Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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11/10/2005 | WO2005105322A1 Substrate processing unit and substrate processing apparatus |
11/10/2005 | WO2005045144A3 Water-conducting body comprising a coating of a glass-like composite matrix |
11/10/2005 | US20050249878 Process of forming a uniaxially oriented mesotructured film on a uniaxially oriented polymer compound |
11/09/2005 | CN1694769A A method for depositing a film on a substrate |
11/09/2005 | CN1226238C Carbon, ceramic-nonmetallic material and metal material connection method |
11/08/2005 | US6963157 Lead zirconate titanate fiber, smart board using lead zirconate titanate fiber, actuator utilizing smart board, and sensor utilizing smart board |
11/08/2005 | US6962873 Nitridation of electrolessly deposited cobalt |
11/03/2005 | WO2005103329A2 Manufacturing method |
11/03/2005 | WO2005103318A1 High nucleation density organometallic compounds |
11/03/2005 | WO2004029326A3 Creating layers in thin-film structures |
11/03/2005 | US20050245080 Method and apparatus for processing substrate |
11/03/2005 | US20050245004 Method for manufacturing wiring substrate and method for manufacturing electronic device |
11/03/2005 | US20050244678 Niobium oxide-based layers for thin film optical coatings and processes for producing the same |
11/03/2005 | US20050244577 Process for fabricating a carbon nanofiber/Cu composite powder by electroless Cu plating |
11/03/2005 | US20050241955 Substrate processing apparatus and substrate processing method |
11/03/2005 | US20050241953 Surface of zirconia ceramic is cleaned, acid etched, rinsed; activating surface is achieved by first applying tin sensitizer, rinsing, then palladium activator, then applying electroless nickel to surface of material and rinsing; surface can be subsequently plated with gold, nickel, copper, tin |
11/03/2005 | US20050241951 Selective catalytic activation of non-conductive substrates |
11/03/2005 | US20050241949 Selective catalytic activation of non-conductive substrates |
11/03/2005 | US20050241947 System and method for an increased bath lifetime in a single-use plating regime |
11/03/2005 | US20050241942 Homogenous coating distribution, high corrosion resistance; for example, depositing a nickel-phosphorus layer using hypophosphite; electrodialysis; improvement consisting in providing main cation exchangers for removing ions of nickel metal from a concentrate fluid |
11/03/2005 | US20050241530 Multilayer interference pigments |
11/03/2005 | DE102004017440A1 Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen A method for the treatment of laser-structured plastic surfaces |
11/02/2005 | EP1590500A2 Method of forming a conductive metal region on a substrate |
11/02/2005 | EP1590499A2 Improved silver plating method and articles made therefrom |
11/02/2005 | EP1590099A1 Process equipment wear surfaces of extended resistance and methods for their manufacture |
11/02/2005 | EP1590098A2 Fiber and sheet equipment wear surfaces of extended resistance and methods for their manufacture |
11/02/2005 | CN1692484A Semiconductor sensor and plating method for semiconductor device |
11/01/2005 | US6960366 Plated terminations |
11/01/2005 | CA2202384C Method of manufacturing electrodes for chemical current sources |
10/27/2005 | WO2004027113A3 Improved silver plating method and articles made therefrom |
10/27/2005 | WO2004024983A3 Method and apparatus for electroless deposition with temperature-controlled chuck |
10/27/2005 | US20050239264 Materials suitable for shallow trench isolation |
10/27/2005 | US20050238929 Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate |
10/27/2005 | US20050238812 Method for electroless metalisation of polymer substrate |
10/27/2005 | US20050236268 Substrate processing apparatus |
10/27/2005 | EP1590499A3 Improved silver plating method and articles made therefrom |
10/26/2005 | EP1589376A1 Conductive pattern forming method, and conductive pattern material |
10/26/2005 | EP1587967A1 Photosensitive dispersion with adjustable viscosity for metal deposition on an insulating substrate and use of same |
10/26/2005 | CN1689381A Method for the manufacture of printed circuit boards with integral plated resistors |
10/26/2005 | CN1688746A Method of electroless plating |
10/20/2005 | WO2005098088A1 Electroless gold plating liquid |
10/20/2005 | WO2005098087A2 Method for selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits |
10/20/2005 | WO2005056875A3 Formation of solid layers on substrates |
10/20/2005 | WO2005045095A3 The formation of layers on substrates |
10/20/2005 | US20050233593 Plating of multi-layer structures |
10/20/2005 | US20050233561 Adhesion of a metal layer to a substrate and related structures |
10/20/2005 | US20050233148 Metallised parts made from plastic material |
10/20/2005 | US20050233087 Thermal fatigue crack-resistant coatings for motor vehicle cylinder head |
10/20/2005 | US20050230399 Vacuum insulating double vessel and method for manufacturing the same |
10/20/2005 | US20050230263 Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby |
10/20/2005 | US20050230262 Electrochemical methods for the formation of protective features on metallized features |
10/20/2005 | US20050230260 Plating apparatus and method |
10/20/2005 | US20050230259 Process for metallising support media made from plastic material |
10/20/2005 | US20050229816 waterborne reactive graded mixed metal Zr:Si sol-gel; stable oxide surface covalently bonded on titanium and aluminum alloy; corrosion resistance, impact resistance over wide temperature range; adhesion; Conversion coating; nontoxic; spraying rather than immersion for easy maintenance |
10/19/2005 | EP1586675A1 Method for coating the interior of a hollow component and a hollow component having an interior coating |
10/19/2005 | CN1685082A Thin film of oxidic materials having a high dielectric constant |
10/19/2005 | CN1685081A 无电解镀方法 Electroless plating method |
10/19/2005 | CN1685080A Substrate processing apparatus and substrate processing method |
10/19/2005 | CN1684275A Thin film material for sunlight blind area ultraviolet detector and its producing method |
10/19/2005 | CN1684149A Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate |
10/19/2005 | CN1683588A Method for coating the interior of a hollow component and a hollow component having an interior coating |
10/19/2005 | CN1223706C Chemical copper plating process for non-aqueous system magnesium base hydrogen storage alloy powder |
10/19/2005 | CN1223705C Method of electroless plating layer and apparatus for electro less plating layer |
10/19/2005 | CN1223702C Plating method of metal film on surface of polymer |
10/18/2005 | US6956174 Tip structures |
10/13/2005 | WO2005095671A2 Method for the production of iridium oxide coatings |
10/13/2005 | WO2005094394A2 Non-chrome plating on plastic |
10/13/2005 | US20050227488 Capping of copper structures in hydrophobic ILD using aqueous electro-less bath |
10/13/2005 | US20050227485 Method of forming metallic wiring layer, method of selective metallization, apparatus for selective metallization and substrate apparatus |
10/13/2005 | US20050227181 Metallisation |
10/13/2005 | US20050227074 Conductive electrolessly plated powder and method for making same |
10/13/2005 | US20050227073 Conductive electrolessly plated powder and method for making same |
10/13/2005 | US20050227049 Process for fabrication of printed circuit boards |
10/13/2005 | US20050226995 Flexible printed circuits with many tiny holes |
10/13/2005 | US20050225993 Plated synthetic resin member for vehicle |
10/13/2005 | US20050224461 Method for metallizing titanate-based ceramics |
10/13/2005 | US20050224092 Substrates, after laser structuring, are brought into contact with solution of wetting agents and compositions that support the cleaning before metallization; leads to sufficient removal of the unintentionally deposited metal seeds without having lasting damaging effect on surface |
10/12/2005 | EP1584708A2 Process for the treatment of laser-structured plastic surfaces |
10/12/2005 | CN1681965A Electroless plating apparatus and electroless plating method |
10/12/2005 | CN1681964A Plated polyester resin article and method for production thereof |
10/12/2005 | CN1680622A Liquid and method for chemically plating chemical-carried Ni-Co-W film on Ni-Ti alloy |
10/12/2005 | CN1680621A Method for treating laser-structured plastic surfaces |
10/12/2005 | CN1222636C Pretreatment solution and pretreatment process of chemical nickel plating |
10/12/2005 | CN1222359C Production process of carrier metal catalyst |
10/11/2005 | US6953600 Complex of an amine compound and aluminum hydride and an organic solvent used to form wiring or an electrode which can be suitably used in a variety of electronic devices |
10/06/2005 | WO2005093131A1 Method for manufacturing fine pattern reproducing die |
10/06/2005 | WO2005092043A2 Process for fabrication of printed circuit boards |
10/06/2005 | WO2004113594A3 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles |
10/06/2005 | WO2003085166A3 Electroless deposition methods |
10/06/2005 | US20050221621 Proximity head heating method and apparatus |
10/06/2005 | US20050221112 Microtools for package substrate patterning |
10/06/2005 | US20050221103 Polyimide complex sheet |
10/06/2005 | US20050221015 Apparatus and method for electroless deposition of materials on semiconductor substrates |
10/06/2005 | US20050221008 Method of Plating a Golf Club Head |
10/06/2005 | US20050220993 Thin film of oxidic materials having a high dielectric constant |
10/06/2005 | US20050218487 Method for manufacturing wiring substrate and method for manufacturing electronic device |
10/06/2005 | US20050218437 Raw material solution, ferroelectric film, method for manufacturing ferroelectric film, piezoelectric element, piezoelectric actuator, ink jet recording head, and ink jet printer |
10/06/2005 | US20050218110 Method for manufacturing wiring substrate and method for manufacturing electronic device |
10/06/2005 | US20050217895 Flexible printed circuits with many tiny holes |
10/06/2005 | US20050217574 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads |