Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910)
09/2008
09/10/2008CN101260281A Nano zinc oxide modifying chloroprene rubber spraying type adhesive and preparation method thereof
09/03/2008CN101256996A Semiconductor device and manufacturing method of the semiconductor device
09/03/2008CN101256851A Coating layer material of electronic component
09/03/2008CN101255321A Highly conductive composition for wafer coating
09/03/2008CN100416921C Adhesive film for circuit connection, and circuit connection structure
09/02/2008US7419387 Electric connection member utilizing ansiotropically conductive sheets
08/2008
08/28/2008DE202005021556U1 Lösbarer elektrisch leitender Werkstoff auf der Basis funktionaler Saccharide und metallischer Partikel Releasable electrically conductive material on the basis of functional saccharides and metallic particles
08/27/2008CN101250387A Preparation of high solid content aqueous adhesive for mounting books
08/27/2008CN101250386A Adhesive for electrode connection and connecting method using it
08/27/2008CN101250385A Method for preparing full biodegradable environment protection hot melt adhesive
08/27/2008CN100413890C Resin particle, conductive particle and anisotropic conductive adhesive containing the same
08/26/2008CA2432701C Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection
08/21/2008WO2008099925A1 Conductive adhesive composition, conductive adhesive sheet and conductive adhesive tape
08/21/2008WO2008098847A1 Intrinsically heatable hot melt adhesive sheet materials
08/20/2008CN101246760A Low-temperature sintering type conductive slurry based on semiconductor chip agglutination and its manufacturing technique
08/20/2008CN101245227A Epoxy conductive silver glue for LED and method for manufacturing same
08/19/2008US7413686 Conductive particle and adhesive agent
08/14/2008US20080191174 anisotropic electrically conductive adhesive is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics
08/14/2008DE102007007617A1 Intrinsisch erwärmbare heißschmelzklebrige Flächengebilde Intrinsically heatable hotmelt sheet
08/14/2008DE102007006251A1 Verfahren zur kantenseitigen Passivierung von Haftklebebändern A method for edge side passivation of pressure sensitive tapes
08/13/2008CN101240152A Nanometer mildew-resistant solid adhesive and preparation method thereof
08/12/2008CA2145947C Halogen-free biocide
08/06/2008EP1951836A1 Anisotropic conductive adhesive compositions
08/06/2008CN101238189A Conductive adhesives and biomedical articles including same
08/06/2008CN101235264A Water-based polyurethane adhesive and preparation method thereof
08/06/2008CN100409370C High-temperature sintered silver paste and producing process thereof
08/05/2008US7407704 Electromagnetically activatable primer, with a binder having nanoscale particles with ferromagnetic, ferrimagnetic, superparamagnetic or piezoelectric properties; loosening adhesive bonds by alternating an electric, magnetic or electromagnetic field to effect localized heat in primer layer of the joint
07/2008
07/31/2008US20080178983 Impregnating reinforcing structure with a curable epoxy resin and polyphenyl ethers; polyether includes 1.6-2.4 hydroxy groups, a polydispersity index =/<2.2 and intrinsic viscosity of 0.03-0.2 deciliter/gram to improve its solubility; room temperature curing; tough, flexible circuit boards .
07/30/2008EP1948751A1 Method for producing low anisotropy pressure-sensitive adhesives
07/30/2008EP1228158B1 Bonding by adhesives containing nanoparticles
07/30/2008CN101232128A Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
07/30/2008CN101230241A Adhesive for electrode connection and connecting method using it
07/30/2008CN100406873C 固化性粘合剂组合物的固化物固化水平的非破坏测试方法和电子装置的制造方法 The method of manufacturing a curable adhesive composition cured cured level of non-destructive testing method and electronic device
07/29/2008US7405247 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks
07/24/2008DE102007003648A1 Kupferenthaltende Formmasse aus Polyester, ihre Herstellung und Verwendung Copper-containing molding material of polyester, their preparation and use
07/23/2008EP1945701A1 Nanoparticulate preparation and method of heating it
07/23/2008EP1606368B1 Intrinsically heatable pressure-sensitive adhesive planar structures
07/23/2008CN101226784A Aeolotropic conductive film
07/23/2008CN101225288A Water-proof roof glue
07/23/2008CN100405506C Conducting material with anisotropy
07/17/2008WO2008084811A1 Adhesive for connection of circuit member and semiconductor device using the same
07/17/2008DE102006060638A1 Dynamic anchoring adhesive, especially for fixing anchor bars in rock for mining and tunnel-building, comprises a one- or two-component system chemically adjusted to eliminate shrinkage on hardening
07/16/2008CN101220252A Solid glue stick and method for producing the same
07/16/2008CN100402620C Method of preparing high performance conductive glue
07/09/2008EP1941951A1 Particle classification apparatus and adhesive containing particle classified by the apparatus
07/09/2008CN101217193A Anode for lithium battery and lithium battery employing the same
07/09/2008CN101215452A Nano luminous epoxy adhesive and preparation method thereof
07/09/2008CN101215450A Conductive adhesive added with short rod type nano silver powder and preparation method thereof
07/09/2008CN101215449A Function cigarette overlapping glue and preparation method thereof
07/03/2008WO2008079620A1 Seaming tape and method of sealing window film seams
07/03/2008US20080157030 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
07/02/2008CN101213267A Pressure-sensitive adhesive composition comprising near infrared ray absorption agent
07/02/2008CN101210158A Electric bonding for battery or capacitor and composition containing the same used for electrode
07/02/2008CN101210157A Micron nano material composite modified water-based adhesive
07/02/2008CN100399109C Electro-optic assemblies
07/02/2008CN100398620C Adhesion agent for electrode conection and connection method using same
07/01/2008US7393468 Adhesive with differential optical properties and its application for substrate processing
07/01/2008US7393419 Conductive adhesive rework method
06/2008
06/26/2008WO2008076686A1 Thermally b-stageable composition for rapid electronic device assembly
06/26/2008DE102007041734A1 Repulpierbare Klebmassen Repulpable adhesives
06/25/2008CN101206939A Method for manufacturing piece type base metal resistor
06/25/2008CN101205451A Ultraviolet-anaerobic dual curing adhesive
06/25/2008CN101205450A Aqueous laminating adhesive and method for making same
06/25/2008CN100396745C Aqueous assembly glue for package material
06/25/2008CN100396730C Conductive composition, conductive film, and process for the formation of the film
06/19/2008WO2008071469A1 Hot melt adhesive for microwave heating
06/19/2008DE10297224B4 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zum Verbinden von Substraten und Verwendung eines derartigen Klebstoffs zur Verknüpfung und Verbindung von Substraten einer Halbleitervorrichtung Die attach adhesives for semiconductor applications, and methods of bonding substrates using such an adhesive for bonding substrates and linking of a semiconductor device
06/18/2008EP1809716B1 Nanotube-based directionally-conductive adhesive
06/11/2008CN101195735A Fireproof glue and method for producing the same
06/11/2008CN100393839C Polyaniline conducting adhesive
06/11/2008CN100393834C Adhesive compositions containing organic spacers and methods for use thereof
06/05/2008WO2008065997A1 Adhesive and connection structure using the same
06/05/2008DE202008003236U1 Klebstoff, insbesondere Dispersions-Parkettkleber Adhesive, especially dispersion parquet adhesive
06/05/2008DE19804748B4 Anordnung und Verfahren der Isolierung gegen mechanische Spannung bei der Befestigung von Halbleiterchips Arrangement and method of the insulation against mechanical stress at the mounting of semiconductor chips
06/04/2008EP1723197A4 Thermally conductive two-part adhesive composition
06/04/2008CN101191044A Water-proof adhesive
05/2008
05/29/2008DE102006054936A1 Process for temperature-induced, material bonding of substrates comprising thermodynamically incompatible plastics, comprises adding adhesive-welding additive, joining substrate on a joining zone, heating the zone and obtaining substrates
05/28/2008EP1606337B1 Electrically heatable pressure-sensitive adhesive compound
05/28/2008CN101186801A Polysulfur sealing gum dissolving agent
05/28/2008CN101186799A Fire resistant anaerobic adhesive containing cage-type silsesquioxane and preparation method thereof
05/28/2008CN101186798A Method for preparing water polyurethane siloxane ventilating coating adhesive used for automobiles and shoes
05/28/2008CN101186793A Thermally resistant adhesive
05/28/2008CN101186791A Method for preparing resorcin glass sizing cloth
05/22/2008US20080115889 terpolymers of a C4+ alkyl acrylate and a C1-3 alkyl acrylate with a vinylcarboxylic acid such as acrylic acid; adhesive tapes; splicing
05/21/2008DE202008001413U1 Trägerloses Klebeband Strapless tape
05/21/2008DE102006056070A1 Reflector for use in a secondary concentrator or a heliostat, comprises reflecting elements on retaining elements made of two flat parts connected together with coolant channels made by material forming
05/21/2008DE102006054155A1 Schäumbare Mischungen enthaltend alkoxysilanterminierte Prepolymere Foamable mixtures containing alkoxysilane-terminated prepolymers
05/21/2008CN101182406A Method for preparing multiple modified self-crosslinking aqueous polyurethane adhesive agent
05/21/2008CN101182405A Preparation method of dual-component aqueous polyurethane adhesive agent
05/21/2008CN100389162C Adhesive agent and method for production thereof
05/15/2008WO2008056773A1 Adhesive film, and connection structure and connecting method for circuit member
05/14/2008EP1920021A1 Substrate having polarized adhesive
05/14/2008CN101180335A Modified polyurethane resin and adhesive composition using the same, method for connecting circuit member and connection structure of circuit member
05/14/2008CN101178948A Anisotropic conductive film composition
05/08/2008WO2008053824A1 Adhesive tape and adhesive tape roll
05/07/2008EP1917318A1 Conductive adhesives and biomedical articles including same
05/07/2008CN100386823C Terminal electrod composition for multilayer ceramic capacitor
05/01/2008US20080100783 Polarizer and liquid crystal display including the same
04/2008
04/30/2008DE102007050875A1 Adhesive part production for use in sealing, sound proofing, reinforcement or structural adhesion, involves utilizing adhesive material, which contains curing agent
04/30/2008CN101168652A Positioning bonding element for suspender
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