| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 02/24/2005 | US20050042383 Colloidal seed formation for printed circuit board metallization |
| 02/24/2005 | US20050042366 Forming openings in dielectric layer laminated onto substrate; applying uniform copper plating |
| 02/24/2005 | US20050040535 has plating catalytic activity; multilayered printed wiring board using a conductive film; good adhesive strength between adjacent insulating layers |
| 02/23/2005 | EP1507746A2 Substrate comprising a titanium oxide/cerium oxide protective layer |
| 02/23/2005 | EP1427869B1 Regeneration method for a plating solution |
| 02/23/2005 | CN1585833A Powder coated with titania film and method for production thereof |
| 02/23/2005 | CN1584116A Metal surface treatment composition, metal surface treatment method, and galvanized steel plate |
| 02/23/2005 | CN1584113A Crystal silver mirror and preparing method thereof |
| 02/23/2005 | CN1584112A Preparation of double axial structured CeO2 film from inorganic salt as raw material by liquid phase chemical process |
| 02/23/2005 | CN1583331A Preparing method for medium hole noble metal hollow microscapsule |
| 02/22/2005 | US6858084 Plating apparatus and method |
| 02/17/2005 | WO2005015627A1 Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| 02/17/2005 | WO2005014885A1 Electrode for electrochemical processes and method for producing the same |
| 02/17/2005 | WO2005014881A2 Production method of substrate with black film and substrate with black film |
| 02/17/2005 | WO2005014183A1 Polymer-assisted deposition of films |
| 02/17/2005 | WO2004094682B1 Improved coating for silver plated circuits |
| 02/17/2005 | WO2004087992A3 Method for the formation of a coating of metal oxides on an electrically-conducting substrate, resultant activated cathode and use thereof for the electrolysis of aqueous solutions of alkaline metal chlorides |
| 02/17/2005 | US20050037580 Manufacturing method for semiconductor device |
| 02/17/2005 | US20050035347 Probe card assembly |
| 02/17/2005 | US20050034996 Non-reactive coatings for inertization |
| 02/17/2005 | US20050034526 Semiconductor sensor and method of plating semiconductor devices |
| 02/17/2005 | DE10332567A1 Verbindung für die Bildung einer Schicht auf einem Substrat, Verfahren zur Herstellung einer Schicht auf einem Substrat und Halbleiterbauelement Connection for the formation of a layer on a substrate, method for producing a layer on a substrate and semiconductor device |
| 02/16/2005 | EP1507026A1 Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings |
| 02/16/2005 | EP1410403A4 Low temperature method and compositions for producing electrical conductors |
| 02/16/2005 | CN1580321A Chemical Plated rare earth coblat-boron alloy cladding material, and its preparing method and cladding formation mode |
| 02/16/2005 | CN1580320A Magnesium and magnesium alloy chemical-plating liquor composition |
| 02/15/2005 | US6855378 Printing of electronic circuits and components |
| 02/15/2005 | US6855191 Reducing agent that is oxidized by gold, and an additional reducing agent that is either oxidized by gold or by a substrate metal |
| 02/10/2005 | WO2005013331A2 Supercritical fluid-assisted deposition of materials on semiconductor substrates |
| 02/10/2005 | WO2004111299A3 Solution and method for ultra thin, non-porous and highly adhesive gold coating |
| 02/10/2005 | WO2004068389A3 Method of forming a conductive metal region on a substrate |
| 02/10/2005 | US20050032375 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization |
| 02/10/2005 | US20050032362 Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures |
| 02/10/2005 | US20050031895 Stable solution comprising stabilizers of complexes, water-soluble silver compound and water-soluble other metal compounds; stabilizing the coatings on printed curcuits or electronic parts; form a thick uniform smooth gold film; electrochemistry |
| 02/10/2005 | US20050031876 Undercoating a substrate; fluidization; durability; photocatalyst |
| 02/10/2005 | US20050031788 Conditioning a ceramic, applying a catalyst to the ceramic, and plating a metal alloy on the ceramic employing a bath of mid-level phosphorous content; reduces the probability of metal and metal alloy layers separating from their ceramic substrates |
| 02/10/2005 | US20050031727 Honeycomb structural body forming ferrule and method of manufacturing the ferrule |
| 02/10/2005 | US20050029669 Semiconductor device and method for manufacturing the same |
| 02/10/2005 | US20050028363 Contact structures and methods for making same |
| 02/10/2005 | DE10259310B4 Verfahren zur Herstellung eines elektronischen Teils und stromloses Plattierverfahren A method of manufacturing an electronic part and electroless plating |
| 02/10/2005 | CA2574816A1 Supercritical fluid-assisted deposition of materials on semiconductor substrates |
| 02/09/2005 | CN1578814A Coating compound for forming titanium oxide film, method for forming titanium oxide film and metal substrate coated with titanium oxide film |
| 02/09/2005 | CN1578597A Wiring substrate, apparatus for producing wiring substrate and method for producing the same |
| 02/09/2005 | CN1578594A Copper compound and method for producing copper thin film using the same |
| 02/09/2005 | CN1577742A Solution deposition of chalcogenide films |
| 02/09/2005 | CN1576393A Metallization of ceramics |
| 02/09/2005 | CN1188901C Method for preparing 3-D orientation zinc oxide film |
| 02/09/2005 | CN1188544C High temperature antioxidant base metal coated nickel powder composition and its production process |
| 02/08/2005 | US6852626 Film deposition method and apparatus |
| 02/08/2005 | US6852549 Ferroelectric thin film processing for ferroelectric field-effect transistor |
| 02/08/2005 | US6852425 Contacting a liquid suspension photosystem I-containing units and metal precursors with light to cause reductive precipitation of metal complexes |
| 02/08/2005 | US6852300 Process for preparing silica or silica-based thick vitreous films according to the sol-gel technique and thick films thereby obtained |
| 02/08/2005 | US6852210 Electroless plating using a redox system; by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to activate the plating bath; storage stability |
| 02/08/2005 | US6852152 Colloidal seed formulation for printed circuit board metallization |
| 02/03/2005 | WO2005010954A1 Multi-staged heating system for fabricating microelectronic devices |
| 02/03/2005 | WO2005010234A1 Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
| 02/03/2005 | WO2005010233A2 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
| 02/03/2005 | WO2005010108A1 Palladium complexes for printing circuits |
| 02/03/2005 | US20050025960 Catalyst composition and deposition method |
| 02/03/2005 | US20050023248 Immersing object into solution containing gold ions and reductant and irradiating with ultraviolet light |
| 02/03/2005 | US20050023148 Selectively transferring a prepatterned dielectric mask precursor through which voids extend to solidify and adhere to a substrate; depositing material through the voids; removing the mask to leave one or more openings through the deposited layer; depositing a 2nd material through the openings; polishing |
| 02/03/2005 | US20050022909 Substrate processing method and substrate processing apparatus |
| 02/03/2005 | US20050022908 Containing niobium oxide colloidal particles derived from a niobium oxide sol stabilized by c citric acid or salts; may also contain a water-borne resin, water-dispersible silica, and a compound of vanadium, zirconium and/or titanium; provides superior rust prevention and adhesion |
| 02/03/2005 | US20050022745 Electroless plating method, electroless plating device, and production method and production device of semiconductor device |
| 02/03/2005 | US20050022692 Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
| 02/03/2005 | CA2530286A1 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
| 02/02/2005 | EP1502299A2 Contacting of nanotubes |
| 02/02/2005 | CN1575099A Method for forming sheet metal |
| 02/02/2005 | CN1572917A Method for recycling of plating solutions |
| 02/02/2005 | CN1572914A Liquid tank |
| 02/02/2005 | CN1572903A Catalyst composition and deposition method |
| 02/02/2005 | CN1188021C Copper tin displacement method for printed circuit board |
| 02/02/2005 | CN1187481C Electrolyzing apparatus |
| 02/01/2005 | US6849865 Chemical processor |
| 02/01/2005 | US6849305 Photolytic conversion process to form patterned amorphous film |
| 02/01/2005 | US6849302 Resin-coated metal sheet for parts of electronic machinery and tools and production method thereof |
| 02/01/2005 | US6849291 Gas sensing element and method for manufacturing the same |
| 01/27/2005 | WO2005008803A2 Semiconductor component, and method for the production thereof |
| 01/27/2005 | WO2005007930A1 Electroless deposition methods and systems |
| 01/27/2005 | WO2005007929A2 Resin substrate having a resin-metal composite layer and method for manufacturing thereof |
| 01/27/2005 | WO2005007576A1 Method for manufacturing metal organic deposition precursor solution using superconduction oxide and film superconductor |
| 01/27/2005 | US20050019502 Surface coating a photopolymerizable composition onto a substrate, irradiation polymerization with a hydrophilic addition monomer to form a graft polymer, adsorption and reduction of a metal salt; high density; improved durability; magnetic recording media |
| 01/27/2005 | US20050019484 Niobium oxide-based layers for thin film optical coatings and processes for producing the same |
| 01/27/2005 | US20050018274 Nanoparticle-based all-optical sensors |
| 01/27/2005 | US20050017099 Narrow diameter needle having reduced inner diameter tip |
| 01/27/2005 | US20050016416 Stabilizer for electroless copper plating solution |
| 01/27/2005 | US20050016328 Method of manufacturing silver flake |
| 01/27/2005 | US20050016201 Multi-staged heating system for fabricating microelectronic devices |
| 01/27/2005 | DE19816325B9 Verfahren und Vorrichtung zur Vernickelung der Innenoberflächen von Hohlkörpern in Form von Wärmeaustauschern aus Aluminium und Aluminiumlegierungen durch Durchlaufstömung Method and apparatus for nickel plating of the inner surfaces of hollow bodies in the form of heat exchangers made of aluminum and aluminum alloys by Durchlaufstömung |
| 01/27/2005 | DE10356449B3 Bath for electroless deposition of silver, e.g. on circuit boards, comprises a soluble silver ion source, an acid and an aromatic dicarboxylic acid with electron-withdrawing substituents |
| 01/26/2005 | EP1499452A2 Process for preparing palladium alloy composite membranes for use in hydrogen separation, palladium alloy composite membranes and products incorporating or made from the membranes |
| 01/26/2005 | EP1232294B1 Metallizing method for dielectrics |
| 01/26/2005 | CN1570206A Composite plating layer containing carbon nano shallot ball shaped nanomaterial and its preparation method |
| 01/26/2005 | CN1570205A Composite nickel plating method for aluminum alloy heating piece |
| 01/26/2005 | CN1186189C Metal plate and its making and coating method |
| 01/25/2005 | US6846519 Method and apparatus for electroless deposition with temperature-controlled chuck |
| 01/20/2005 | WO2005006423A1 Electroless and immersion plating of integrated circuits using an activation plate |
| 01/20/2005 | WO2005005687A1 Method of coating nanosturctures with metal using metal salts |
| 01/20/2005 | WO2004094682A3 Improved coating for silver plated circuits |
| 01/20/2005 | WO2004092436A3 Object |