| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 01/20/2005 | WO2004091906A3 Use of an object as shaping tool |
| 01/20/2005 | WO2004020696A3 Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam |
| 01/20/2005 | WO2004001355A3 Temperature control sequence of electroless plating baths |
| 01/20/2005 | US20050014359 Semiconductor device manufacturing method |
| 01/20/2005 | US20050013994 Thermal barrier coating with stabilized compliant microstructure |
| 01/20/2005 | US20050013928 Aqueous solution containing sulfonate compound |
| 01/19/2005 | EP1498511A1 Method of electroless plating and semiconductor wafer having metal plating layer formed thereon |
| 01/19/2005 | EP1498510A2 Metal surface treatment composition, metal surface treatment method, and galvanized steel plate |
| 01/19/2005 | CN1568380A Nickel-based surface treatment films excellent in heat-resistant adhesion to resin |
| 01/19/2005 | CN1566399A Chemical plating solution and its use in low concentration standard gas packaging container |
| 01/19/2005 | CN1185483C Differential scanning calorimeter instrument and anticorrosive treating method thereof |
| 01/18/2005 | US6843852 Apparatus and method for electroless spray deposition |
| 01/13/2005 | WO2005004222A1 Precursor solution, method of preparation thereof and use thereof |
| 01/13/2005 | WO2005003033A2 Aluminum phosphate coatings |
| 01/13/2005 | WO2005002742A1 Process equipment wear surfaces of extended resistance and methods for their manufacture |
| 01/13/2005 | US20050009340 Method and apparatus for forming capping film |
| 01/13/2005 | US20050009334 Method of producing multilayer interconnection structure |
| 01/13/2005 | US20050009229 Solution deposition of chalcogenide films |
| 01/13/2005 | US20050009225 Hydrazine-free solution deposition of chalcogenide films |
| 01/13/2005 | US20050009213 Substrate processing method and apparatus |
| 01/13/2005 | US20050008788 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
| 01/13/2005 | US20050008786 Cobalt shunt or barrier layer on copper semiconductor wafer; in situ mixing, disposal of plating solution; controlling temperature |
| 01/13/2005 | US20050008777 Heating at high temperature; forming metal oxide; uniformity |
| 01/13/2005 | US20050006644 Electroless deposition of doped noble metals and noble metal alloys |
| 01/13/2005 | US20050006339 Electroless deposition methods and systems |
| 01/13/2005 | US20050006242 Void-free damascene copper deposition process and means of monitoring thereof |
| 01/13/2005 | US20050005820 Ink jetting; palladium, aliphatic amine complexes capable of being reduced by heating; forming palladium metal in pattern; electronics |
| 01/13/2005 | DE20122301U1 Device for chemical and electrolytic surface treatment of rod-like components has rotating chambers arranged along a longitudinal axis |
| 01/13/2005 | CA2529095A1 Aluminum phosphate coatings |
| 01/12/2005 | EP1496542A2 Method and apparatus for forming capping film |
| 01/12/2005 | EP1496061A2 Copper compound and method for producing copper thin film using the same |
| 01/12/2005 | EP1495157A1 Method for copper-plating or bronze-plating an object and liquid mixtures therefor |
| 01/12/2005 | CN1565047A Method of manufacturing semiconductor device |
| 01/12/2005 | CN1564876A Thin metal oxide film and process for producing the same |
| 01/12/2005 | CN1563489A Method of silver plating layer in fine structure deposited from non aqueous solution and application |
| 01/12/2005 | CN1563488A Bath formula of chemical plating for magnesium and magnesium alloy |
| 01/12/2005 | CN1563487A Bright chemical nickel plating liquid and application |
| 01/12/2005 | CN1563486A Method for carrying out hole sealing by using fol of silicie acid on plating surface of nickel-phosphor alloy |
| 01/12/2005 | CN1563485A Method for preparing nano zinc oxide film of high ultraviolet absorption |
| 01/12/2005 | CN1184361C Process for metallizing a plastic surface |
| 01/12/2005 | CN1184349C Formation of metal interconnection structure |
| 01/11/2005 | US6841885 High melting metal on insulator; lead-free electroless plated metal coating covering Group 1B precipitated metal |
| 01/11/2005 | US6841497 Method of producing aluminum oxides and products obtained on the basis thereof |
| 01/11/2005 | US6841476 Electroless plating method |
| 01/11/2005 | US6841074 Method and apparatus of purifying an electrolyte |
| 01/11/2005 | US6841009 Method of manufacturing a reaction vessel suitable for oxidation and decomposition processing with supercritical water |
| 01/11/2005 | US6840644 Metal salt solution for forming a metallic mirror surface on a receiving surface |
| 01/06/2005 | WO2005000950A1 Modified polyacetals for plating |
| 01/06/2005 | WO2005000743A2 Molybdenum doped alumina garnets |
| 01/06/2005 | WO2005000579A1 Multilayer body and method for producing same |
| 01/06/2005 | WO2004092444A3 Use of an object as an electronic component |
| 01/06/2005 | US20050003677 Activation plate for electroless and immersion plating of integrated circuits |
| 01/06/2005 | US20050003654 Method of producing semiconductor device |
| 01/06/2005 | US20050003590 Method for defining a source and a drain and a gap inbetween |
| 01/06/2005 | US20050003101 Overcoating substrate using catalyst; overlapping multilayer; sealing |
| 01/06/2005 | US20050003090 Sensitizers using Group 8 metal; immersion in tin bath; oxidation |
| 01/06/2005 | US20050003086 Copper compound and method for producing copper thin film using the same |
| 01/06/2005 | US20050003085 Composition for forming a coating film, method of preparing the composition, tantalum oxide film and method of forming the tantalum oxide film |
| 01/06/2005 | US20050001528 Enhanced field emission from carbon nanotubes mixed with particles |
| 01/05/2005 | EP1493841A1 Metallization of ceramics |
| 01/05/2005 | EP1493840A2 Ferroelectric thin film formation composition, ferroelectric thin film, and method of fabricating thin film |
| 01/05/2005 | DE10323905A1 Verfahren zur Erzeugung von ultradünnen homogenen Metallschichten A process for the production of ultra thin homogeneous metal layers |
| 01/04/2005 | US6838893 Probe card assembly |
| 01/04/2005 | US6838750 Interconnect circuitry, multichip module, and methods of manufacturing thereof |
| 01/04/2005 | US6838404 Vapor deposition of organometallic compound; hydrolysis forming metal oxide |
| 01/04/2005 | US6838117 Subjecting a hydrothermally formed film to hydrothermally processing in an aqueous solution having a pH of about 5 to 7 |
| 01/04/2005 | US6838116 Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition |
| 01/04/2005 | US6837930 Continuous ceramic composite plating method and apparatus for long doctor base materials |
| 01/04/2005 | US6837923 Low viscosity polyoxyalkoxylated silicon glycol surfactants |
| 12/30/2004 | US20040265600 Material for forming copper undercoat films |
| 12/30/2004 | US20040265592 Field emission type cold cathode device, manufacturing method thereof and vacuum micro device |
| 12/30/2004 | US20040265507 Process for the preparation of metal oxide coated organic material by microwave deposition |
| 12/30/2004 | US20040265501 storing solution containing subset of group consisting of metal ion, complexing agent, ammonium salt, and strong base, then nearer to time of use in electroless deposition process, using solution to form electroless deposition solution containing entire group; interconnect structures for microelectronics |
| 12/30/2004 | US20040264105 Component formation via plating technology |
| 12/30/2004 | US20040262147 Sputtering an alloy in oxygen to form a spinel oxides of two different transition metals; stoichiometry; infrared transmission, electroconductivity, stability; optical coatings for light emitting diode, transistor, solar cells, flat panel displays |
| 12/30/2004 | DE102004017984A1 Electrical board manufacture used in power electronics, involves setting conductive strips and heat sinks on conductive layers on both sides of non-conducting base material and fixing heat-dissipating components on conductive strips |
| 12/29/2004 | WO2004114026A1 Casing for transporting a toner mixture and method for producing a casing of this type |
| 12/29/2004 | WO2004113640A1 Improvements to lead sheet materials |
| 12/29/2004 | WO2004113594A2 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles |
| 12/29/2004 | WO2004113255A1 A colloidal composite sol gel formulation with an expanded gel network for making thick inorganic coatings |
| 12/29/2004 | WO2004113253A2 Method of preparing layers of oxides of metallic elements |
| 12/29/2004 | WO2004097929A3 Method and apparatus for reduction of defects in wet processed layers |
| 12/29/2004 | EP1492163A2 Substrate processing method and apparatus |
| 12/29/2004 | EP1491656A1 Electroless deposition catalyst and menthod |
| 12/29/2004 | CN1558966A Platable engineered polyolefin alloys |
| 12/29/2004 | CN1558017A Nickel-copper composite metal textile and preparation method thereof |
| 12/29/2004 | CN1182612C Conductive porous body and metal porous body and cell polar plate made thereby |
| 12/29/2004 | CA2527763A1 A process for the preparation of a pigment comprising a core material and at least one dielectric layer |
| 12/28/2004 | US6835898 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 12/28/2004 | US6835331 Conductive composition |
| 12/23/2004 | WO2004111299A2 Solution and method for ultra thin, non-porous and highly adhesive gold coating |
| 12/23/2004 | WO2004111298A1 Process for the preparation of metal oxide coated organic material by microwave deposition |
| 12/23/2004 | WO2004111287A2 Electroless gold plating solution |
| 12/23/2004 | WO2004110929A1 Silane polymer and method for forming silicon film |
| 12/23/2004 | US20040258914 Enhanced metal ion release rate for anti-microbial applications |
| 12/23/2004 | US20040258906 blends of acetal resins and semicrystalline or amorphous thermoplastic resins and acid soluble group II compounds; molding, extrusion or thermoforming to form articles, that can be acid etched, and coated with metals; chemical resistance |
| 12/23/2004 | US20040258848 Method and apparatus for processing a substrate |
| 12/23/2004 | US20040258847 Method of measuring component loss |
| 12/23/2004 | US20040258611 Producing 300 micron layer in single deposition; catalyst supports |
| 12/23/2004 | US20040256235 Removing one metal from an alloy plating solution containing two kinds of metals that differ in standard electrode potential, and preparing a single metal plating solution from the remaining other metal |