Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
06/2006
06/21/2006CN1791474A Method for coating substrates with a carbon-based material
06/21/2006CN1791437A Medical implants comprising biocompatible coatings
06/21/2006CN1791306A Electric wire formation method, wiring substrate, electrooptical element manufacturing method and electronic apparatus manufacturing method
06/21/2006CN1789198A Ferroelectric membrane with constituents graded distribution and its preparation method
06/21/2006CN1260778C Substrate processing method
06/21/2006CN1260390C Method of pretreatment of material to be electrolessly plated
06/20/2006US7064566 Probe card assembly and kit
06/20/2006US7064065 Silver under-layers for electroless cobalt alloys
06/20/2006US7063898 A metal fastener having a first layer comprising a chemical conversion coating and a second layer derived from a sol gel of an organometal polymer on the first layer which separates the metal from the cured sol gel film; aircraft rivets having improved adhesion to paint; corrosion resistance
06/15/2006WO2006062575A2 Microfabrication using patterned topography and self-assembled monolayers
06/15/2006US20060127590 Substrate coating method
06/14/2006EP1668174A2 Plating method and apparatus
06/14/2006EP1668169A1 Organotitanium precursors, method for their preparation and method of producing material and/or composite material using the same
06/14/2006EP1668167A2 Protection of metallic surfaces against thermally-induced wrinkling (rumpling)
06/14/2006CN1786268A Self assembly chemical silver plating method on non metal material surface
06/14/2006CN1786267A Method of chemical copper plating on hydregen storage alloy surface
06/14/2006CN1786266A Production technology of ceramic outer shell cover plate of crystal oscillator
06/14/2006CN1786265A Method of nickel sulfate solution system chemical nickel plating on magnesium alloy
06/14/2006CN1786264A Method of low temperature preparing C axle preferrel orientation titanium dioxide film
06/13/2006US7061257 Probe card assembly
06/13/2006US7060618 Semiconductor device, method for manufacturing the same, and plating solution
06/13/2006US7060421 Conductor track structures and method for production thereof
06/13/2006US7060349 Resin composition, process for producing the same and electrophotographic fixing member
06/13/2006US7060329 Patterned hydrophilic-oleophilic metal oxide coating and method of forming
06/08/2006WO2005073430A3 Apparatus for electroless deposition of metals onto semiconductor substrates
06/08/2006US20060122297 Photosensitive dispersion with adjustable viscosity for metal deposition on an insulating substrate and use of same
06/08/2006US20060121316 Method of fabricating a magnetic tag
06/08/2006US20060121249 Plated-polyester resin article and method for production thereof
06/08/2006US20060121180 Using electrochemical solution containing metal compound and bioactive materials; contacting substrate
06/08/2006US20060120940 Ceramic and method of manufacturing the same, dielectric capacitor, semiconductor device, and element
06/08/2006US20060117988 Ultra-bright passivated aluminum nano-flake pigments
06/08/2006DE102004008875B4 Anorganisches Pulver und Verfahren zur Oberflächenbeschichtung Inorganic powder and process for the surface coating
06/07/2006EP1667507A1 A multilayer printed circuit board and a process for manufacturing the same
06/07/2006EP1667506A1 Electroless plating solution, electroless plating process, and printed circuit board
06/07/2006EP1667505A1 Electroplating process and process for producing a circuit board by electroplating
06/07/2006EP1667504A1 Process for manufacturing a multilayer printed circuit board, and multilayer printed circuit board
06/07/2006EP1667250A1 Battery case-use surface-treated steel sheet, battery case and battery using it
06/07/2006EP1665360A2 Processes for fabricating conductive patterns using nanolithography as a patterning tool
06/07/2006EP1664381A1 Apparatus and method of detecting the electroless deposition endpoint
06/07/2006EP1251970A4 Method for preparation of thermally and mechanically stable metal/porous substrate composite membranes
06/07/2006CN1784508A Resin coating methoa added with heating process
06/07/2006CN1784507A Compositions for the currentless deposition of ternary materials for use in the semiconductor industry
06/07/2006CN1784506A Polytetrafluoroethylene dispersion for electroless nickel plating applications
06/07/2006CN1258618C Method of forming texture epitaxial film on metallic substrate
06/06/2006US7056448 Method for forming circuit pattern
06/06/2006CA2152447C Filled polyphthalamide blends having improved plating characteristics and plated articles therefrom
06/01/2006WO2006057372A1 Plated resin molding
06/01/2006WO2006057242A1 Method for reducing transition metal, and method for treating surface of silicon-containing polymer, method for preparing fine transition metal particles and method for producing article and wiring board, using the reducing method
06/01/2006WO2005073429A3 Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
06/01/2006US20060115670 Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same
06/01/2006US20060115636 comprises a transparent substrate, a fine line pattern comprises a metal plating film using a physically developed metal silver as a catalytic nucleus; high conductivity and a high total luminous transmittance with low cost and high productivity; protective devices
06/01/2006US20060113531 Semiconductor component and method for the production thereof
06/01/2006US20060113185 Plating apparatus
05/2006
05/31/2006EP1662020A1 Method for producing a copper thin film
05/31/2006EP1661826A1 Grounded fuel filler pipes
05/31/2006EP1661788A2 Steering wheel with stationary airbag-modul
05/31/2006EP1661160A2 Supercritical fluid-assisted deposition of materials on semiconductor substrates
05/31/2006EP1461345B1 Copper deposition using copper formate complexes
05/31/2006EP0913502B1 Method of electroplating nonconductive plastic molded product
05/30/2006US7053005 Method of forming a silicon oxide layer in a semiconductor manufacturing process
05/26/2006WO2006053405A1 Composite material
05/26/2006WO2004099459A8 Enhanced metal ion release rate for anti-microbial applications
05/25/2006US20060111470 Metal resin composite and process for producing the same
05/25/2006US20060110621 Corrosion resistant coatings and method of producing
05/25/2006US20060108232 Pretreatment method for electroless plating material and method for producing member having plated coating
05/24/2006CN1776014A Method for cladding honeycomb metal cobalt or cobalt alloy on nickel or nickel alloy powder surface
05/24/2006CN1776013A Supersonic spraying method for preparing vanadium pentoxide thin film
05/24/2006CN1776012A Method for preparing nano copper oxide on surface of SiO2
05/24/2006CN1776011A PST[(pB, sR)tIo3] and its Ba solution, Mg/Mn/K doping material system preparing method
05/24/2006CN1257311C Method for preparing nano zinc oxide film of high ultraviolet absorption
05/24/2006CN1257310C Fuzzy control film-coating process for electric heating film
05/24/2006CN1257309C Growth technology for nano composite aluminium oxidation film with high specific inductive constant
05/23/2006US7049234 Multiple stage electroless deposition of a metal layer
05/18/2006WO2006051876A1 Method for producing metal oxide film
05/18/2006WO2006051637A1 Electroless gold plating solution
05/18/2006WO2006050813A1 Use of polysilazanes for coating metal strips
05/18/2006WO2006050792A1 Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement
05/18/2006WO2005098087A3 Method for selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
05/18/2006US20060105243 Composite current collector
05/18/2006US20060102485 Electroless plating method, electroless plating device, and production method and production device of semiconductor device
05/17/2006EP1657324A1 Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement
05/17/2006EP1656471A1 Electrode for electrochemical processes and method for producing the same
05/17/2006EP1436445B1 Process for making thin film porous ceramic-metal composites and composites obtained by this process
05/17/2006CN1774304A Improved coating for silver plated circuits
05/17/2006CN1772950A No-palladium activating recipe for chemical nickel plating on plastic surface and its technological process
05/17/2006CN1772949A Laser induced selective chemical plating process
05/17/2006CN1772948A Laser induced selective chemical plating process for polyimide film
05/17/2006CN1256857C Method for producing copper-resin composite material
05/16/2006US7045461 reacting or mixing palladium (catalyst) with a silane-coupling agent; imidazole with glycidooxypropyltrimethoxysilane; electroless plating for powders, specular bodies, and resin fabrics
05/16/2006US7045006 stirring sol-gel including hydrolysates and condensates of metal oxides in the presence group VIII metal catalyst to form ferroelectric thin films
05/11/2006WO2006048211A2 Method for production of a substrate coated with a zeolite layer
05/11/2006WO2006020584A3 Silver-releasing articles and methods of manufacture
05/11/2006WO2005095671A3 Method for the production of iridium oxide coatings
05/11/2006US20060099438 Metal plating structure and method for production thereof
05/11/2006US20060099409 providing an alcohol solution of an alcohol-soluble metal salt and an alcohol solution of an amine compound, mixing and stirring the two alcohol solutions with an inorganic powder and water, thus coating the surface of inorganic powder with a metal hydroxide produced from the alcohol-soluble metal salt
05/11/2006US20060099328 Creating layers in thin-film structures
05/11/2006DE112004001309T5 Verfahren zur Herstellung einer Vorläufer-Lösung für die metallorganische Abscheidung unter Verwendung eines supraleitenden Oxids und ein Dünnschicht-Supraleiter A process for preparing a precursor solution for metal organic deposition using a superconducting oxide superconductor and a thin film-
05/10/2006EP1587967B1 Photosensitive dispersion with adjustable viscosity for metal deposition on an insulating substrate and use of same
05/10/2006EP1257690B1 A method for providing a protective coating for carbonaceous components of an electrolysis cell
05/10/2006EP1117283B1 Printed wiring board and its manufacturing method
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