Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910)
07/2003
07/09/2003CN1428392A Preparation method of nano modified polyurethane colour liquid water-proofing adhesive material
07/03/2003WO2003054102A1 Nanoparticulate preparation
07/03/2003WO2003023787B1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof
07/03/2003US20030122257 Electrically conductive paste and semiconductor device prepared by using the paste
07/02/2003EP0819151B1 Composite adhesive for optical and opto-electronic applications
07/01/2003US6586510 Composition comprising copolymer of plurality of copolymerizable monomers and at least one multifunctional crosslinking monomer, and citrate plasticizer
07/01/2003US6585849 Coating a protective layer
06/2003
06/26/2003US20030116756 Conductive adhesive and packaging structure using the same
06/19/2003US20030114560 Optically clear and antistatic pressure sensitive adhesives
06/19/2003US20030111174 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination
06/18/2003EP1068130B1 Adhesively bonded joints in carbon fibre composite structures
06/18/2003CN1424728A Conductive sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate
06/18/2003CN1424727A Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate
06/12/2003WO2003048264A1 Scented hot melt adhesives
06/12/2003US20030109658 Resin composition for high-frequency bonding
06/11/2003CN1422923A Solid adhesive with function of preventing adhesion each other and making, packing method thereof
06/10/2003US6576081 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A
06/05/2003WO2003046098A1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
06/05/2003US20030105207 Silicon composition and electrically conductive silicone adhesive formed therefrom
06/05/2003US20030105183 Scented hot melt adhesives
06/05/2003US20030104200 Optical adhesive coating having low refractive index
06/05/2003US20030102466 Anisotropic conductive adhesive film
05/2003
05/29/2003US20030100654 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
05/28/2003EP1141104B1 Heat debondable adhesive composition and adhesion structure
05/28/2003EP1131387A4 Microcellular thermoplastic elastomeric structures
05/22/2003WO2003042315A1 Curable bonded assemblies capable of being dissociated
05/20/2003US6566422 For bonding and connecting elements each having electrodes thereon
05/15/2003WO2002062914A9 Triboluminescent materials in adhesive compositions for use in adhesive tape
05/15/2003US20030091777 Clean release tape for EMI shielding
05/15/2003US20030089973 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
05/14/2003CN1417842A Semicoductor device and its manufacture, circuit board and electronic equipment
05/08/2003US20030088239 Conductive adhesive and biomedical electrode
05/07/2003CN1107694C Thermally conductive pressure-sensitive adhesive and adhesive sheet contg. same
05/06/2003US6558576 Luminescent electroconductive adhesive
05/02/2003EP1305982A1 Ferrogmagnetic resonance excitation and its use for heating substrates that are filled with particles
05/02/2003EP1190374B1 High-reliability touch panel
04/2003
04/24/2003WO2002035554A1 Electroconductive metal paste and method for production thereof
04/24/2003US20030078322 Conductive resin compositions and electronic parts using the same
04/23/2003EP1303571A1 Polyimide hybrid adhesives
04/23/2003EP0876437B1 Process for preparing a porous shaped part
04/23/2003CN1413240A Conductive adhesive and biomedical electrode
04/23/2003CN1412265A Resin composition for high frequency binding
04/23/2003CN1412264A Plant fibre high-temp. adhesive
04/16/2003CN1410498A Water based copolymer adhesive for artificial board and its preparation method
04/16/2003CN1410455A Preparation method of polymer/carbon nano pipe composite emulsion and its in situ emulsion polymerization
04/16/2003CN1105762C Electrically conductive adhesive tape
04/16/2003CN1105760C Process for preparing aerosol-type adhesive
04/15/2003US6548175 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
04/08/2003CA2112243C Microwaveable adhesive article and method of use
04/03/2003WO2002062914A8 Triboluminescent materials in adhesive compositions for use in adhesive tape
04/03/2003WO1999006496A3 Adhesive composition for electrical ptc heating device
04/02/2003CN1407561A Conductive paste composition, conductive paste and its preparation
03/2003
03/27/2003WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes
03/27/2003WO2003024494A1 Antimicrobial adhesive and coating substance and method for the production thereof
03/27/2003US20030059607 Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
03/20/2003WO2003023787A1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof
03/20/2003WO2003022949A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
03/20/2003US20030054163 Self-adhesive sheet for protecting vehicle finishes
03/20/2003US20030054162 Adhesive for joining surface of semiconductor
03/18/2003US6534581 Silicone composition and electrically conductive silicone adhesive formed therefrom
03/06/2003US20030042469 Mixture of solvent and metal particles
03/05/2003CN1400270A Interpenetrating polymer networks wide temperature band damping adhesive and its preparation method
03/04/2003US6528563 High strength mortar for installation of floor tiles
03/04/2003US6527984 Low temperature-curable connecting material for anisotropically electroconductive connection
02/2003
02/26/2003EP1285955A1 Electrically conductive, permanently surface-tacky adhesive tape which is preferably supportless and consists of an adhesive layer having an alkaline surface, preferably coated onto an anti-adhesive medium
02/26/2003CN1398942A Production process and application of water soluble elastic waterproof polyvinyl chloride glue
02/25/2003US6524721 Conductive adhesive and packaging structure using the same
02/20/2003WO2003015107A1 Electrically insulating material in tape form, insulated article and aqueous dispersion type acrylic pressure sensitive adhesive agent for insulating material
02/18/2003US6521144 A conductive adhesive comprising a thermoplastic or thermosetting binder resin contains a functional group in its molecular chain that forms multidentate bonding with electrode metal after binder is adhered, and a metal filler
02/13/2003WO2003011958A1 Optically clear and antistatic pressure sensitive adhesives
02/13/2003WO2003011591A1 Optical adhesive coating having low refractive index
02/13/2003US20030029559 Adhesive for connecting electrodes and adhesion methods with the use of the same
02/13/2003CA2450775A1 Optical adhesive coating having low refractive index
02/12/2003CN1101438C Die attach adhesive compositions
02/06/2003US20030027889 Antimicrobial paste glues
02/05/2003CN1395259A Conducting paste and semiconductor prepared by using said paste
02/04/2003US6514560 Blend of thermosetting resin and conductive particles
01/2003
01/30/2003US20030019575 Method of making liquid crystal display having a dielectric adhesive layer for laminating a liquid cryatal layer
01/23/2003WO2003007067A1 Electro-optic display and adhesive composition
01/23/2003US20030017328 Comprising conductive fine particles having a 50% particle size of up to 1.0 mu m dispersed in a heat sealable synthetic resin; electronics packaging permitting visual recognition of contents
01/23/2003US20030017327 High adhesion triple layered anisotropic conductive adhesive film
01/23/2003US20030015690 Process for forming a mixed solvent adhesive solution
01/22/2003EP1277820A2 Antimicrobial adhesives
01/22/2003EP1277819A1 Connecting material
01/22/2003EP1153098A4 Method for fabricating an optical device using purified adhesives in the optical path
01/21/2003US6510059 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
01/16/2003US20030011867 Electro-optic display and adhesive composition for use therein
01/15/2003EP1274783A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same
01/15/2003CN1390906A Method for packing hot-fusible adhesive
01/09/2003WO2003002682A1 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constituents
01/09/2003US20030006069 Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board
01/03/2003WO2003000816A1 Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same
12/2002
12/27/2002WO2002102911A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
12/25/2002CN1387244A Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device
12/24/2002US6498547 Anisotropically electroconductive adhesive and a ladder filter using the same
12/24/2002US6498400 Semiconductor devices
12/19/2002WO2002061010A3 Method for adhering substrates using light activatable adhesive film
12/19/2002US20020193487 Polymerizable vinyl monomer having a glass transition temperature of its homopolymer of at most 0 degrees C, polymerization initiator, reducing agent, flame retardant
12/19/2002US20020190244 Electrically conductive adhesive agent
12/19/2002US20020189847 Shielded flat cable
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