Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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08/25/2005 | US20050183952 Electrode |
08/25/2005 | DE102004006000A1 Conducting metallized powder, comprises core particles with a nickel film formed on the surface by metallization |
08/25/2005 | DE102004005999A1 Conducting metallized powder, comprises core particles with a nickel film formed on the surface |
08/24/2005 | CN1659686A 衬底处理设备和衬底处理方法 The substrate processing apparatus and a substrate processing method |
08/24/2005 | CN1659312A Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
08/24/2005 | CN1659311A Method for copper-plating or bronze-plating an object and liquid mixtures therefor |
08/24/2005 | CN1659310A Method for electroless metalisation of polymer substrate |
08/24/2005 | CN1658739A Production method of suspension board with circuit |
08/24/2005 | CN1216292C Method for fixing biological macro molecule in common pattern on inorganic silicone material surface |
08/24/2005 | CN1216181C Chemical replacement silver plating additive, method for making same and use thereof |
08/23/2005 | US6933231 Methods of forming conductive interconnects, and methods of depositing nickel |
08/18/2005 | WO2005076338A1 Use of dissolved hafnium alkoxides or zirconium alkoxides as starting materials for hafnium oxide layers and hafnium oxynitride layers or zirconium oxide layers and zirconium oxynitride layers |
08/18/2005 | WO2005075703A1 Electroless coating methods for depositing silver-tungsten coatings, kits and products |
08/18/2005 | WO2005075702A2 Method for depositing a metal oxide coating on a substrate |
08/18/2005 | US20050181226 Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber |
08/18/2005 | US20050178669 Method of electroplating aluminum |
08/18/2005 | US20050178668 Method for depositing nickel- and chromium (VI) -free metal matte layers |
08/18/2005 | US20050178569 Electromagnetic-shielding transparent window member and method for producing the same |
08/18/2005 | US20050178441 Fuel pump for inter-cylinder direct fuel injection apparatus |
08/18/2005 | DE102004001613A1 The use of an object as a shaping tool having a surface consisting in whole or in part of a composite material made of a nonmetallic substrate useful |
08/17/2005 | EP1564314A1 Metal plating structure and method for production thereof |
08/17/2005 | EP0859686B1 Fabricating interconnects and tips using sacrificial substrates |
08/11/2005 | WO2005073985A1 Conductive particle and anisotropic conductive material |
08/11/2005 | WO2005073431A1 Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating |
08/11/2005 | WO2005073430A2 Apparatus for electroless deposition of metals onto semiconductor substrates |
08/11/2005 | WO2005073429A2 Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber |
08/11/2005 | US20050175780 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
08/11/2005 | US20050175773 Metal/ceramic bonding member and method for producing same |
08/11/2005 | US20050174407 Depositing solid materials |
08/11/2005 | US20050173374 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
08/11/2005 | US20050173253 Minimizing voids and cracks from thermal shock; dispensing heat processing fluid onto substrate prior to annealing; high throughput |
08/11/2005 | DE102004003891A1 Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung Oriented, can be structured by means of electromagnetic radiation sheet of thermoplastic polyester, processes for their preparation and their use |
08/11/2005 | DE102004002778A1 Verfahren zur Instandhaltung von Metallisierungsbädern Procedures for the maintenance of metallization |
08/10/2005 | EP1562411A1 Metal/ceramic bonding member and method for producing same |
08/10/2005 | EP1560665A1 Corrosion resistant coatings and method of producing |
08/10/2005 | EP1560664A1 Nanostructured and nanoporous film compositions, structures, and methods for making the same |
08/10/2005 | CN1652666A Method for mfg wired substrate and method for mfg electronic apparatus |
08/09/2005 | US6926922 PWB manufacture |
08/04/2005 | WO2005071138A1 Method for processing substrate, catalyst process liquid, and substrate processing apparatus |
08/04/2005 | WO2003087707A3 Metallization of carbon nanotubes for field emission applications |
08/04/2005 | US20050170652 Method for manufacturing wiring substrate and method for manufacturing electronic device |
08/04/2005 | US20050170622 Method for manufacturing wiring substrate and method for manufacturing electronic device |
08/04/2005 | US20050170080 single process tool; surface of semiconductor has barrier layer and conductor; two planarization modules, an electroless deposition module; conductor is planarized until a portion of the barrier layer is expose and removed; workpiece moved to electroless plating module, a cap layer is formed |
08/04/2005 | US20050167712 Ferroelectric film, ferroelectric memory, and piezoelectric element |
08/04/2005 | US20050167281 Production method of suspension board with circuit |
08/04/2005 | DE4313980B4 Integrierte Hybridschaltung und Verfahren zu deren Herstellung A hybrid integrated circuit, and processes for their preparation |
08/03/2005 | EP1559810A2 Process for the preparation of a ceramic protective layer |
08/03/2005 | EP1559740A1 Oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester, process of preparation and use |
08/03/2005 | EP1559677A2 Mixed metal oxide layer and method of manufacture |
08/03/2005 | EP1558794A1 Measurement of the concentration of a reducing agent in an electroless plating bath |
08/03/2005 | EP1558786A2 Pretreatment method for electroless plating material and method for producing member having plated coating |
08/03/2005 | EP1558785A1 Substrate coating method |
08/03/2005 | CN1650046A Method of plating nonconductor product |
08/03/2005 | CN1649473A Production method of suspension board with circuit |
08/02/2005 | US6924232 Semiconductor process and composition for forming a barrier material overlying copper |
08/02/2005 | US6923892 Method for electrodeposited film formation, method for electrode formation, and apparatus for electrodeposited film formation |
08/02/2005 | CA2258102C Multilayer-coated powder and process for producing the same |
07/28/2005 | WO2005069068A1 Method for gravure printing transparent electrodes, and ink composition therefor |
07/28/2005 | WO2005068134A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components |
07/28/2005 | US20050164499 Electroless plating method and apparatus |
07/28/2005 | US20050164020 use of a hot-press method where ion exchange groups are introduced in a resin, metal ions are bound to said groups, and then chemically reduced to form metal at the surface of the resin in order to increase bonding strength between the metal and resin base |
07/28/2005 | US20050163987 metal oxide or spinel capable of activation by electromagnetic radiation forms metal nuclei; graphite, carbon black, inorganic or organic black pigment absorb radiation; printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits |
07/28/2005 | US20050163917 Direct writeTM system |
07/28/2005 | US20050163916 Electroless plating systems and methods |
07/28/2005 | US20050161338 activation of conductive surface on semiconductors and to depositing capping layers on the conductive layers as part of electronics |
07/28/2005 | US20050160990 Apparatus for electroless deposition of metals onto semiconductor substrates |
07/28/2005 | US20050160974 Microelectronic fabrication system components and method for processing a wafer using such components |
07/28/2005 | DE19655326B4 Electroless nickel plating bath - containing nickel salt, reducing agent, complexing agent and a compound with sulphur to sulphur bond |
07/28/2005 | DE102004001107A1 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film |
07/28/2005 | DE102004001097A1 Metallische Substrate mit verformbarer glasartiger Beschichtung Metallic Substrates with a deformable vitreous coating |
07/28/2005 | CA2551397A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components |
07/27/2005 | EP1558067A1 Electromagnetic wave shielding light transmitting window material and process for producin the same |
07/27/2005 | EP1557483A1 Method for forming thin silver mirror film, and method for forming coating film comprising thin silver mirror film |
07/27/2005 | EP1557482A2 Process for the maintenance of metallization baths |
07/27/2005 | EP1557481A2 Ferroelectric film, ferroelectric memory, and piezoelectric element |
07/27/2005 | EP1556878A2 Enhanced field emission from carbon nanotubes mixed with particles |
07/27/2005 | EP1556737A2 Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrication |
07/27/2005 | EP1556175A2 Hydrothermal deposition of thin and adherent metal oxide coatings for high temperature corrosion protection |
07/27/2005 | EP1404746B1 Pre-treatment of plastic materials |
07/27/2005 | CN1646728A Method for electroless deposition of a metal layer on selected portions of a substrate |
07/27/2005 | CN1645617A Ferroelectric film, ferroelectric memory, and piezoelectric element |
07/27/2005 | CN1644759A Surface treating method for improving lanthanum alloy vapour impurity poisoning performance |
07/27/2005 | CN1644758A Activating method for nonmetallic base material surface chemical coated metal |
07/27/2005 | CN1644757A Production of quantum point nanometer titanium dioxide composite membrane |
07/27/2005 | CN1644496A Ceramics and production method therefor, and ferroelectric capacitor, semiconductor device, other elements |
07/27/2005 | CN1212431C Method for enhancing the solderability of a surface |
07/27/2005 | CN1212422C Preparation method of titanium dioxide bydrophilic film blended with vanadium |
07/21/2005 | WO2005066392A2 Surface structuring by means of a film |
07/21/2005 | WO2005066388A2 Metallic substrates comprising a deformable glass-type coating |
07/21/2005 | WO2005065815A1 Method for coating powder particle |
07/21/2005 | WO2005065433A2 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
07/21/2005 | WO2005065208A2 Apparatus and method for treating used electroless plating solutions |
07/21/2005 | WO2005038082A3 Method for obtaining a composite ferro-electric material |
07/21/2005 | US20050158478 Substrate processing apparatus and substrate processing method |
07/21/2005 | US20050158466 Mixture containing nonionic surfactant and stabilizer compound, such as triglyme, dipivaloylmethane, pinacol, pivalic acid or hexyleneglycol; for overcoating substrate with bismuth ferrite; heat treatment; suitable for application to non-volatile ferroelectric memories; low decomposition temperature |
07/21/2005 | US20050157396 Microstructure array, mold for forming a microstructure array, and method of fabricating the same |
07/21/2005 | US20050156991 Maskless direct write of copper using an annular aerosol jet |
07/21/2005 | US20050155514 Additive for plating bath |
07/21/2005 | DE10360046A1 Kupfer(l)formiatkomplexe Formate complexes of copper (I) |
07/20/2005 | EP1555335A2 Additive for plating bath |