Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
02/2007
02/21/2007CN1916235A Method for preparing composite film of silver Nano granule / titanium dioxide
02/20/2007US7179742 Interconnect circuitry, multichip module, and methods for making them
02/20/2007US7179741 Electroless plating method and semiconductor wafer on which metal plating layer is formed
02/20/2007US7179537 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
02/20/2007US7179359 Cup-shaped plating apparatus
02/15/2007WO2007018144A1 Doctor blade
02/15/2007DE10229001B4 Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche A method and system for controlling the distribution of ions during the galvanic depositing a metal on a workpiece surface
02/15/2007DE102005038208A1 Herstellung von Silberschichten Preparation of silver layers
02/14/2007EP1752167A2 Resorbable implant with titanium coating
02/14/2007EP1751328A2 Selective catalytic activation of non-conductive substrates
02/14/2007EP1178493B1 Ceramic capacitor electrode-forming paste
02/14/2007CN1914353A Formation of layers on substrates
02/14/2007CN1912190A Method for conduction high polymer pattern sedimentation on surface of plastic
02/14/2007CN1912181A Regeneration apparatus and regeneration method for electroless plating
02/14/2007CN1912180A Preparation method of chemical nickeling phosphorus alloy film
02/14/2007CN1300385C Method for recycling of plating solutions
02/14/2007CN1299840C Process for plating particulate matter
02/08/2007US20070031599 Use of dissolved hafnium alkoxides or zirconium alkoxides as precursors for hafnium oxide and hafnium oxynitride layers or zirconium oxide and zirconium oxynitride layers
02/07/2007EP1749904A2 Planar resistance heating element and manufacturing method thereof
02/07/2007CN1910305A Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
02/07/2007CN1910013A Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components
02/07/2007CN1908231A Method of fast growing HA biologically active layer from oxidation film on titanium alloy surface by ultraviolet excitation
02/07/2007CN1908229A Preparation method of manganese-cobalt-nickel thin film heat-sensitive material
02/07/2007CN1299548C Method for metal coating of substrates
02/06/2007US7173509 Core having superior end face insulation and method of treating core end faces to give insulation coating
02/06/2007US7173180 Coating a silica semiconductive layer with a starting mixture comprising a polysilane or silane compound, silicon particles, and doping; heating and/or light in containing oxygen and/or ozone, or oxygen-free; silicon hydride-free; safe, easy to handle
02/06/2007US7172979 Substrate processing apparatus and method
02/06/2007US7172785 Process for deposition of metal on a surface
02/06/2007CA2397821C A method for providing a protective coating for carbonaceous components of an electrolysis cell
02/01/2007CA2620514A1 Substrate with spatially selective metal coating method for production and use thereof
01/2007
01/31/2007CN1906705A Conductive fine particle and anisotropic conductive material
01/31/2007CN1906526A Method for gravure printing transparent electrodes, and ink composition therefor
01/31/2007CN1904138A Preparation method of Sb2S3 thermal electric film
01/31/2007CN1297693C Method for producing molded goods plating
01/30/2007US7169703 Forming an adsorbed molecular layer of organometallic compound on the layer-stacked plate, reducing the concentration of the organometallic compound in the gas, light irradiation against a selected region to form the metallization area, removing compound from non-selected area; integrated circuits
01/30/2007US7169443 Preventing corrosion by suspending the base particle in a buffer solution having in a neutral or alkaline state, a pH of from 7.0 to 12.0; hydrogen peroxide-ammonia mixture solution containing peroxytitanic acid
01/30/2007US7169222 Transparent carrier with pigments of lead formed by hydrolysis, drying to form metal oxides and roasting to form pigment oxides for agriculturedielectrics
01/30/2007US7169216 Electroless copper plating solution, electroless copper plating process and production process of circuit board
01/30/2007US7169215 Copper molybdenum electroless deposition process and materials
01/25/2007WO2007010966A1 Method for improving adhesiveness of electroless copper plating film
01/25/2007WO2007010760A1 Plating solution for electroless palladium plating
01/25/2007US20070020387 Facture of shining keyboard and mouse
01/25/2007DE10218077B4 Verfahren zum Aufbringen einer Kupferplattierungsschicht auf einem dielektrischen keramischen Substrat Method for applying a copper plating layer on a dielectric ceramic substrate
01/24/2007EP1416469B1 Chord winder for stringed instrument
01/24/2007CN1902755A Electrical connection of components
01/24/2007CN1902550A Composition for forming nitride coating film for hard mask
01/24/2007CN1900361A Process for preparing neodymium-iron-boron permanent magnetic material surface gradient function coating layer
01/24/2007CN1900360A Process for preparing magnesium alloy surface function gradient film
01/24/2007CN1900358A Apparatus for electroless deposition of metals onto semiconductor substrates
01/24/2007CN1900357A Process for local chemical plating long pipe surface
01/24/2007CN1296976C Low temperature liquid-phase deposition method and cleaning method of liquid phase deposition equipment
01/23/2007US7166152 Pretreatment silver compound; using metal alloy catalyst
01/18/2007WO2007008218A2 High aspect ratio metal particles and methods for forming same
01/18/2007WO2007007790A1 Wear-resistant member and power transmission component
01/18/2007WO2007007617A1 Surface treatment in presence of organic solvent
01/18/2007WO2007006338A1 Electroless niwp adhesion and capping layers for tft copper gate process
01/18/2007US20070015367 Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
01/18/2007US20070014923 Method of Electroless Deposition of Thin Metal and Dielectric Films with Temperature Controlled Stages of Film Growth
01/18/2007DE19536019B4 Verfahren zur Herstellung von feinen diskreten Metallstrukturen und seine Verwendung A process for the production of fine discrete metal structures and its use
01/18/2007DE102006025683A1 Method of applying catalytically active material, directly to heat exchanger internal surfaces without use of a carrier layer uses streamless deposition (ELP) or chemical gas phase deposition (CVD)
01/17/2007EP1744233A1 Regeneration apparatus and regeneration method for electroless plating
01/17/2007EP1742991A1 Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material
01/17/2007CN1898413A Formation of layers on substrates
01/17/2007CN1896311A Direct composite method for coating magnesium-alloy surface with nano-titanium dioxide
01/17/2007CN1896310A Magnesium or its alloy chemical nickeling liquid
01/17/2007CN1896309A Direct chemical nickeling process for pressed-cast aluminum alloy
01/17/2007CN1896308A Chemical nickeling liquid and its process
01/17/2007CN1896307A Copper-alloy chemical nickeling process
01/17/2007CN1295790C Heavy current medium film and its manufacturing method, heavy-current medium storage, piezoelectric element
01/16/2007US7163915 Aqueous solutions containing dithionic acid and/or metal dithionate for metal finishing
01/16/2007US7163835 Method for producing thin semiconductor films by deposition from solution
01/11/2007WO2007004437A1 SILVER β-KETOCARBOXYLATE, MATERIAL COMPRISING THE SAME FOR FORMING SILVER METAL, AND USE THEREOF
01/11/2007WO2007003828A2 Sol for sol-gel process coating of a surface and coating method by sol-gel process using same
01/11/2007WO2007003223A1 Method and apparatus for forming a noble metal layer, notably on inlaid metal features
01/11/2007CA2610244A1 Sol for sol-gel process coating of a surface and coating method by sol-gel process using same
01/10/2007EP1741495A1 Method to obtain a composite material having a catalytic bonding layer
01/10/2007CN2855553Y Nanometer film type coating film machine
01/10/2007CN1894772A Substrate holding apparatus, substrate holding method, and substrate processing apparatus
01/10/2007CN1894438A Method and system for forming a film of material using plasmon assisted chemical reactions
01/10/2007CN1894192A Copper(I) formate complexes
01/10/2007CN1891899A Methods and fabrics for combating nosocomial infections
01/10/2007CN1891673A Method for preparing diamond film surface metal patternization
01/10/2007CN1294662C Bipolar laminated unit electrochemical battery
01/10/2007CN1294626C Method for forming silicon film and ink composition for ink jet
01/09/2007US7161794 Component formation via plating technology
01/09/2007US7160582 Chemical vapor deposition of nickel from autocatalytic bath with electroconductive surface, to form sulfur-free protective coating for aircraft turbine blades against corrosion, oxidation and high temperatures; heat treament
01/09/2007US7159421 Manufacture of planar waveguides using sol-gel techniques
01/04/2007WO2007000833A1 Method for electrically conductive circuit formation
01/04/2007US20070004200 Selective activation of aluminum, copper, and tungsten structures
01/04/2007US20070003772 Method for metallizing a component comprising parts of different non-metallic materials
01/04/2007US20070003699 Transparent coating films
01/03/2007EP1330558B1 Leadfree chemical nickel alloy
01/03/2007EP1297200B1 Activation of a cathode
01/03/2007EP1251970B1 Method for preparation of thermally and mechanically stable metal/porous substrate composite membranes
01/03/2007CN1890401A Selective self-initiating electroless capping of copper with cobalt-containing alloys
01/03/2007CN1889983A Silver coatings and methods of manufacture
01/03/2007CN1888134A Functional molybdate film and its prepn
01/03/2007CN1887444A Thermal decomposing nozzle for ultrasonic spraying
01/02/2007US7157415 Post etch cleaning composition for dual damascene system
01/02/2007US7157370 Semiconductor device and method for manufacturing the same
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