic and/or ultrasound cell, for pickling and/or polishing |
04/02/2003 | CN1407050A Grinding composition and its grinding method |
03/20/2003 | US20030052308 A slurry for chemical mechanical polishing (CMP), containing alumina abrasive, aqueous ozone as oxidant with predetermined concentration and a benzotriazole as corrosion inhibitor |
03/20/2003 | US20030051413 Silicon dioxide or aluminum oxide abrasive; polyether; citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine or histidine accelerant; benzotriazole, benzimidazole, triazole, imidazole or tolyltriazole stabilizer; H2O2 and water |
03/13/2003 | US20030047539 Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same |
03/11/2003 | US6530967 Stabilized slurry compositions |
03/11/2003 | US6530824 Method and composition for polishing by CMP |
03/06/2003 | WO2003018714A1 Abrasive free formulations for chemical mechanical polishing of copper and assocated materials and method of using the same |
03/06/2003 | WO2003018252A2 Metal polishing |
03/04/2003 | US6527622 CMP method for noble metals |
02/27/2003 | WO2002062528A3 Chemical mechanical machining and surface finishing |
02/26/2003 | CN1398939A Polishing composition and its polishing method |
02/20/2003 | US20030036267 Copper-based metal polishing solution and method for manufacturing semiconductor device |
02/13/2003 | WO2003012169A1 Metal surface protection film forming agent and application thereof |
02/12/2003 | EP1283250A1 Polishing composition and polishing method employing it |
02/06/2003 | US20030024896 Methods of etching silicon-oxide-containing compositions |
01/30/2003 | US20030021908 Gas cluster ion beam process for smoothing MRAM cells |
01/30/2003 | US20030019842 Plasma reaction chamber assemblies |
01/30/2003 | US20030019834 using polishing system comprising an abrasive, a polishing pad, an acid, and a carrier |
01/29/2003 | EP1279708A1 Polishing composition and polishing method employing it |
01/23/2003 | US20030017785 Metal polish composition and polishing method |
01/23/2003 | US20030015221 Preparing a solution containing a source of fluoride ion and an acid of sufficient strength to form hydrofluoric acid when mixed with the source of fluoride ion, and applying the solution onto the surface of metal to be treated |
01/22/2003 | CN1392215A Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it |
01/21/2003 | US6508953 Slurry for chemical-mechanical polishing copper damascene structures |
12/27/2002 | WO2002102920A1 A silica and a silica-based slurry |
12/26/2002 | US20020197855 Chemical mechanical polishing slurry and process for ruthenium films |
12/17/2002 | US6495026 Process to sever metal fibers using galvanic cell |
12/10/2002 | US6491837 Mixture of particles; nitric acid or aluminum-, nickel-, magnesium-, zinc-, or ammonium nitrate oxidizer; co-oxidizer; and water; nickel-plated hard disk drives |
12/03/2002 | US6489281 Includes a product of mixing an acid component, a source of phosphoric acid component, and an oxidant component for cleaning aluminum surface |
11/28/2002 | US20020177316 Slurry comprising a chelating organic acid buffer system, colloidal silica, and an oxidizer. |
11/27/2002 | CN1382305A Compositions and processes for spin etch planarization |
11/21/2002 | US20020173243 Polishing composition having organic polymer particles |
11/21/2002 | US20020173241 Forming a passivating layer copper oxide for reducing the reaction of the copper metal with the polishing mixtures; reducing the problem of dishing of copper circuits of semiconductor devices |
11/12/2002 | US6478880 Multi-component solvent systems for fluorinated compounds and cleaners and delivery systems based thereon |
11/12/2002 | US6478834 Slurry for chemical mechanical polishing |
11/06/2002 | EP0985059B1 Composition and method for polishing a composite comprising titanium |
10/31/2002 | WO2002057382A3 A cmp polishing pad including a solid catalyst |
10/31/2002 | US20020160609 Reducing dishing and erosion during polishing and riding thin films on a substrate planarizing for isolation of trenches by using a first and second liquid containing an oxidizing agent, an organic acid, corrosion inhibitor and water |
10/30/2002 | EP1252248A1 Polishing compositions for noble metals |
10/17/2002 | WO2002081584A1 Polishing composition having organic polymer particles |
10/17/2002 | US20020148997 Slurry for CMP and CMP method |
10/10/2002 | US20020146965 Method and composition for polishing by CMP |
10/10/2002 | US20020145127 Chemical mechanical polishing slurry useful for copper substrates |
10/09/2002 | CN1373241A Chemically polishing method for stainless steel |
10/08/2002 | US6461227 Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition |
09/25/2002 | EP1242651A2 Brightening/passivating metal surfaces without hazard from emissions of oxides of nitrogen |
09/19/2002 | WO2002073681A1 Method and composition for polishing by cmp |
09/18/2002 | CN1370208A Chemical mechanical polishing systems and methods for their use |
09/12/2002 | WO2002003883A3 Improving effectiveness of medical stents by gcib |
09/12/2002 | US20020125460 Compositions for chemical mechanical planarization of tungsten |
09/10/2002 | US6448182 Stabilization of peroxygen-containing slurries used in a chemical mechanical planarization |
09/10/2002 | US6447632 Apparatus and nozzle device for gaseous polishing |