| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 05/10/2006 | CN1771352A Electroless gold plating liquid |
| 05/10/2006 | CN1771351A Composition for coating metals to protect against corrosion |
| 05/10/2006 | CN1771096A Corrosion protection on metals |
| 05/10/2006 | CN1769525A Low cost, room temperature and quick speed chemical plating method for preparing silicon carbide-nickel core-shell structure and technics |
| 05/10/2006 | CN1769521A Chemical nickel phosphor plating method for magnesium alloy |
| 05/10/2006 | CN1769520A Electroless plating apparatus and method |
| 05/10/2006 | CN1769519A Metal nanometertube preparation method |
| 05/10/2006 | CN1255212C Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition |
| 05/09/2006 | US7041725 Adhesion of the applied metal layer |
| 05/09/2006 | US7041606 Electroless deposition of doped noble metals and noble metal alloys |
| 05/09/2006 | US7040948 Enhanced field emission from carbon nanotubes mixed with particles |
| 05/09/2006 | CA2069495C Catalytic, water-soluble polymeric films for metal coatings |
| 05/04/2006 | US20060094309 Components for electrical connectors, and metal strip therefore |
| 05/04/2006 | US20060090669 Method for copper-plating or bronze-plating an object and liquid mixtures therefor |
| 05/04/2006 | DE4401671B4 Verfahren zur Verringerung der Löslichkeit von Kupferionen aus Rohren aus Kupfer oder Kupferlegierungen sowie Kupferrohr mit verringerter Kupferlöslichkeit A process for reducing the solubility of copper ions from pipes made of copper or copper alloys as well as copper tube with reduced copper solubility |
| 05/04/2006 | DE102004052563A1 Coating components with alumina comprises heating component coated with aluminum hydroxide prepared by adding excess aluminum or aluminum alloy to basic aqueous aluminate solution |
| 05/03/2006 | EP1652962A1 Electroless metallic plating method for leak repair and prevention in liquid-cooled generator stator bars |
| 05/03/2006 | EP1652222A1 Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| 05/03/2006 | EP1651795A1 Electroless deposition methods and systems |
| 05/03/2006 | CN2776213Y Micro bead mixed type non sticking pot structure |
| 05/03/2006 | CN1766166A Cu/Si nanometer porous array composite material preparation method |
| 05/03/2006 | CN1766165A Nickel substitute chrome-plating process |
| 05/03/2006 | CN1766164A Fe3O4/Si nanometer porous array composite material preparation method |
| 05/03/2006 | CN1766163A Supersonic and atomized filming method and device for preparing YBCO thin film |
| 05/02/2006 | US7036915 Composition for forming piezoelectric film, producing method for piezoelectric film, piezoelectric element and ink jet recording head |
| 05/02/2006 | CA2524143A1 Electroless metallic plating method for leak repair and prevention in liquid-cooled generator stator bars |
| 04/27/2006 | WO2006042892A1 Method of modifying the surfaces of metals, semiconductors and carbon, surface-modified products thus obtained and applications thereof |
| 04/27/2006 | WO2006014861A3 Jet printing of patterned metal |
| 04/27/2006 | US20060088664 Method and apparatus to color vinyl slats |
| 04/27/2006 | US20060086931 Electro- and electroless plating of metal in the manufacture of PCRAM devices |
| 04/26/2006 | EP1649083A2 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
| 04/26/2006 | EP1649077A1 Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
| 04/26/2006 | CN1764739A Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 04/26/2006 | CN1764349A Electroformed metallization |
| 04/26/2006 | CN1763245A Plating substrate, electroless plating method, and circuit forming method using the same |
| 04/26/2006 | CN1253414C Gold plating method of quartz or high-alumina tube |
| 04/25/2006 | US7033463 Substrate plating method and apparatus |
| 04/20/2006 | WO2006041657A2 Maskless direct write of copper using an annular aerosol jet |
| 04/20/2006 | WO2006041117A1 Plating material, polyamic acid solution using said plating material, polyimide resin solution, and printed wiring board using them |
| 04/20/2006 | US20060084264 Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatment |
| 04/20/2006 | US20060083850 Cobalt and nickel electroless plating in microelectronic devices |
| 04/20/2006 | DE202004020795U1 Object with layers of composite material comprising a first nonmetallic layer and a second metallic layer applied to the first layer and containing polymer useful for various rollers and for turbomolecular pump components |
| 04/20/2006 | DE10348734B4 Verfahren zum selektiven Galvanisieren von Metalloberflächen und Selektiv-Galvanisierungssystem für Metalloberflächen A method for selective electroplating of metal surfaces and selective electroplating system for metal surfaces |
| 04/19/2006 | EP1590098A4 Fiber and sheet equipment wear surfaces of extended resistance and methods for their manufacture |
| 04/19/2006 | CN1761534A Electroless plating solution and process |
| 04/18/2006 | US7029761 Bonding layer for bonding resin on copper surface |
| 04/18/2006 | US7029529 Method and apparatus for metallization of large area substrates |
| 04/13/2006 | WO2006039453A2 Silver nanoparticles made in non-aqueous solvent |
| 04/13/2006 | WO2006039380A2 Silver microribbon composition and method of production |
| 04/13/2006 | WO2006038011A2 Active filler particles in inks |
| 04/13/2006 | WO2005059204A3 Rolling bearing having a nickel-phosphorus coating |
| 04/13/2006 | US20060079085 Method for applying metal features onto metallized layers using electrochemical deposition |
| 04/13/2006 | US20060079084 Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment |
| 04/13/2006 | US20060079083 Method for applying metal features onto metallized layers using electrochemical deposition using acid treatment |
| 04/13/2006 | US20060078465 Measuring transmissivity or absorbance of at least two different wavelengths as measured values of said electroless composite plating solution disposed in an absorbance cell; nickel plating; trapping fine bubbles; washing with pure water; vertically elongated plating solution |
| 04/12/2006 | EP1645658A1 Electroless gold plating solution |
| 04/12/2006 | EP1645538A1 Material composition for the production of a coating of a metallic component and coated metallic component |
| 04/12/2006 | EP1644995A2 Semiconductor component, and method for the production thereof |
| 04/12/2006 | EP1644971A1 Precursor solution, method of preparation thereof and use thereof |
| 04/12/2006 | EP1644555A2 Resin substrate having a resin-metal composite layer and method for manufacturing thereof |
| 04/12/2006 | EP1644453A1 Palladium complexes for printing circuits |
| 04/12/2006 | EP1644300A2 Method of preparing layers of oxides of metallic elements |
| 04/12/2006 | CN1251319C Microelectronic component insert making method |
| 04/12/2006 | CN1251173C Chord winder for stringed instrument |
| 04/12/2006 | CN1250772C Electroplating pretreatment solution and electroplating pretreatment method |
| 04/12/2006 | CN1250768C 镀覆组合物 Plating composition |
| 04/12/2006 | CN1250655C Coating composition |
| 04/11/2006 | US7026012 Method and apparatus for forming a metallic feature on a substrate |
| 04/06/2006 | WO2006035556A1 Electroless plating method and electrically nonconductive plating object with plating film formed thereon |
| 04/06/2006 | WO2006035397A2 Non-galvanically applied nickel alloy |
| 04/06/2006 | WO2005075702A3 Method for depositing a metal oxide coating on a substrate |
| 04/06/2006 | US20060073335 Conductive electrolessly plated powder and method for making same |
| 04/06/2006 | DE102004046258A1 Bath for the electroless deposition of palladium is based on an aqueous solution containing a divalent palladium compound, a base and a reducing agent |
| 04/05/2006 | EP1642652A1 Coating process of passivated, chromec surfaces of work-pieces and a so coated work-piece |
| 04/05/2006 | CN1249267C Plated resin molding products and manufacturing method thereof |
| 04/05/2006 | CN1248786C Nickel plating solution and process for its use |
| 04/04/2006 | US7022598 Method of producing multilayer interconnection structure |
| 04/04/2006 | US7022412 Member having metallic layer, its manufacturing method and its application |
| 04/04/2006 | US7022169 Electroless gold plating solution |
| 03/30/2006 | WO2006033957A1 Method to fabricate copper-cobalt interconnects |
| 03/30/2006 | WO2006033465A1 Semiconductor device and method for manufacturing the same, and treatment liquid |
| 03/30/2006 | WO2005118121A3 Kinetic shear mixer and method |
| 03/30/2006 | WO2005087979A3 A method and a device for deposition of a metal layer on a non-conducting surface of a substrate |
| 03/30/2006 | WO2005065433A3 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
| 03/30/2006 | US20060068543 Electro-and electroless plating of metal in the manufacture of PCRAM Devices |
| 03/30/2006 | DE4426803B4 Galvanisierter, thermoplastischer Fahrzeugkühlergrill mit verbesserter Flexibilität Galvanized thermoplastic vehicle grille with improved flexibility |
| 03/30/2006 | DE10313517B4 Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens Solution for etching copper, method for pretreating a layer of copper as well as application of the method |
| 03/29/2006 | EP1640342A1 Silane polymer and method for forming silicon film |
| 03/29/2006 | EP1640153A1 Multilayer body and method for producing same |
| 03/29/2006 | EP1639212A1 Improvements to lead sheet materials |
| 03/29/2006 | EP1638699A2 Enhanced metal ion release rate for anti-microbial applications |
| 03/29/2006 | EP1214739B1 Copper deposit process |
| 03/29/2006 | CN1754010A Surface-treated al sheet excellent in solderability, heat sink using the same, and method for producing surface-treated al sheet excellent in solderability |
| 03/29/2006 | CN1752285A Formular and process of polymer powder chemical Co-plating |
| 03/29/2006 | CN1752284A Formular of polymer powder chemical nickel-plating and technique thereof |
| 03/29/2006 | CN1752283A Method of Nd-Fe-B permanent magnet material surface coating |
| 03/28/2006 | US7018679 Coating installation with an atomizer change station |
| 03/23/2006 | WO2006030999A1 Electroless plating method and plating film obtained by the electroless plating method |
| 03/23/2006 | WO2006030998A1 Electro polishing combined electric plating apparatus and electroless plating apparatus using the same |
| 03/23/2006 | WO2005037418A3 Processes for fabricating conductive patterns using nanolithography as a patterning tool |