| Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003) |
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| 03/24/2009 | US7508081 Dicing die-bonding film |
| 03/24/2009 | US7507352 Luminous materials |
| 03/17/2009 | US7504316 Method and device for separating a reinforcing-plate fixed to a reinforced semiconductor wafer |
| 03/12/2009 | WO2009031472A1 Adhesive and connecting structure using the same |
| 03/11/2009 | CN100467561C Re-peelable adhesive sheet, semiconductor component using the same and producing method thereof |
| 03/10/2009 | US7501468 Adhesive composition |
| 03/04/2009 | CN101379159A Moisture-hardening compositions containing silane-functional polymers and aminosilane adducts |
| 02/26/2009 | WO2009025787A2 Adhesives with thermal conductivity enhanced by mixed silver fillers |
| 02/26/2009 | WO2009025224A1 Adhesive tape |
| 02/26/2009 | WO2009025058A1 Process for producing adhesive sheet and adhesive sheet obtained by the process |
| 02/26/2009 | DE4210277C5 Kleb- und Dichtstoff und dessen Verwendung Adhesives and sealants, and its use |
| 02/26/2009 | CA2696985A1 Adhesives with thermal conductivity enhanced by mixed silver fillers |
| 02/25/2009 | EP1633828B1 Thermally activatable removable adhesive tapes |
| 02/25/2009 | EP1185594B2 Adhesive composition comprising thermoexpandable microcapsules |
| 02/24/2009 | US7495059 Pressure sensitive adhesives; polymerization catalysts |
| 02/19/2009 | WO2009022516A1 Method for production of adhesive resin composition, resin film, and laminate |
| 02/19/2009 | DE102007038333A1 Silan-modifizierte Additive und Silanmodifizierte Polymerzusammensetzungen Silane-modified additives and silane-modified polymer compositions |
| 02/18/2009 | EP1519964B1 Polymeric photoinitiators |
| 02/18/2009 | CN101370887A Adhesive tape |
| 02/17/2009 | US7491290 Comprising first curing agent, formed by silane coupling agent and electrically conductive particles mixed with epoxy resin to produce first adhesive material, second curing agent, formed of metal chelate or metal alcoholate and electrically conductive particles mixed with second epoxy resin |
| 02/17/2009 | CA2343553C High temperature cabonaceous cement |
| 02/12/2009 | WO2009020040A1 Curable composition |
| 02/05/2009 | WO2009017160A1 Adhesive composition |
| 01/29/2009 | WO2009014077A1 Curable composition |
| 01/29/2009 | WO2009013968A1 Adhesive film, connecting method and connected body |
| 01/28/2009 | CN101356007A Inorganic sulfate ion scavenger, inorganic scavenging composition, and electronic component- sealing resin composition, electronic component-sealing material, electronic component, varnish, adhesive, |
| 01/28/2009 | CN100455636C Electrically heatable pressure-sensitive adhesive compound |
| 01/22/2009 | WO2009011421A1 Detachable adhesive containing reaction product of oxidizing agent and amine compound |
| 01/22/2009 | WO2009011383A1 Adhesive for electronic component |
| 01/22/2009 | WO2009011329A1 Curable composition |
| 01/21/2009 | EP1221986B1 Hot melt pressure sensitive adhesives |
| 01/21/2009 | CN101351261A Potting material, hollow-fiber module, and process for producing the same |
| 01/21/2009 | CN101351112A Light-permeable conductive film |
| 01/20/2009 | US7479530 Comprising one or more macromonomer units selected from perfluoroalkylpolyether, fluorinated poly(meth)acrylate, poly(perfluoroalkyl) (meth)acrylate, poly(fluoroalkyl) (meth)acrylamide, and fluorinated polyolefin, and one or more charged units; intraocular lenses |
| 01/20/2009 | US7479317 Adhesive sheet roll for wafer processing |
| 01/20/2009 | US7479288 Nanoparticulate preparation |
| 01/20/2009 | CA2637641A1 Notched applicator spatula and adhesive compound for laying parquet flooring |
| 01/15/2009 | WO2009008448A1 Adhesive for circuit member connection |
| 01/14/2009 | EP2014738A1 Adhesive composition and optical member |
| 01/14/2009 | EP2013305A1 Moisture-hardening compositions containing silane-functional polymers and aminosilane adducts |
| 01/14/2009 | CN101346449A Adhesive composition, circuit connecting material and connecting structure of circuit member |
| 01/08/2009 | WO2009005130A1 Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these |
| 01/07/2009 | EP2011844A1 Adhesive tape, semiconductor package, and electronic device |
| 01/07/2009 | EP2011834A1 Curable composition |
| 01/07/2009 | EP2011833A1 Curable resin composition |
| 01/07/2009 | CN101337433A Production technique of composite material automobile body decoration piece |
| 01/07/2009 | CN101337432A Production technique of composite material automobile body covering piece |
| 01/07/2009 | CN100449794C Solar panel including a low moisture vapor transmission rate adhesive composition |
| 01/07/2009 | CN100449732C Dicing die-bonding film |
| 12/31/2008 | WO2009001771A1 Adhesive film, connection method, and assembly |
| 12/31/2008 | WO2009001605A1 Anisotropic elctroconductive material, connection structure, and process for producing the connection structure |
| 12/31/2008 | CN101336278A Heat curable adhesive |
| 12/31/2008 | CN101333424A Water-soluble spraying glue and method for preparing same |
| 12/31/2008 | CN100447213C Double faced adhesive tape for grinding cloth and grinding sheet with the adhesive tape for roller winding |
| 12/25/2008 | US20080319152 Curable Composition |
| 12/24/2008 | EP2004746A1 Radiation-curable rubber adhesive/sealant |
| 12/24/2008 | CN101328317A Biomass based Michael addition compositions |
| 12/24/2008 | CN100446359C Laser module |
| 12/24/2008 | CN100446131C Flat-cable-coating material and flat cable |
| 12/23/2008 | US7467742 Electrically conducting adhesives for via fill applications |
| 12/18/2008 | WO2008153883A1 Room temperature curing adhesive composition having high temperature properties |
| 12/18/2008 | US20080308222 Dispersion of superparamagnetic nanoscale particles of mixed metal oxide of two divalent and one trivalent metals and having a volume-averaged particle diameter of 20 to 100 nm in a surfactant; for the production of adhesives whose properties can be modified by heating. |
| 12/18/2008 | CA2689595A1 Room temperature curing adhesive composition having high temperature properties |
| 12/17/2008 | EP1438200B1 Bookbinding process |
| 12/17/2008 | CN100443534C Base material for pressure-sensitive adhesive tape or sheet, pressure-sensitive tape or sheet using the base material, and process of producing the base material |
| 12/16/2008 | US7465778 Silante terminated polyurethane |
| 12/16/2008 | US7465492 Electrically disbondable compositions and related methods |
| 12/16/2008 | US7465479 Polymerisable monocyclic compounds |
| 12/16/2008 | CA2296043C Adhesive composition for hot bonding and bonding method using same |
| 12/11/2008 | WO2008149820A1 Bonding method, and biochemical chip and optical component produced by the method |
| 12/11/2008 | WO2008149787A1 Resin-coated metal sheet and formed object made therefrom |
| 12/11/2008 | WO2008149745A1 Bonding method, and biochemical chip and optical component produced by the method |
| 12/11/2008 | WO2008149678A1 Electronic component connecting method and joined body |
| 12/10/2008 | CN101321840A Adhesive film |
| 12/10/2008 | CN100441607C Method for preparing latent hardener |
| 12/09/2008 | CA2421095C Process for continuous production of reactive polymers with in-line post-modification and products thereof |
| 12/04/2008 | WO2008146849A1 Heat-releasable pressure-sensitive adhesive sheet |
| 12/04/2008 | WO2008146793A1 Electric device, connecting method and adhesive film |
| 12/04/2008 | WO2008146688A1 Method for producing adhesive, method for connecting electronic component and bonded body |
| 12/04/2008 | WO2008146014A2 Improved structural adhesive materials |
| 12/04/2008 | WO2008145618A1 Adhesive and sealant systems |
| 12/04/2008 | US20080299485 Reducing surface tension using a polymer containing perfluorobutanesulfonamide in repeating units such N-methyl-perfluorobutanesulfonylethyl acrylate, which is lower cost and less bioaccumulative than corresponding perfluorooctyl surfactants |
| 12/03/2008 | CN100439422C Hyperbranched poly(hydroxycarboxylic acid) polymers |
| 12/02/2008 | CA2454692C Machine-detectable adhesive tape |
| 11/27/2008 | WO2008143358A1 Electric device, connecting method and adhesive film |
| 11/27/2008 | WO2008143010A1 Adhesive, adhesive sheet, method for producing adhesive sheet, and active energy ray-curable resin composition |
| 11/26/2008 | EP1995290A1 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet making use of the same |
| 11/26/2008 | CN100437926C Method and device for separating a reinforcing-plate fixed to a reinforced semiconductor wafer |
| 11/20/2008 | WO2008140094A1 Circuit-connecting material, and connection structure for circuit member |
| 11/20/2008 | WO2008140059A1 Glass filler, photocurable coating composition and photocurable resin composition using the same, and photocurable adhesive |
| 11/20/2008 | WO2008139857A1 Anisotropic conductive adhesive film and method for producing anisotropic conductive adhesive film |
| 11/20/2008 | US20080287636 Curable Composition |
| 11/20/2008 | US20080283415 Electrically disbondable compositions and related methods |
| 11/19/2008 | EP1992665A1 Curable composition |
| 11/19/2008 | EP1992399A1 Potting material, hollow-fiber module, and process for producing the same |
| 11/19/2008 | EP1991412A2 The use of organophosphorus compounds as creping aids |
| 11/19/2008 | EP1511578B1 Method of conforming an adherent film to a substrate by application of vacuum |
| 11/19/2008 | CN101310202A Adhesive optical film and image display |
| 11/19/2008 | CN101309993A Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method |
| 11/19/2008 | CN100434125C Pvc-free multilayered tube with improved peel security for medical purpose, process for its production and use |