Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910)
09/2001
09/26/2001EP1135777A1 Particles
09/26/2001CN1071780C 水溶性粘接剂 Water-soluble adhesive
09/25/2001US6294259 Polyimide hybrid adhesives
09/20/2001WO2001030932A3 Method for separating adhesive bonded composites
09/20/2001DE10010118A1 Coating system, useful for the production of microelectronics, comprises a pyranosyl nucleic acid comprises a pyranosephosphate back bone bonded to purine or pyrimidine bases.
09/19/2001CN1313371A Connecting material and mounting method for using it
09/13/2001US20010020697 Thermosetting adhesive material
09/12/2001EP1131387A1 Microcellular thermoplastic elastomeric structures
09/12/2001CN1312346A Fireproof adhesive tape
09/07/2001WO2001064808A1 Coating system based on pyranosyl nucleic acids (p-na)
09/07/2001WO2001064807A1 Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
09/05/2001CN1311511A Aeolotropic conductive adhering film
08/2001
08/30/2001US20010018228 Connecting material and mounting method which uses same
08/30/2001US20010018124 Using hot melt adhesive
08/29/2001CN1310848A Anisotropically conductive paste
08/29/2001CN1310219A Electric conducting binder using for through-hole filling
08/23/2001US20010015424 A conductive adhesive comprising a thermoplastic or thermosetting binder resin contains a functional group in its molecular chain that forms multidentate bonding with electrode metal after binder is adhered, and a metal filler
08/21/2001US6277481 Adhesive composition and adhesive sheet
08/16/2001DE10000834A1 Production of electrically conducting compounds comprises distributing a particulate filler in a polymer matrix, and forming material bridges between the filler particles and the electrically conducting surfaces to be joined
08/08/2001CN1307625A Fine pitch anisotropic conductive adhesive
08/01/2001EP1120449A1 Adhesive for bonding circuit members, circuit board, and method of producing the same
08/01/2001CN1306060A Water-proof active adhesive and its preparing process
07/2001
07/26/2001US20010009393 Anisotropically electroconductive adhesive and a ladder filter using the same
07/24/2001US6265471 Liquid epoxy resin blend
07/19/2001US20010008169 Fine pitch anisotropic conductive adhesive
07/18/2001CN1304323A Hygienic article comprising oil resistant, hydrophilic adhesive
07/18/2001CN1303901A Hydrophilic compact impervious water-proofing elastic matter
07/18/2001CN1303892A Thermoset binding material
07/12/2001WO2000079475A3 High-reliability touch panel
07/11/2001EP1114852A2 Conductive adhesive and connection structure using the same
07/11/2001CN1303329A Multi-functional electrically and thermally conductive adhesive tape
07/10/2001US6258426 Ultraviolet curing pressure-sensitive adhesive sheet
07/05/2001WO2001048111A1 Conductive adhesive and biomedical electrode
07/03/2001US6255138 Process for producing microencapsulated electroconductive filler
06/2001
06/21/2001WO2001044399A1 Shaped body containing dye for producing an aqueous binding agent system
06/21/2001WO2001044373A1 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
06/21/2001WO2001044136A1 Low-solids, high-strength multi-use gelled adhesives and adhesive mastics
06/21/2001US20010004131 Adhesion method and electronic component
06/21/2001DE10056007A1 Tablet for preparing wallpaper paste consists of two or more different phases, at least one of which contains dye which can be seen on its surface
06/20/2001EP1108766A2 Adhesion method and electronic component
06/20/2001CN1299852A Connection material
06/05/2001US6242510 Radiation transparent; holographic prisms; tamper-proof; decoration; polymeric pressure sensitive adhesives
05/2001
05/30/2001EP1102823A1 Electroconductive, thermoplastic and heat-activated adhesive film
05/29/2001US6238597 Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate
05/29/2001CA2039314C Process for the preparation of non surface sticking, fusible, self-adhesive blocks
05/23/2001DE19951599A1 Verfahren zur adhesiven Trennung von Klebeverbunden Process for the separation of adhesiven adhesive assemblies
05/23/2001CN1296053A Adhesion material and circuit connection method
05/22/2001US6235385 Electrically conductive adhesive tape
05/15/2001US6231974 Hot-melt adhesive sheet and semiconductor devices
05/09/2001EP1097978A1 Tackified pressure sensitive adhesives
05/08/2001US6228965 Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same
05/03/2001WO2001030932A2 Method for separating adhesive bonded composites
05/02/2001EP0946097B1 Composition and use
05/02/2001CN1293467A Chip parts on glass and connecting material used thereof
05/02/2001CN1293222A Aerosol-type adhesive and its preparing process
04/2001
04/25/2001EP1094474A2 Low temperature-curable connecting material for anisotropically electroconductive connection
04/25/2001EP1094472A2 Conductive composition, conductive adhesive, and their mounting structure
04/25/2001EP1093503A1 Fine pitch anisotropic conductive adhesive
04/18/2001EP1093160A2 Connecting material for anisotropically electroconductive connection
04/11/2001EP1089773A1 Hygienic article comprising oil resistant, hydrophilic adhesive
04/10/2001US6214460 Adhesive compositions and methods of use
04/05/2001WO2001023466A1 Electrically conductive adhesive containing epoxide-modified polyurethane
04/05/2001WO2000031199A9 A pressure-sensitive adhesive laminate, a method and a device for modifying an initial release force in such a laminate
04/04/2001EP0734576B1 Anisotropic, electrically conductive adhesive film
04/03/2001US6211320 Low viscosity acrylate monomers formulations containing same and uses therefor
04/03/2001CA2169729C Water-soluble pressure-sensitive mucoadhesive
03/2001
03/28/2001EP1087436A2 Adhesive material and electronic circuit connection method
03/28/2001CN1288924A Single-component organic heat-conducting daub
03/28/2001CN1288921A Self-curing inorganic heat-conducting daub
03/21/2001EP1085790A1 Connecting material
03/21/2001EP1085567A1 COG Assembly and connecting material to be used therein
03/14/2001CN1287672A Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and ceramic electronic part
03/13/2001US6201042 Method of making microsphere adhesive
03/01/2001WO2001015505A1 Wiring-connecting material and process for producing circuit board with the same
03/01/2001WO2001014490A1 Microwave bonding
03/01/2001DE10040325A1 Gluing of porous or non-porous materials, e.g. shoes, with melt adhesives involves use of primer activated by microwaves
03/01/2001DE10030909A1 Hot-melt adhesive in granulate form use for adhesive bonding of substrates where the granulate is melted and then applied to the substrate, has compact outer shell
02/2001
02/27/2001US6194492 Anisotropic conductive film
02/27/2001US6194064 Pressure sensitive adhesive for decorative films with removable and repositionable properties
02/21/2001CN1284527A Heat isolating damping glue
02/14/2001EP1076082A1 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
02/08/2001WO2001009078A1 Low viscosity acrylate monomers, formulations containing same, and uses therefor
02/08/2001WO2000061302A3 Electrically conductive coatings applied by internally charged electrostatic sprayers
02/08/2001CA2380020A1 Low viscosity acrylate monomers, formulations containing same, and uses therefor
02/07/2001EP1021165A4 Bioerodable polymeric adhesives for tissue repair
01/2001
01/25/2001WO2001005584A1 Electrically disbonding materials
01/23/2001CA2161763C Anti-static anchor coating agent and laminating composite film
01/18/2001WO2001004229A1 Hot-melt-type adhesive in the form of a granulate
01/17/2001EP1068130A1 Adhesively bonded joints in carbon fibre composite structures
01/17/2001CN1280156A Anisotyopic conductive adhesive and its preparing method
01/17/2001CN1060792C Electricity-conduct adhesive and mfg method thereof
12/2000
12/28/2000WO2000079475A2 High-reliability touch panel
12/27/2000EP1062289A1 Luminescent electroconductive adhesive
12/20/2000EP1061109A2 Re-release type adhesive and re-release type adhesive sheet
12/12/2000CA2189801C Method for production of microcapsule type conductive filler
12/07/2000WO2000074074A1 Water-borne ceramer compositions and antistatic abrasion resistant ceramers made therefrom
12/07/2000WO2000073398A1 Detachable adhesive compounds
11/2000
11/30/2000DE19924138A1 Lösbare Klebeverbindungen Releasable adhesive bonds
11/16/2000DE19901107C1 Lumineszierender elektrisch leitender Klebstoff Luminescent electrically conductive adhesive
11/14/2000US6147141 Die attach adhesive compositions
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