C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks

Patents for C09J 9 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (4,910)
12/2004
12/29/2004	EP1490904A1 Thermosetting adhesive sheet with electroconductive and thermoconductive properties
12/29/2004	EP1490450A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
12/23/2004	DE10324086A1 Markierte Polymerdispersion und daraus erhältliche Klebstoffe Labeled polymer dispersion and adhesives obtainable therefrom
12/22/2004	CN1557002A Tape-like insulating material, insulating article and water-dispersed acrylic adhesive for the insulating material
12/22/2004	CN1181496C Ceramic electronic element
12/21/2004	US6833180 Cyclic structure-containing thermoplastic polymer comprising a cycloolefin polymer or an aromatic condensed polymer; and filler anisotropic electroconductivity
12/16/2004	WO2004108852A1 Thermal interface materials and method of making thermal interface materials
12/15/2004	EP1248825B1 Conductive adhesive and biomedical electrode
12/15/2004	CN1555405A Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
12/15/2004	CN1180669C Wiring-connecting material and process for producing circuit board with the same
12/15/2004	CN1180463C Anisotropic electrically conductive binding material and connecting method
12/15/2004	CN1180046C Adhesion material and circuit connection method
12/15/2004	CN1180044C Small-piece binder containing vinyl ether and amino formate or carbamide functional group
12/14/2004	US6831132 Useful as adhesives in microelectronics industry; film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength
12/09/2004	WO2004106451A1 Labeled polymer dispersion and adhesives obtained therefrom
12/09/2004	US20040249037 Curable bonded assemblies capable of being dissociated
12/09/2004	CA2527214A1 Labeled polymer dispersion and adhesives obtained therefrom
12/08/2004	CN2661692Y Production equipment for clubbed high melting point polyester hot-melt adhesive
12/08/2004	CN1552788A High temperature conductive binding material for aluminium electrolysis
12/07/2004	US6827880 Anisotropic conductive adhesive
12/02/2004	WO2004104129A1 Thermally conductive pressure-sensitive adhesive composition, thermally conductive sheet-like moldings, and process for the production of the moldings
12/02/2004	US20040241410 providing a polymeric hot melt pressure sensitive adhesive with a number average molecular weight of greater than 25,000, melt-blending the polymer with a thermally conductive filler to form a mixture
12/01/2004	CN1551320A Anisotropic conductive adhesive, assembling method,electrooptical device module and electronic device
12/01/2004	CN1550534A Method for preparing emulsion adhesive and its use
11/2004
11/30/2004	US6825570 Resistance-reducing conductive adhesives for attachment of electronic components
11/25/2004	US20040234763 Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device
11/24/2004	EP1000993B1 Ultraviolet-curing composition, optical disk, and method of producing optical disk
11/24/2004	CN1548494A Epoxy resin and inductor assembly for preventing electromagnetic interference
11/17/2004	EP1476902A2 Electronic component with an adhesive layer and method for the production thereof
11/17/2004	CN1546591A High connecting intensity thermosetting conducting resin
11/10/2004	CN1545111A Conductive pulp for terminal electrode of chip capacitor
11/09/2004	US6814893 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
11/09/2004	US6814890 Process for forming a mixed solvent adhesive solution
11/04/2004	WO2004095644A1 Durable electronic assembly with conductive adhesive
11/04/2004	WO2004094529A1 Acrylic-based thermally conductive composition and thermally conductive sheet
11/04/2004	WO2004081095A8 Electrically heatable pressure-sensitive adhesive compound
11/04/2004	US20040219322 Synthetic rubber polymer, a thermoplastic polymer, a plasticizer, and an organic filler comprised of recycled automotive paint powder; seals out dust, moisture, and air
11/04/2004	DE10297224T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices
11/03/2004	EP1473769A2 Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
11/03/2004	CN1542080A Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
11/03/2004	CN1174070C Small granularity adhesive composition for micro electronic device
11/02/2004	US6812065 Anisotropic conductive paste
11/02/2004	US6811869 Alpha-olefin polymer; pressure sensitive adhesives
10/2004
10/28/2004	WO2004092294A1 Thermally resistant adhesive
10/28/2004	US20040214979 Polyurethanes and polyimides for wires or connectors and a process for connecting wires, curing with curing agents to form films.
10/28/2004	US20040214377 Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
10/28/2004	US20040213992 a product of emulsion polymerization based on an alkyl (meth)acrylate 4-12 alkyl carbons) in the presence of an emulsifying agent; an electrolytic corrosion coefficient of >0.98; used as an interlayer or armor dielectric for electrical or electronic components, e.g., transformers and coils; solvent-free
10/28/2004	CA2455524A1 Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
10/27/2004	EP1470181A1 Improved interface adhesive
10/27/2004	EP0942059B1 Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same
10/27/2004	CN1540752A Phase change converting heat-conducting glue material
10/27/2004	CN1173371C Conductive formation and electronic equipment using such conductive formation
10/21/2004	US20040206943 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
10/19/2004	US6806309 Maleimide containing monomer, cure initiator and polymers; controlled bond line thickness and uniformity; semiconductor packaging; stacking without need for spacer die
10/14/2004	WO2004088395A2 Electro-optic assemblies
10/14/2004	US20040201112 Durable electronic assembly with conductive adhesive
10/12/2004	US6803400 Water-swellable hot-melt-type adhesive
10/12/2004	US6802446 Conductive adhesive material with metallurgically-bonded conductive particles
10/06/2004	EP1464689A2 Repositionable microsphere adhesive coated article
09/2004
09/30/2004	WO2004083332A1 A conductive adhesive composition
09/29/2004	CN1532903A Method for producing connection member
09/29/2004	CN1532249A Poisonless water-proof glue
09/23/2004	WO2004081136A1 Intrinsically heatable pressure-sensitive adhesive planar structures
09/23/2004	WO2004081095A1 Electrically heatable pressure-sensitive adhesive compound
09/23/2004	DE10310722A1 Electrically heatable adhesive composition, useful for adhesive tape in automotive applications such as electrically heated mirrors, comprises an adhesive component and an electrically conductive filler
09/22/2004	EP1305982B1 Ferrogmagnetic resonance excitation and its use for heating substrates that are filled with particles
09/22/2004	EP0995784B1 Adhesive for semiconductor components
09/22/2004	CN1167764C Interpenetrating polymer networks wide temperature band damping adhesive and its preparation method
09/16/2004	WO2004078472A1 Laminated tape of anisotropic conductive film and method of manufacturing the same
09/16/2004	US20040180074 Bioerodable polymeric adhesives for tissue repair
09/15/2004	EP1456318A1 Nanoparticulate preparation
09/15/2004	CN1528850A High-elastic shock-reducing rubber
09/14/2004	US6791839 Mixtures of curable polysiloxanes, low melting metal fillers and spacers, laminated between electronic substrates; heat exchanging
09/08/2004	EP1454973A1 Adhesive for bonding circuit members, circuit board and process for its production
09/08/2004	CN1165591C Electrically conducting adhesive, structural body for installation, LCD, electronic device and making emthod
09/07/2004	US6787233 Particles
09/01/2004	CN1524910A Adhesive for antibacterial shoes
09/01/2004	CN1164620C Preparation method of polymer/carbon nanometer pipe composite emulsion and its in situ emulsion polymerization
08/2004
08/25/2004	EP1448745A1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
08/25/2004	CN1523651A Adhesive tape for semiconductor device
08/18/2004	CN1522287A Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents
08/18/2004	CN1521229A Anion environmental glue and its processing method
08/17/2004	US6777478 Connecting integrated circuits; blend of thermoplastic resin and curing agent
08/11/2004	EP1444306A1 Curable bonded assemblies capable of being dissociated
08/11/2004	CN1520448A Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same
08/05/2004	WO2004065468A1 Foamed insulating material
08/04/2004	EP1443531A1 Terminal electrode compositions for multilayer ceramic capacitors
08/04/2004	EP1443530A1 Terminal electrode compositions for multilayer ceramic capacitors
08/04/2004	CN1518008A Terminal electrod composition for multilayer ceramic capacitor
08/04/2004	CN1518007A Terminal electrod composition for multilayer ceramic capacitor
08/04/2004	CN1518006A Terminal electrode composition for multilayer ceramic capacitor
08/04/2004	CN1517420A Adhesive paste rod
08/03/2004	US6770957 Adhesives, adhesive films and electric devices
08/03/2004	US6770820 Shielded flat cable
08/03/2004	US6770812 Metal housing with auxiliary parts glued to housing base
08/03/2004	US6770370 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination
08/03/2004	US6770369 Conductive electrolessly plated powder, its producing method, and conductive material containing the plated powder
07/2004
07/29/2004	US20040147653 Terminal electrode compositions for multilayer ceramic capacitors
07/29/2004	US20040144962 Terminal electrode compositions for multilayer ceramic capacitors
07/29/2004	US20040144205 Firing mixture of tin oxide, vanadium oxide and molybdenum oxide in low temperature nitrogen; electroconductive paste containing copper, nickel, or alloy thereof, mixed with ceramic

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