Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910) |
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11/08/2000 | EP1050888A1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
11/08/2000 | CN1272866A Blended pressure-sensitive adhesives |
11/02/2000 | EP1047730A1 Polymer composition for use as aqueous floor adhesive |
10/31/2000 | US6140402 Comprising organic polymer resin, inorganic filler and fugitive liquid which can be used for die attach applications |
10/19/2000 | WO2000061302A2 Electrically conductive coatings applied by internally charged electrostatic sprayers |
10/19/2000 | WO2000036039A3 Pressure-sensitive adhesive compositions and pressure-sensitive adhesive label constructions exhibiting low adhesive residue in printers |
10/19/2000 | CA2365852A1 Electrically conductive coatings applied by internally charged electrostatic sprayers |
10/12/2000 | WO2000060614A1 Anisotropically conductive paste |
10/12/2000 | WO2000059998A1 Electrically conductive forming paste |
10/12/2000 | WO2000059715A1 Multi functional electrically and thermally conductive adhesive tape |
10/11/2000 | EP1043377A2 Hot melt adhesives based on sulfonated polyesters comprising wetness indicator |
10/11/2000 | CN1269585A 导电糊 Conductive paste |
10/03/2000 | US6126865 Polyacrylic ester; hook and loop fasteners |
10/02/2000 | CA2303637A1 Label adhesive with dispersed refractive particles |
09/27/2000 | CN1267891A Conducting and resistance material with electrical stability using for electronic equipment |
09/26/2000 | US6123799 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
09/13/2000 | CN1056399C Electrically conductive adhesive compositions |
09/05/2000 | US6114494 Polyimide material and method of manufacture |
09/05/2000 | CA2151581C An information transmission system for increasing the effective rate of transfer of information |
08/31/2000 | WO2000051138A1 Conductive electrolessly plated powder, its producing method, and conductive material containing the plated powder |
08/30/2000 | EP1032038A2 Conductive and resitive material with electrical stability for use in electronics devices |
08/30/2000 | EP0886672B1 Methods of making viscoelastic compositions |
08/29/2000 | US6111005 For bonding high density, microcircuit electronic components to substrates |
08/29/2000 | US6110399 Electroconductive solder particles dispersed in ferrofluid; magnetic field fixes pattern |
08/15/2000 | US6103812 A thermoplastic or thermoset polymer comprising a mixture of first and second microwave susceptible fibers to increase microwave adsorption within polymer composition |
08/10/2000 | WO2000046315A1 Adhesive, electrode-connecting structure, and method of connecting electrodes |
08/09/2000 | EP1025179A1 Labelling method with an aqueous polyacrylic preparation |
08/02/2000 | EP1023416A1 Blended pressure-sensitive adhesives |
08/01/2000 | CA2089160C Photo-activated, micro-capsulated thread locking composition |
07/26/2000 | EP1021165A1 Bioerodable polymeric adhesives for tissue repair |
07/26/2000 | CN1261090A Absorbing hot-melted adhesive |
07/20/2000 | WO2000042114A1 Luminescent electroconductive adhesive |
07/19/2000 | EP1019105A1 Polar, lipophilic pressure-sensitive adhesive compositions and medical devices using same |
07/13/2000 | WO2000040648A1 Heat debondable adhesive composition and adhesion structure |
07/06/2000 | WO2000039234A1 Method for fabricating an optical device using purified adhesives in the optical path |
07/06/2000 | WO2000039232A1 Water-swellable hot-melt-type adhesive |
07/06/2000 | CA2357773A1 Method for fabricating an optical device using purified adhesives in the optical path |
07/04/2000 | US6084018 Pulverulent adhesive |
06/29/2000 | DE19859728A1 Wasserquellbarer Schmelzklebstoff A water-melt adhesive |
06/28/2000 | EP1013291A1 Hot melt adhesive comprising an absorbent |
06/27/2000 | US6080443 Method for production of microcapsule type conductive filler |
06/22/2000 | WO2000036043A1 Removable emulsion pressure-sensitive adhesives |
06/22/2000 | WO2000036041A1 Repositionable microsphere adhesive coated article |
06/22/2000 | WO2000036039A2 Pressure-sensitive adhesive compositions and pressure-sensitive adhesive label constructions exhibiting low adhesive residue in printers |
06/22/2000 | CA2355116A1 Removable emulsion pressure-sensitive adhesives |
06/22/2000 | CA2350926A1 Repositionable microsphere adhesive coated article |
06/02/2000 | WO2000031199A1 A pressure-sensitive adhesive laminate, a method and a device for modifying an initial release force in such a laminate |
06/02/2000 | CA2351367A1 A pressure-sensitive adhesive laminate, a method and a device for modifying an initial release force in such a laminate |
05/31/2000 | CN1254744A Electrically conducting adhesive, structural body for installation, LCD, electronic device and making method |
05/17/2000 | EP1000993A1 Ultraviolet-curing composition, optical disk, and method of producing optical disk |
05/16/2000 | US6063838 Marking for paving |
05/11/2000 | WO2000026923A1 Electrically conductive and optically transparent material, method for producing the same and its use |
05/11/2000 | WO2000013190A8 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
05/11/2000 | DE19905125A1 Elektrisch leitfähiges und optisch transparentes Material, Verfahren zu dessen Herstellung und Verwendung desselben Of the same electrically conductive and optically transparent material, process for its preparation and use |
04/27/2000 | WO2000024005A1 Particles |
04/26/2000 | EP0995784A1 Adhesive for semiconductor components |
04/19/2000 | EP0994171A2 Light-blocking anisotropically electroconductive adhesive film, and liquid crystal display device |
04/19/2000 | EP0994170A2 Lightweight adhesive |
04/18/2000 | CA2009570C Electrotransport adhesive |
03/28/2000 | US6042940 Solid adhesive |
03/28/2000 | US6042894 Anisotropically electroconductive resin film |
03/21/2000 | US6040352 Free radical polymerization process using a monochromatic radiation source |
03/21/2000 | US6039896 Resins, organic peroxide, thermoplastic elastomers and phosphoric esters |
03/15/2000 | EP0904329B1 Temperature-responsive adhesive article |
03/09/2000 | WO2000013190A1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
03/08/2000 | EP0984051A1 Heat-resistant adhesives and semiconductor devices produced therewith |
03/01/2000 | EP0982385A1 Adhesive, method for bonding, and assemblies of mounted boards |
03/01/2000 | CN1246064A Adhesive for secure topical attachment to skin and comfortable removal |
03/01/2000 | CN1246062A Adhesive for secure topical attachment to skin and comfortable removal |
03/01/2000 | CN1246061A Adhesive for secure topical attachment to skin and comfortable removal |
03/01/2000 | CN1246060A Adhesive for secure topical attachement to skin and comfortable removal |
02/24/2000 | WO2000009623A1 Adhesive for bonding circuit members, circuit board, and method of producing the same |
02/23/2000 | CN1245521A Thermally conductive pressure-sensitive adhesive and adhesive sheet containing same |
02/16/2000 | CN1244561A Small graniness adhesive composition for micro electronic device |
02/16/2000 | CN1244558A High-temperature conductive inorganic adhesive and its compounding process |
02/09/2000 | CN1243853A Adhesive with high solid content |
02/08/2000 | US6022616 Adhesive composition with small particle size for microelectronic devices |
02/03/2000 | DE19833847A1 Breaking adhesive joints involves photochemical or thermal degradation of adhesive, liberation of gas from additives, inhibition of adhesion by complexing agents or embrittlement by crosslinking |
02/02/2000 | EP0976803A1 Very high solids adhesive |
02/02/2000 | EP0976802A1 Ultraviolet curing pressure-sensitive adhesive sheet |
02/02/2000 | CN1243142A Conductive adhesive tape and cathod ray tube using same |
02/01/2000 | US6020059 Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
01/30/2000 | CA2268017A1 Very high solids adhesive |
01/26/2000 | CN1242403A Anisotropic conductive adhesive and method for preparation thereof and electronic apapratus using said adhesive |
01/18/2000 | US6015509 Composition containing a polymer and conductive filler and use thereof |
01/13/2000 | WO2000001782A1 Electroconductive, thermoplastic and heat-activated adhesive film |
01/12/2000 | EP0971011A2 Adhesive composition and adhesive sheet |
01/12/2000 | EP0970710A1 Hygienic article comprising oil resistant, hydrophilic adhesive |
01/06/2000 | WO2000000563A1 Fine pitch anisotropic conductive adhesive |
01/06/2000 | WO2000000230A1 Hygienic article comprising hydrophilic adhesive |
01/06/2000 | WO2000000229A1 Hygienic article comprising oil resistant, hydrophilic adhesive |
01/06/2000 | CA2333718A1 Hygienic article comprising oil resistant, hydrophilic adhesive |
01/05/2000 | EP0793695B1 Damping constructions comprising at least one layer of a viscoelastic material applied to a vibratory solid article |
01/05/2000 | DE19930490A1 Leitendes Klebeband und Kathodenstrahlröhre mit einem derartigen Klebeband Conductive tape and the cathode ray tube having such a tape |
01/05/2000 | DE19912628A1 Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie Electrically conductive, thermoplastic and heat-activatable adhesive film |
01/05/2000 | CN1240470A Die attach adhesive compositions |
01/05/2000 | CN1240469A Anisotropic conductive adhesive compositions |
12/29/1999 | EP0966977A2 Hygienic article comprising hydrophilic adhesive having low surfactant release |
12/21/1999 | US6005039 Composite pressure sensitive hydrophilic adhesive and method of preparing the same |
12/21/1999 | US6004417 Applying rupturable microcapsules encapsulating solvent adhesive composition to polymeric surface of conduit, rupturing capsules, partially dissolving and cementing surfaces |