| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 05/21/1997 | CN1150184A Bronze plating bath and preparing process thereof |
| 05/20/1997 | US5631091 Immersion plating for coating bismuth on copper using bismuth salt and iodide |
| 05/20/1997 | US5630933 Electrolysis of water |
| 05/20/1997 | US5630872 Formation of thin-film patterns of a metal oxide |
| 05/15/1997 | WO1997008287A3 Polyamino monosuccinic acid derivative degradable chelants, uses and compositions thereof |
| 05/14/1997 | EP0773309A1 Electroless/electrolytic methods for the preparation of metallized ceramic substrates |
| 05/14/1997 | EP0772883A1 Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom |
| 05/14/1997 | EP0772771A1 Determining biodegradability of aspartic acid derivatives, degradable chelants, uses and compositions thereof |
| 05/14/1997 | CN1034882C Bellows used in expansion joint and flexible metal tubing |
| 05/09/1997 | WO1997016866A2 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices |
| 05/02/1997 | EP0770705A1 Electroless plating method, and method and apparatus for producing stamper |
| 05/02/1997 | EP0770265A1 Integrated circuit capacitors and process for making the same |
| 05/01/1997 | WO1997015703A2 Conveyor device for vertically guiding plate-like objects for chemical or electrolytic surface-treatment |
| 04/30/1997 | DE19645148A1 Vorrichtung zur Steuerung der Konzentration einer Mehrkomponenten-Plattierungslösung An apparatus for controlling the concentration of a multicomponent plating solution |
| 04/29/1997 | US5624707 Method of forming ABO3 films with excess B-site modifiers |
| 04/29/1997 | US5624480 Plating bath containing ions of nickel, iron, cobalt, phosphate, and sulfate and organic acid |
| 04/29/1997 | US5624479 Solution for providing catalytically active platinum metal layers |
| 04/24/1997 | DE19642922A1 Hydrophilic catalytic solution for producing patterned film on substrate prior to electroless coating |
| 04/24/1997 | DE19639174A1 Electroless nickel plating bath |
| 04/23/1997 | EP0769572A1 Electroless nickel cobalt phosphorous composition and plating process |
| 04/23/1997 | EP0769206A1 Thin film of abo 3? with excess a-site and b-site modifiers and method of fabricating integrated circuits with same |
| 04/23/1997 | EP0769081A1 Method of coating metal surfaces with copper or copper alloys |
| 04/23/1997 | EP0698130B1 Process for the deposition of palladium layers |
| 04/22/1997 | US5622896 Method of manufacturing a thin silicon-oxide layer |
| 04/22/1997 | US5622746 Tantalum capacitor impregnation process |
| 04/17/1997 | WO1997014181A1 Process for the production of semi-insulating iron-doped indium phosphide wafers |
| 04/15/1997 | US5620739 Thin film capacitors on gallium arsenide substrate and process for making the same |
| 04/09/1997 | EP0767257A2 Process for manufacturing integrated electrodes in plastic moulds, plastic moulds with integrated electrodes and its use |
| 04/09/1997 | EP0766803A2 Apparatus and method for inhibiting the leaching of lead in water |
| 04/03/1997 | DE19536019A1 Prodn. of fine discrete metal structures, esp. wires or foils |
| 04/02/1997 | EP0765413A1 A process for making electroless plated aramid surfaces |
| 04/01/1997 | US5616422 Metallized substrate |
| 04/01/1997 | US5616202 Enhanced adhesion of H-resin derived silica to gold |
| 03/26/1997 | EP0708847B1 Method for metallising non-conductive substrates |
| 03/26/1997 | EP0569585B1 Process for producing immersion member of molten metal bath |
| 03/25/1997 | US5614271 Baking polysilazane coating |
| 03/25/1997 | US5614252 Integrated circuits |
| 03/25/1997 | US5614018 Doped barium strontium titanate layer |
| 03/25/1997 | US5614004 Thallium compound |
| 03/25/1997 | US5614003 Method for producing electroless polyalloys |
| 03/25/1997 | CA2095652C Molded metallized plastic microwave components and processes for manufacture |
| 03/20/1997 | WO1997010282A1 Beta-substituted organosilsesquioxanes and use thereof |
| 03/20/1997 | WO1997010185A1 Titanium dioxide-based photocatalytic coating substrate, and titanium dioxide-based organic dispersions |
| 03/20/1997 | WO1996038858A3 Method and probe card for testing semiconductor devices |
| 03/19/1997 | EP0763150A1 Catalytic, crosslinked polymeric films for electroless deposition of metal |
| 03/18/1997 | US5612082 Metal oxide thin films used in integrated circuits |
| 03/18/1997 | US5611823 Method for fabricating a battery electrode |
| 03/18/1997 | CA2104224C Piston-based ventilator design and operation |
| 03/12/1997 | EP0761842A1 EMI shield and a method of forming the same |
| 03/11/1997 | US5609767 Precipitation |
| 03/06/1997 | WO1997008288A1 Succinic acid derivative degradable chelants, uses and compositions thereof |
| 03/06/1997 | WO1997008287A2 Polyamino monosuccinic acid derivative degradable chelants, uses and compositions thereof |
| 03/06/1997 | DE19634616A1 Prodn. of titanium@-aluminium@ part |
| 03/06/1997 | CA2230275A1 Polyamino monosuccinic acid derivative degradable chelants, uses and compositions thereof |
| 03/05/1997 | EP0595844B1 Sol gel composition for producing glassy coatings |
| 02/27/1997 | WO1997007554A1 Method of manufacturing electrodes for chemical current sources |
| 02/27/1997 | WO1997007546A1 Metal insulator semiconductor structure with polarization-compatible buffer layer |
| 02/27/1997 | DE19627413C1 Continuous, uniform metallisation of process materials |
| 02/27/1997 | CA2228608A1 Metal insulator semiconductor structure with polarization-compatible buffer layer |
| 02/26/1997 | EP0759329A2 Cyanate ester films that promote plating adhesion to cyanate ester graphite composites |
| 02/25/1997 | US5605742 Metal material formed with fluorocarbon film, process for preparing the material and apparatus made with use of the material |
| 02/25/1997 | US5605565 Process for attaining metallized articles |
| 02/20/1997 | DE19539868C1 Transport device for transport plate-like objects, esp. circuit boards for electroplating |
| 02/18/1997 | US5603768 Flow-inducing panels for electroless copper plating of complex assemblies |
| 02/13/1997 | WO1997005192A1 Plated molding and process for preparing plated moldings |
| 02/11/1997 | US5602060 Applying solution of polycarbosilane in solvent onto substrate bearing electrically conductive components, curing in oxidizing atmosphere to covert to silicon oxide layer |
| 02/11/1997 | US5601869 Producing thin film metal oxide by reacting metal alkoxycarboxylate with metal carboxylate or alkoxide to form bimetallic complex, adding octane solvent, coating integrated circuit substrate with mixture, annealing |
| 02/11/1997 | US5601740 Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires |
| 02/11/1997 | US5601695 Etchant for aluminum alloys |
| 02/11/1997 | US5601637 Comprising reduction controllers |
| 02/05/1997 | EP0756718A1 Electrochromic thin-film systems and components thereof |
| 02/05/1997 | CN1142252A Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| 02/05/1997 | CN1142204A Ammonia-free deposition of copper by disproportionation |
| 02/04/1997 | US5599592 Irradiation plastic piece surface with excimer laser, immersing irradiated piece into electroless plating metal bath, free of palladium to form metal film, heat treating metal film to diffuse metal film in plastic piece |
| 01/30/1997 | WO1996040425A3 Improved uniformly plated microsphere catalyst |
| 01/29/1997 | EP0730500A4 Ammonia-free deposition of copper by disproportionation |
| 01/22/1997 | EP0754249A1 Use of a compound |
| 01/22/1997 | CN1033867C Ethylenethiourea wear resistant electroless nickel-boron coating compositions |
| 01/21/1997 | US5595943 Cathode reaction inhibitor |
| 01/21/1997 | US5595787 Chemical metallization of electrically non-conducting porous substrates |
| 01/15/1997 | EP0753896A2 Process involving metal hydrides |
| 01/15/1997 | EP0665814B1 Precursors and processes for making metal oxides |
| 01/15/1997 | CN1140208A Plating on nonmetallic disks |
| 01/14/1997 | US5593739 Method of patterned metallization of substrate surfaces |
| 01/14/1997 | US5593495 Method for manufacturing thin film of composite metal-oxide dielectric |
| 01/08/1997 | EP0752019A1 Alkaline composition for tin immersion coating |
| 01/07/1997 | US5591488 Pretreatment of polymer surfaces prior to metallization,aliphatic diols |
| 01/02/1997 | EP0751238A2 A method of adhering silica to gold |
| 01/02/1997 | EP0750549A1 Bismuth coating protection for copper |
| 01/01/1997 | CN1033709C Process for roll plating of non-metallic surface |
| 12/31/1996 | US5589255 Adhesive for electroless plating, printed circuit boards and method of producing the same |
| 12/27/1996 | EP0749500A1 Method of manufacturing a thin silicon-oxide layer |
| 12/19/1996 | WO1996041040A1 Etchant for aluminium alloys |
| 12/19/1996 | WO1996040425A2 Improved uniformly plated microsphere catalyst |
| 12/19/1996 | CA2223540A1 Improved uniformly plated microsphere catalyst |
| 12/19/1996 | CA2195878A1 Etchant for aluminium alloys |
| 12/18/1996 | CN1033593C Method and apparatus for chemical plating outside bath |
| 12/17/1996 | US5585142 Method for preparing conductive electrochemically active material |
| 12/17/1996 | US5585136 Method for producing thick ceramic films by a sol gel coating process |
| 12/11/1996 | EP0747507A1 Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |