Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910) |
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03/08/2006 | EP1159368B1 Pressure-sensitive adhesive compositions and pressure-sensitive adhesive label constructions exhibiting low adhesive residue in printers |
03/08/2006 | CN1244658C Water based copolymer adhesive for artificial board and its preparation method |
03/08/2006 | CN1244657C Sterilization, deodorization, nourishment and bonding agent for shoes |
03/02/2006 | DE102004040840A1 Hot melt adhesive, useful for pasting the interior panel of refrigerator with heat conducting metal sheets, comprises thermal-conductive fillers and/or pigments (e.g. aluminum oxide, titanium dioxide, graphite and/or calcium silicate) |
03/02/2006 | DE102004039212A1 Rheologiesteuerung von Pickering-Emulsion durch Elektrolyte Rheology of Pickering emulsion by electrolytes |
03/01/2006 | EP1629059A1 Thermal interface materials and method of making thermal interface materials |
03/01/2006 | EP1425759B1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof |
03/01/2006 | CN2761680Y High elasticity light granule used for sport field |
03/01/2006 | CN1742067A Glue line use of bifenthrin in wood products |
03/01/2006 | CN1742043A Foamed insulating material |
03/01/2006 | CN1741212A Release layer paste and method of production of multilayer type electronic device |
03/01/2006 | CN1741198A High-temperature sintered silver paste and producing process thereof |
03/01/2006 | CN1243809C Absorbing hot-melted adhesive |
02/22/2006 | EP1628363A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
02/22/2006 | EP1456318B1 Nanoparticulate preparation |
02/22/2006 | CN1737072A Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent |
02/16/2006 | DE10223341B4 Verfahren und Vorrichtung zum Verbinden von Formteilen mit wenigstens einer Klebstoffnaht aus einem durch Wärmebeaufschlagung aushärtbarem Klebstoff Method and apparatus for joining shaped parts having at least one adhesive seam by heat application from a curable adhesive |
02/15/2006 | CN1735660A Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
02/15/2006 | CN1733858A Production process of gild sizing or gild gold size |
02/02/2006 | WO2006012614A2 Fabrication methods and multifunctional substrate materials for chemical and biological analysis in microfluidic systems |
02/02/2006 | WO2006011697A1 Adhesive composition and floor plywood using the same |
02/01/2006 | EP1621596A2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film |
02/01/2006 | EP1151049B1 Repositionable microsphere adhesive coated article |
02/01/2006 | CN1728302A Conductive paste and multilayer ceramic electronic device and its method of production |
02/01/2006 | CN1727424A Biologic waterproof glue and usage |
02/01/2006 | CN1239658C Conductive binding agent, multiplayer printed circuit board and process for making the latter |
02/01/2006 | CN1239657C Connecting material and mounting method for using it |
01/31/2006 | US6991751 Electroconductive silicone pressure-sensitive adhesive composition |
01/26/2006 | US20060017069 Superior piezoelectric/electrostrictive characteristics without containing lead (Pb) and which can obtain an especially large displacement |
01/25/2006 | EP1617769A2 Structures, systems and methods for joining articles and materials and uses therefor |
01/25/2006 | CN1238459C High connecting intensity thermosetting conducting glue |
01/19/2006 | US20060012460 Metal or alloy having a melting point of 230 degrees C. or higher, alloy having a melting point lower than 230 degrees C.; epoxy-based, phenolic-based or acrylic-based thermosetting or thermoset resin or polyethylene type, polyester type, polypropylene type or acrylic type thermoplastic resin |
01/18/2006 | EP1616217A2 Electro-optic assemblies |
01/18/2006 | EP1615979A1 Thermally resistant adhesive |
01/18/2006 | EP1615970A1 Acrylic-based thermally conductive composition and thermally conductive sheet |
01/18/2006 | CN1723590A Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
01/18/2006 | CN1722395A Circuit connection method |
01/18/2006 | CN1237137C Fire-retardant solidifying resin composition and fire-retardant solidifying binder composition |
01/12/2006 | DE19649893B4 Elektrisch leitender Klebstoff und dessen Verwendung Electrically conductive adhesive and its use |
01/11/2006 | EP0942060B1 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
01/11/2006 | CN1236000C Electronic donor compound capable of solidifying |
01/11/2006 | CN1235998C Anion environmental glue |
01/04/2006 | EP1611642A1 Durable electronic assembly with conductive adhesive |
01/04/2006 | CN1717462A Anti-static self-adhesive strip |
01/04/2006 | CN1716458A Thick-film conductor paste |
01/04/2006 | CN1234794C Adhesive material |
12/29/2005 | WO2005123388A2 Magneto-active adhesive systems |
12/29/2005 | WO2005123387A2 Electro-active adhesive systems |
12/29/2005 | US20050288427 prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, a short circuit between adjacent electrodes can be prevented when connecting circuits |
12/29/2005 | US20050287328 Method of producing laminates, and laminates |
12/29/2005 | DE102005006417A1 Elektrisch leitfähiger Klebstoff und klebende Produkte auf dessen Basis Electrically conductive adhesive and adhesive products on the basis of |
12/29/2005 | DE102004029589A1 Elektrisch anisotrop leitfähiger Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper Electrically conductive anisotropic melt adhesive for implanting electrical modules in a card body |
12/28/2005 | CN1714131A Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
12/28/2005 | CN1712483A Isotropic conductive adhesive and adhesive film using the same |
12/28/2005 | CN1234181C Polymer lithium iron cell current-collector net-spraying slurry material and preparation process thereof |
12/28/2005 | CN1233763C Metal backed printed circuit board assemblies |
12/22/2005 | WO2005121267A1 Adhesive sheet comprising hollow parts and method for preparing the same |
12/22/2005 | US20050282002 Electrically anisotropically conductive hotmelt adhesive for implanting electrical modules in a card body |
12/21/2005 | EP1607457A2 Electrical anisotropic conductable hot-melt adhesive for implanting electric modules in a card body |
12/21/2005 | EP1606368A1 Intrinsically heatable pressure-sensitive adhesive planar structures |
12/21/2005 | EP1606337A1 Electrically heatable pressure-sensitive adhesive compound |
12/21/2005 | CN1710003A Electrically anisotropically conductive hotmelt adhesive |
12/21/2005 | CN1232606C Novel waterproof glue and method for making same |
12/20/2005 | US6977024 Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies |
12/15/2005 | WO2005118733A1 Self-adhesive vibration damping tape and composition |
12/15/2005 | US20050276972 A heme protein (especially a porphyrin complex whose iron ion is divalent is obtained by adding a reducing agent) is mixed with an adhesive to confer electrical conductivity; is used on the surface of electronic parts or a label to prevent and eliminate static electricity and improve heat dissipation |
12/15/2005 | US20050276963 Adhesive sheet comprising hollow parts and method for preparing the same |
12/15/2005 | US20050274455 Electro-active adhesive systems |
12/15/2005 | US20050274454 Magneto-active adhesive systems |
12/14/2005 | EP1603985A1 A conductive adhesive composition |
12/08/2005 | DE102004022622A1 Magnetsensoranordnung und ein Verfahren zu dessen Herstellung A magnetic sensor arrangement and a method for its preparation |
12/07/2005 | CN1706008A Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure |
12/07/2005 | CN1230834C Method for testing electronic unit using electrode member |
12/07/2005 | CN1230483C Adhesive for bonding circuit members, circuit board, and method of producing same |
12/07/2005 | CN1230482C Stripping adhesive composition |
12/01/2005 | WO2005061017A3 Electrically conductive adhesive hydrogels with solubilizer |
12/01/2005 | DE102004022232A1 Viskoses Klebematerial zur Befestigung elektronischer Bauelemente Viscous adhesive material for mounting electronic components |
11/24/2005 | WO2005111169A1 Connecting material |
11/24/2005 | WO2005111168A1 Adhesive agent composition and adhesive film for electronic component |
11/24/2005 | US20050260908 Electroconductive adhesive tape |
11/23/2005 | CN1699492A Photo-curable conductive adhesive and method for making same |
11/17/2005 | WO2005060490A3 Anticorrosion separator for wood deck fasteners |
11/17/2005 | US20050256241 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
11/17/2005 | US20050252607 Microwave bonding |
11/17/2005 | US20050252598 Viscous adhesive material for fastening electronic components |
11/16/2005 | EP1131387B1 Microcellular thermoplastic elastomeric structures |
11/16/2005 | CN1696234A Adhesive compsn.circuit connection material,joint stucture of circuit parts and semiconductor device |
11/16/2005 | CN1696231A Interface adhesive compsn. and rework prepn. |
11/16/2005 | CN1227320C Weather resistant epoxy conductive adhesives |
11/16/2005 | CN1227319C Anisotropic conductive adhesive film |
11/10/2005 | WO2005105633A1 Anisotropic conductive film holding tape and mounting method |
11/09/2005 | EP0855049B1 A method of forming a monolayer of particles, and products formed thereby |
10/26/2005 | EP1587860A1 Foamed insulating material |
10/26/2005 | CN1689077A Conducting adhesive for magnetic head assembly |
10/26/2005 | CN1687276A Conducting resin for negative pole of laminated cell |
10/26/2005 | CN1687275A Method for producing spherical hot-melt adhesive granules |
10/26/2005 | CN1687274A Method and equipment for forming spherical hot-melt adhesive granules |
10/20/2005 | US20050230667 Conductive adhesive and circuit using the same |
10/19/2005 | EP1047730B2 Polymer composition for use as aqueous floor adhesive |
10/13/2005 | WO2005096442A1 Anisotropic conductive film and manufacturing method thereof |