| Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910) |
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| 07/09/2003 | CN1428392A Preparation method of nano modified polyurethane colour liquid water-proofing adhesive material |
| 07/03/2003 | WO2003054102A1 Nanoparticulate preparation |
| 07/03/2003 | WO2003023787B1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof |
| 07/03/2003 | US20030122257 Electrically conductive paste and semiconductor device prepared by using the paste |
| 07/02/2003 | EP0819151B1 Composite adhesive for optical and opto-electronic applications |
| 07/01/2003 | US6586510 Composition comprising copolymer of plurality of copolymerizable monomers and at least one multifunctional crosslinking monomer, and citrate plasticizer |
| 07/01/2003 | US6585849 Coating a protective layer |
| 06/26/2003 | US20030116756 Conductive adhesive and packaging structure using the same |
| 06/19/2003 | US20030114560 Optically clear and antistatic pressure sensitive adhesives |
| 06/19/2003 | US20030111174 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination |
| 06/18/2003 | EP1068130B1 Adhesively bonded joints in carbon fibre composite structures |
| 06/18/2003 | CN1424728A Conductive sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| 06/18/2003 | CN1424727A Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| 06/12/2003 | WO2003048264A1 Scented hot melt adhesives |
| 06/12/2003 | US20030109658 Resin composition for high-frequency bonding |
| 06/11/2003 | CN1422923A Solid adhesive with function of preventing adhesion each other and making, packing method thereof |
| 06/10/2003 | US6576081 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A |
| 06/05/2003 | WO2003046098A1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
| 06/05/2003 | US20030105207 Silicon composition and electrically conductive silicone adhesive formed therefrom |
| 06/05/2003 | US20030105183 Scented hot melt adhesives |
| 06/05/2003 | US20030104200 Optical adhesive coating having low refractive index |
| 06/05/2003 | US20030102466 Anisotropic conductive adhesive film |
| 05/29/2003 | US20030100654 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 05/28/2003 | EP1141104B1 Heat debondable adhesive composition and adhesion structure |
| 05/28/2003 | EP1131387A4 Microcellular thermoplastic elastomeric structures |
| 05/22/2003 | WO2003042315A1 Curable bonded assemblies capable of being dissociated |
| 05/20/2003 | US6566422 For bonding and connecting elements each having electrodes thereon |
| 05/15/2003 | WO2002062914A9 Triboluminescent materials in adhesive compositions for use in adhesive tape |
| 05/15/2003 | US20030091777 Clean release tape for EMI shielding |
| 05/15/2003 | US20030089973 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 05/14/2003 | CN1417842A Semicoductor device and its manufacture, circuit board and electronic equipment |
| 05/08/2003 | US20030088239 Conductive adhesive and biomedical electrode |
| 05/07/2003 | CN1107694C Thermally conductive pressure-sensitive adhesive and adhesive sheet contg. same |
| 05/06/2003 | US6558576 Luminescent electroconductive adhesive |
| 05/02/2003 | EP1305982A1 Ferrogmagnetic resonance excitation and its use for heating substrates that are filled with particles |
| 05/02/2003 | EP1190374B1 High-reliability touch panel |
| 04/24/2003 | WO2002035554A1 Electroconductive metal paste and method for production thereof |
| 04/24/2003 | US20030078322 Conductive resin compositions and electronic parts using the same |
| 04/23/2003 | EP1303571A1 Polyimide hybrid adhesives |
| 04/23/2003 | EP0876437B1 Process for preparing a porous shaped part |
| 04/23/2003 | CN1413240A Conductive adhesive and biomedical electrode |
| 04/23/2003 | CN1412265A Resin composition for high frequency binding |
| 04/23/2003 | CN1412264A Plant fibre high-temp. adhesive |
| 04/16/2003 | CN1410498A Water based copolymer adhesive for artificial board and its preparation method |
| 04/16/2003 | CN1410455A Preparation method of polymer/carbon nano pipe composite emulsion and its in situ emulsion polymerization |
| 04/16/2003 | CN1105762C Electrically conductive adhesive tape |
| 04/16/2003 | CN1105760C Process for preparing aerosol-type adhesive |
| 04/15/2003 | US6548175 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
| 04/08/2003 | CA2112243C Microwaveable adhesive article and method of use |
| 04/03/2003 | WO2002062914A8 Triboluminescent materials in adhesive compositions for use in adhesive tape |
| 04/03/2003 | WO1999006496A3 Adhesive composition for electrical ptc heating device |
| 04/02/2003 | CN1407561A Conductive paste composition, conductive paste and its preparation |
| 03/27/2003 | WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes |
| 03/27/2003 | WO2003024494A1 Antimicrobial adhesive and coating substance and method for the production thereof |
| 03/27/2003 | US20030059607 Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface |
| 03/20/2003 | WO2003023787A1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof |
| 03/20/2003 | WO2003022949A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 03/20/2003 | US20030054163 Self-adhesive sheet for protecting vehicle finishes |
| 03/20/2003 | US20030054162 Adhesive for joining surface of semiconductor |
| 03/18/2003 | US6534581 Silicone composition and electrically conductive silicone adhesive formed therefrom |
| 03/06/2003 | US20030042469 Mixture of solvent and metal particles |
| 03/05/2003 | CN1400270A Interpenetrating polymer networks wide temperature band damping adhesive and its preparation method |
| 03/04/2003 | US6528563 High strength mortar for installation of floor tiles |
| 03/04/2003 | US6527984 Low temperature-curable connecting material for anisotropically electroconductive connection |
| 02/26/2003 | EP1285955A1 Electrically conductive, permanently surface-tacky adhesive tape which is preferably supportless and consists of an adhesive layer having an alkaline surface, preferably coated onto an anti-adhesive medium |
| 02/26/2003 | CN1398942A Production process and application of water soluble elastic waterproof polyvinyl chloride glue |
| 02/25/2003 | US6524721 Conductive adhesive and packaging structure using the same |
| 02/20/2003 | WO2003015107A1 Electrically insulating material in tape form, insulated article and aqueous dispersion type acrylic pressure sensitive adhesive agent for insulating material |
| 02/18/2003 | US6521144 A conductive adhesive comprising a thermoplastic or thermosetting binder resin contains a functional group in its molecular chain that forms multidentate bonding with electrode metal after binder is adhered, and a metal filler |
| 02/13/2003 | WO2003011958A1 Optically clear and antistatic pressure sensitive adhesives |
| 02/13/2003 | WO2003011591A1 Optical adhesive coating having low refractive index |
| 02/13/2003 | US20030029559 Adhesive for connecting electrodes and adhesion methods with the use of the same |
| 02/13/2003 | CA2450775A1 Optical adhesive coating having low refractive index |
| 02/12/2003 | CN1101438C Die attach adhesive compositions |
| 02/06/2003 | US20030027889 Antimicrobial paste glues |
| 02/05/2003 | CN1395259A Conducting paste and semiconductor prepared by using said paste |
| 02/04/2003 | US6514560 Blend of thermosetting resin and conductive particles |
| 01/30/2003 | US20030019575 Method of making liquid crystal display having a dielectric adhesive layer for laminating a liquid cryatal layer |
| 01/23/2003 | WO2003007067A1 Electro-optic display and adhesive composition |
| 01/23/2003 | US20030017328 Comprising conductive fine particles having a 50% particle size of up to 1.0 mu m dispersed in a heat sealable synthetic resin; electronics packaging permitting visual recognition of contents |
| 01/23/2003 | US20030017327 High adhesion triple layered anisotropic conductive adhesive film |
| 01/23/2003 | US20030015690 Process for forming a mixed solvent adhesive solution |
| 01/22/2003 | EP1277820A2 Antimicrobial adhesives |
| 01/22/2003 | EP1277819A1 Connecting material |
| 01/22/2003 | EP1153098A4 Method for fabricating an optical device using purified adhesives in the optical path |
| 01/21/2003 | US6510059 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 01/16/2003 | US20030011867 Electro-optic display and adhesive composition for use therein |
| 01/15/2003 | EP1274783A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 01/15/2003 | CN1390906A Method for packing hot-fusible adhesive |
| 01/09/2003 | WO2003002682A1 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constituents |
| 01/09/2003 | US20030006069 Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board |
| 01/03/2003 | WO2003000816A1 Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same |
| 12/27/2002 | WO2002102911A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| 12/25/2002 | CN1387244A Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device |
| 12/24/2002 | US6498547 Anisotropically electroconductive adhesive and a ladder filter using the same |
| 12/24/2002 | US6498400 Semiconductor devices |
| 12/19/2002 | WO2002061010A3 Method for adhering substrates using light activatable adhesive film |
| 12/19/2002 | US20020193487 Polymerizable vinyl monomer having a glass transition temperature of its homopolymer of at most 0 degrees C, polymerization initiator, reducing agent, flame retardant |
| 12/19/2002 | US20020190244 Electrically conductive adhesive agent |
| 12/19/2002 | US20020189847 Shielded flat cable |