Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910)
07/2004
07/28/2004CN1516727A Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus
07/28/2004CN1159401C Conductive binding belt
07/22/2004WO2004060996A1 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body
07/15/2004DE10258984A1 Heat-activatable adhesive film for implanting electrical modules in cards, e.g. bank cards, contains vinyl-aromatic block copolymer and tackifying resin with a relatively high softening point
07/15/2004DE10258961A1 Electrically-conductive adhesive film for implanting electrical modules in cards e.g. smart cards, contains elastomeric polymer, resins and conductive particles in which the conductive metal is not more noble than copper
07/13/2004US6762249 Rapid low temperature setting; high adhesion, stress releaving polyurethane resin, free radical polymerizable material and curing agent
07/13/2004US6761978 Polyamide and conductive filler adhesive
07/13/2004US6760969 Method for connecting electrical components
07/08/2004WO2004056933A1 Self-adhesive article with at least one layer of a thermally-conducting adhesive mass and method for production thereof
07/08/2004WO2004056932A1 Self-adhesive article comprising at least one layer made from a thermally-conducting adhesive mass and method for production thereof
07/08/2004DE10259549A1 Haftklebeartikel mit wenigstens einer Schicht aus einer elektrisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung Adhesive products with at least one layer of an electrically conductive pressure sensitive adhesive and method for its manufacture
07/08/2004DE10259451A1 Haftklebeartikel mit wenigstens einer Schicht aus einer thermisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung Adhesive products with at least one layer of a thermally conductive PSA and method for its manufacture
07/08/2004DE10258959A1 Kunststofffolie Plastic film
07/07/2004CN1510092A Connecting materials
07/07/2004CN1156550C Single-component organic heat-conducting daub
07/01/2004WO2004056156A1 Plastic film
07/01/2004WO2004055126A1 Anisotropic-electroconductive adhesive, circuit connection method and structure using the same
07/01/2004WO2004055058A1 Process for producing resin particle and process for producing anisotropically conductive adhesive
07/01/2004US20040127626 capable of forming or bonding low-resistance electrodes; silver powder as a conductive agent
06/2004
06/24/2004US20040121139 Composition for preparing porous dielectric thin film containing saccharides porogen
06/23/2004CN1154516C Adhesive for secure topical attachment to skin and comfortable removal
06/23/2004CN1154515C Adhesive for secure topical attachment to skin and comfortable removal
06/17/2004WO2004050783A1 Glue line use of bifenthrin in wood products
06/17/2004DE10255893A1 Method for heating, by means of an alternating electromagnetic field, a material containing magnetic particles involves alignment of the magnetic axes of these particles
06/17/2004CA2507931A1 Glue line use of bifenthrin in wood products
06/16/2004EP1427453A1 Antimicrobial adhesive and coating substance and method for the production thereof
06/16/2004CN1505672A Method for adhering substrates using light activatable adhesive film
06/15/2004US6749774 Conductive adhesive and connection structure using the same
06/09/2004EP1425759A1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof
06/09/2004EP1425358A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
06/02/2004CN1500846A Composition for preparing porous dielectric thin film containing saccharides porogen
05/2004
05/27/2004WO2004045027A1 Anisotropic conductive adhesive and film
05/27/2004WO2004001844A3 Thermal interface materials and methods for their preparation and use
05/26/2004EP1303571B1 Polyimide hybrid adhesives
05/26/2004CN1499166A Method for filling up slots between heat conductive parts as well as structure of part
05/25/2004US6740192 Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane
05/19/2004EP0679312B1 An information transmission system for increasing the effective rate of transfer of information
05/12/2004EP1417096A1 Optical adhesive coating having low refractive index
05/11/2004US6733787 Applying to defect a biocompatible, bioerodable, adhesive water soluble polymer
05/11/2004US6733695 Silver powder and thermosetting resin
05/06/2004EP1416501A2 Composition for preparing porous dielectric thin film containing saccharides porogen
05/06/2004EP1414896A1 Optically clear and antistatic pressure sensitive adhesives
05/05/2004CN1148696C High-reliability touch panel
04/2004
04/29/2004WO2004036555A1 Conductive adhesive for magnetic head assembly
04/29/2004US20040079478 Adhesives for vehicle body manufacturing
04/28/2004CN1492449A Electrode member
04/28/2004CN1492004A Process for preparing silver plated quartz powder for conductive adhesive
04/22/2004WO2003071596A3 Electronic component with an adhesive layer and method for the production thereof
04/21/2004EP1196509B1 Hot-melt-type adhesive in the form of a granulate
04/21/2004CN1146647C Anisotropic conductive adhesive and method for preparation thereof and electronic apparatus using said adhesive
04/15/2004US20040070881 Conductive adhesive for magnetic head assembly
04/14/2004EP1407320A1 Electro-optic display and adhesive composition
04/14/2004CN1145430C Flame retardant fastener and method for making same
04/07/2004CN1487039A Stripping adhesive compositeon
04/06/2004US6716527 Hot-melt-type adhesive in the form of a granulate
04/01/2004WO2004026984A1 Method of adhesion of conductive materials, laminate, and adhesive composition
04/01/2004WO2004026574A1 Method of producing laminates, and laminates
03/2004
03/31/2004EP1153985B1 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
03/31/2004CN1485252A Compound vessel and adhesive for use, decomposition method for cpmpound vessel
03/25/2004US20040058150 Triboluminescent materials in adhesive compositions for use in adhesive tape
03/25/2004US20040056240 Adhesive
03/24/2004EP1400576A1 Adhesive
03/24/2004EP1399519A1 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents
03/24/2004CN1483782A Adhesive
03/24/2004CN1483781A Water-proof environment protection adhesive glue and productive method thereof
03/23/2004US6710261 Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board
03/18/2004WO2004022663A1 Conductive adhesive and circuit comprising it
03/17/2004CN1142555C Thermal and electric graphite-base conductor
03/16/2004US6706136 Resin composition for high-frequency bonding
03/11/2004WO2003072673A3 Adhesive compositions containing organic spacers and methods for use thereof
03/11/2004US20040047985 Use of a pressure sensitive adhesive possessing anisotropic properties for producing punched products
03/11/2004DE20320000U1 Adhesive bond formed between flat surfaces, e.g. two layers of paper, includes encapsulated aromatic material in detachable adhesive layers
03/11/2004DE20317875U1 Electrically conductive adhesive surfaces for electrically conductive adhesive tapes and similar items are obtained by use of an adhesive with embedded ultra-thin conductive fibers or fiber sections
03/10/2004CN1481038A Electrical conduction agent for alkali manganese cell and its production method
03/09/2004US6703463 Transparent polymer of a fluoroalkyl acrylate; good solubility; low glass transition temperature; transfer tapes
03/04/2004US20040041257 Adhesion method and electronic component
03/04/2004US20040041131 Electroconductive silicone pressure-sensitive adhesive composition
03/03/2004EP1141160B1 Water-swellable hot-melt-type adhesive
03/02/2004US6699929 Die attach adhesives with vinyl ether and carbamate or urea functionality
02/2004
02/25/2004CN1478285A Electroconductive metal paste
02/19/2004DE20315226U1 Dämmender geschäumter Werkstoff Insulating foamed material
02/12/2004US20040029992 Mixture of polymer and filler
02/12/2004US20040026028 Ferrogmagnetic resonance excitation and its use for heating substrates that are filled with particles
02/11/2004EP1194931B1 Water-borne ceramer compositions and antistatic abrasion resistant ceramers made therefrom
02/11/2004EP1169138B1 Electrically conductive coatings applied by internally charged electrostatic sprayers
02/11/2004CN1473903A Water soluble fire-proof adhesive
02/05/2004WO2002062915A8 Paper products containing triboluminescent materials
02/05/2004US20040024107 Containing carbon black and a plate-like or pillar-like electroconductive powder in given parts by weight; belt has medium resistivity, little non-uniformity, and high insulating reliability
02/05/2004US20040023022 Cushion layer arranged between heat sealing layer, which is conductive acicular fine particles dispersed in a synthetic resin, and an outer layer, formed by a biaxially oriented film
02/04/2004EP1171522B1 Bushing with electrically conductive paste
01/2004
01/28/2004EP0982385B1 Adhesive, method for bonding, and assemblies of mounted boards
01/28/2004CN1471566A Use of self-adhesive materials having anisotropic properties for producing stamping products
01/28/2004CN1470588A Microconductive powder suitable for preparing anisotropic conductive rubber composition
01/28/2004CN1470586A Laser self-adhesive film and its production process
01/22/2004US20040014875 Color-changing wallpaper adhesive primer/activator
01/22/2004US20040012622 Color-changing wallpaper adhesive primer/activator
01/22/2004US20040012098 Conductor bodies attached adhesive sheet, process for producing semiconductor device and semiconductor device
01/21/2004EP1382653A1 Color-changing wallpaper adhesive and primer composition
01/21/2004CN1468925A Production process of cold water soluble environment protecting glue powder
01/20/2004US6680007 Suitable for use in electrical and mechanical connection of electronic parts as a substitute for the existing solder; adhesion, heat resistance, moisture resistance, flexibility and impact resistance
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