Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910)
04/2008
04/30/2008CN101168648A Composition of hygroscopic coating with surface grain and manufacturing method for the coating
04/30/2008CN101168472A Leadless platinum electrode slurry and manufacturing method thereof
04/30/2008CN100386013C Substrate holding method and method of manufacturing electronic part
04/30/2008CN100384958C Removable emulsion pressure-sensitive adhesives
04/24/2008WO2008047600A1 Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film
04/24/2008DE10217698B4 Elektrische Schaltanordnung mit einem spritzgegossenen Schaltungsträger Electrical switching device with an injection molded circuit carrier
04/23/2008CN100383211C Thermoset binding material
04/17/2008DE102006048335A1 Joining together two structural parts comprises using a glueing system comprising a core of adhesive surrounded by a casing
04/09/2008EP1907498A1 Pressure-sensitive adhesive composition comprising near infrared ray absorption agent
04/09/2008EP1190009B1 Detachable adhesive compounds
04/09/2008CN100380741C Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
04/09/2008CN100379832C Adhesive for circuit components connection circuit board and producing method thereof
04/03/2008WO2008038565A1 Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles
04/02/2008CN101153211A Method of producing compound water-proof glue
04/02/2008CN101153209A Method for producing silver staining conductive adhesive of chemical fiber
04/02/2008CN101153080A Conductive particles and method of preparing the same
04/02/2008CN100378187C Rapid waterproof glue for polymer
04/02/2008CN100378185C Expansion type fire fighting glue
04/01/2008US7351361 Metal or alloy having a melting point of 230 degrees C. or higher, alloy having a melting point lower than 230 degrees C.; epoxy-based, phenolic-based or acrylic-based thermosetting or thermoset resin or polyethylene type, polyester type, polypropylene type or acrylic type thermoplastic resin
03/2008
03/27/2008WO2008034487A1 Isoporous membrane and method of production thereof
03/27/2008DE102006042488A1 Adhesive or sealant useful in the construction of aircraft or motor vehicles comprises a colorant that is not part of an epoxy resin and changes color irreversibly at high temperature
03/27/2008DE102006042032A1 Halbleiterbauelement Semiconductor device
03/27/2008CA2660956A1 Isoporous membrane and method for its production
03/26/2008EP1902493A1 Use of heat-activated adhesive for manufacture and a device so manufactured
03/26/2008CN201040743Y General-purpose adhesive plaster with sterilization effect
03/26/2008CN101148572A Epoxy group anti-skid glue and preparation method thereof
03/26/2008CN101148571A Fire resistant epoxy conducting adhesive and preparation method thereof
03/26/2008CN101148570A Anaerobic glue bar and preparation method thereof
03/26/2008CN100376649C 各向异性导电薄膜 Anisotropic conductive film
03/25/2008US7348373 For electronic screen printable pastes
03/20/2008DE102006040189A1 Verfahren zur Herstellung von Wellpappenkleber A process for the production of corrugated board adhesive
03/19/2008CN101147210A Electroconductive joining material and electric or electronic device using the same
03/19/2008CN101146885A Anisotropic conductive adhesive and method of electrode connection therewith
03/19/2008CN100376007C Terminal electrode composition for multilayer ceramic capacitor
03/18/2008US7345105 Conductive adhesive composition
03/13/2008WO2008029580A1 Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape
03/12/2008CN101142292A Adhesive, adhesive for connecting circuit, connecting body and semiconductor device
03/12/2008CN101140813A Electrode paste composite, front plate structure of plasma display panel and manufacturing method using the same
03/12/2008CN101139506A Method for preparing glue-water having flashing function
03/12/2008CN101139505A Method for producing fragrant glue sticker
03/12/2008CN100375152C Conducting adhesive for magnetic head assembly
03/06/2008WO2008026517A1 Conductive bonding material and electronic device
03/06/2008WO2008025966A1 Optical nanomaterial compositions
03/06/2008DE102007033214A1 Glueing workpieces together comprises using an adhesive in which a catalyst is formed or activated on exposure to ultraviolet or visible light and induces hardening without further irradiation
03/05/2008CN101134883A White glue and method for preparing same
03/05/2008CN100372904C Flame-proof silicone sealant for electronics and its production method
03/04/2008US7338710 Particle of a polymer of monomers containing a urethane compound and an acrylic acid ester, having a maximum compression deformation ratio of 60% or more, and needing a load less than or equal to 60 mN for a compression deformation by 60%.
02/2008
02/28/2008WO2008023670A1 Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
02/28/2008WO2008023565A1 Circuit connecting material, connection structure for circuit member using the same and production method thereof
02/28/2008WO2008023452A1 Adhesive tape, joint structure, and semiconductor package
02/27/2008CN101130672A Adhesion promotion agent of boron-acylated composite metal
02/27/2008CN101130671A Optically clear and antistatic pressure sensitive adhesives
02/27/2008CN100371385C Acrylic-based thermally conductive composition and thermally conductive sheet
02/20/2008EP1890324A2 Circuit-connecting material and circuit terminal connected structure and connecting method
02/20/2008EP1889889A2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film
02/20/2008CN101128886A Insulation-coated electroconductive particles
02/20/2008CN101126002A Wood-based plate fire retardant mixed into adhesive and preparation method thereof
02/20/2008CN100370345C Anisotropic conductive material, display device, manufacturing method for the device, and conductive member
02/20/2008CN100370210C Method for filling up slots between heat conductive parts as well as structure of part
02/20/2008CN100370002C Hybrid adhesives, articles, and methods
02/20/2008CN100369999C Labeled polymer dispersion and adhesives obtained therefrom
02/19/2008US7332219 a product of emulsion polymerization based on an alkyl (meth)acrylate 4-12 alkyl carbons) in the presence of an emulsifying agent; an electrolytic corrosion coefficient of >0.98; used as an interlayer or armor dielectric for electrical or electronic components, e.g., transformers and coils; solvent-free
02/19/2008US7332218 Electrically disbonding materials
02/13/2008CN101121871A Nontoxic environmental protection solvent type adhesive and manufacturing method thereof
02/07/2008DE19740722B4 Elektrisches Kabel mit einem überlappten Außenleiter Electric cable with an overlapped outer conductor
02/07/2008DE102006042074B3 Preparing labels that can be detached from hydrophobic substrates in an aqueous solution, useful e.g. in packaging of food stuffs, comprises completely or partially applying a hot melt pressure sensitive adhesive on the label
02/06/2008CN101120627A Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave
02/05/2008US7326746 Curable electron donor compositions
01/2008
01/31/2008WO2008013252A1 Heat conductive adhesive
01/30/2008CN101113315A Method for preparing rubber roofing water-proof binder
01/30/2008CN101113313A Polymeric cement type waterproof adhesive adapted for joint, confinement and bonding of roofing and hypogee
01/30/2008CN101113312A Process for manufacturing waterproof adhesive
01/30/2008CN101113309A Pressure-sensitive adhesive for applying optically functional film, optically functional film and production process for the same
01/30/2008CN100365090C Anisotropic conductive adhesive having PTC characteristics
01/24/2008WO2007120078A3 Polymer anisotropic electroconductive gluing material and a gluing method
01/24/2008US20080017223 Conductive adhesive rework method
01/23/2008EP1881049A1 Adhesive agent for thermally insulating material and carbonized laminate for thermally insulating material using the same
01/15/2008CA2341417C Electrically disbonding materials
01/10/2008WO2008004367A1 Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member
01/10/2008WO2008004287A1 Conductive adhesive
01/10/2008DE19818545B4 Verwendung von Beschichtungsmassen zur Vorbeschichtung von Oberflächen und der nachfolgenden Fügung mit Klebstoffen auf Wasserbasis Use of coating materials for precoating surfaces and the subsequent addition of water-based adhesives
01/09/2008EP1507837B1 Segmented curable transfer tapes
01/09/2008CN101103087A Solid adhesive agent and raw material composition for the same
01/09/2008CN100360628C Adhesive
01/02/2008EP1519988B1 Polymeric compositions containing polymers and ionic liquids
01/02/2008EP1268703B2 Reactive hot-melt-type adhesive granulate for insulating glass
01/02/2008CN100358964C Polyaniline corrosion proof sealant
12/2007
12/27/2007WO2007149613A1 Flame retardant pressure sensitive adhesive
12/27/2007US20070299159 Resin particle, conductive particle, and anisotropic conductive adhesive containing the same
12/26/2007CN101094901A Nanotube-based directionally-conductive adhesive
12/26/2007CN101092545A Magnetic conductive hot-melt adhesive
12/26/2007CN100357383C Water cement and use for substituted gasoline cement
12/26/2007CN100357382C Adhesive, electrode-connecting structure, and method of connecting electrodes
12/25/2007US7312261 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks
12/20/2007DE102006033702B3 Producing package-on-package electronic circuits, involves sticking a chip on a bottom package to an interposer using radiation-curable thermoplastic adhesive, soldering on a top package and irradiating the adhesive
12/13/2007WO2007142600A1 An electrochemically weakable adhesive composition
12/12/2007CN101085903A Organic screen conducting adhesive tape
12/06/2007DE102006025667A1 Klebstoffdispersionen mit Fadenzugadditiv Adhesive dispersions with Fadenzugadditiv
12/05/2007CN101081969A Conductive adhesive
12/05/2007CN101081553A 贴合产品 Fitting products
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