| Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003) |
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| 12/02/2010 | WO2010137445A1 Adhesive composition, adhesive sheet for connection of circuit member, and process for manufacture of semiconductor device |
| 12/02/2010 | WO2010137443A1 Adhesive sheet for connecting circuit member, and method for manufacturing semiconductor device |
| 12/02/2010 | WO2010137442A1 Adhesive composition, adhesive sheet, and process for manufacture of semiconductor device |
| 12/01/2010 | EP1442072B1 Superabsorbent-hydrophobic polymer two-phase compositions |
| 12/01/2010 | CN1685025B Hybrid plastisol/hot melt compositions |
| 11/25/2010 | WO2010134341A1 Organosilicon compound, and rubber composition, tire, primer composition, coating composition and adhesive agent each comprising same |
| 11/25/2010 | WO2010134266A1 Organosilicon compound, and rubber composition, tire, primer composition, coating composition and adhesive agent each utilizing same |
| 11/24/2010 | EP1100555B1 Bioadhesive compositions and wound dressings containing them |
| 11/24/2010 | CN101897245A Circuit connecting material and structure for connecting circuit member |
| 11/23/2010 | US7838100 Vehicular structural members and method of making the members |
| 11/18/2010 | WO2010131655A1 Bonding sheet |
| 11/18/2010 | WO2010131575A1 Adhesive composition, adhesive sheet for connecting circuit member, and method for manufacturing semiconductor device |
| 11/18/2010 | WO2010098431A9 Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article |
| 11/17/2010 | CN1938356B Hardenable composition |
| 11/17/2010 | CN101889065A Adhesive composition, adhesive article, adhesive composition for optical use, and adhesion method |
| 11/17/2010 | CN101517831B Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles |
| 11/16/2010 | US7833600 Double-sided pressure-sensitive adhesive sheet |
| 11/10/2010 | EP2248835A1 Curable composition |
| 11/04/2010 | WO2010126937A1 Moisture curable silylated polymer compositions containing reactive modifiers |
| 11/04/2010 | WO2010125880A1 Adhesive resin composition, laminate using same, and flexible printed wiring board |
| 11/03/2010 | EP2246403A1 Waterborne adhesive formulations |
| 11/03/2010 | EP2246400A1 Circuit connecting material |
| 11/03/2010 | CN1965044B Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 11/03/2010 | CN1720766B Method for manufacturing flexible wiring circuit board |
| 11/02/2010 | US7824754 and Isopropyltris(dioctylpyrophosphate)titanate coupler; acrylated bisphenol-glycerol epoxy resin; nonunsaturated is a bisphenol-epichlorohydrin resin; insulating adhesive; anisotropically electroconductive adhesive film; curable at low temperature; circuit boards |
| 10/28/2010 | WO2010122863A1 Solar cell module and method for manufacturing same |
| 10/27/2010 | CN101872029A Anti-newton ring sheet and touch panel using the same |
| 10/21/2010 | WO2010119685A1 Adhesive composition, bonding method, laminate and tire |
| 10/20/2010 | EP2242090A1 Film for semiconductor, method for manufacturing semiconductor device and semiconductor device |
| 10/20/2010 | EP1530532B1 Method for monitoring the air bleeding quality of an electrohydraulic braking system |
| 10/20/2010 | CN101862462A Electrode |
| 10/19/2010 | CA2225653C Adhesives |
| 10/14/2010 | WO2010116891A1 Heat-conductive massive adhesive agent, heat-conductive adhesive sheet and method for producing same |
| 10/14/2010 | WO2010116713A1 Organosilicon compound, and rubber composition, tire, primer composition, coating composition and adhesive each using the organosilicon compound |
| 10/14/2010 | WO2010116712A1 Organosilicon compound, and rubber composition, tire, primer composition, coating composition and adhesive each using the organosilicon compound |
| 10/12/2010 | US7811647 Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet |
| 10/07/2010 | WO2010113883A1 Adhesive composition for labels |
| 10/07/2010 | WO2010113813A1 Base-generating agent, photosensitive resin composition, patterning material comprising the photosensitive resin composition, patterning method and article using the photosensitive resin composition |
| 10/07/2010 | WO2010113759A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same |
| 10/06/2010 | CN1625571B Aqueous dispersions of polymer particles |
| 09/30/2010 | WO2010110135A1 Adhesive protective film, screen panel, and portable electronic terminal |
| 09/30/2010 | DE102009001771A1 Erstarrende Klebstoffe mit Silanvernetzung Solidifying adhesives with silane |
| 09/29/2010 | EP2233532A1 Curable composition |
| 09/29/2010 | EP2233531A1 Curable composition |
| 09/29/2010 | CN1914282B Moisture cross-linkable adhesive compositions |
| 09/28/2010 | US7803863 Filler-containing polymer dispersion, method for its production and use |
| 09/28/2010 | CA2468182C Articles and methods for applying color on surfaces |
| 09/21/2010 | US7799943 sodium carbonate as polymerization catalysts; for producing coatings, adhesives, sealants and elastomers |
| 09/21/2010 | US7799884 Type II H-extraction; mercapto-functional benzophenone-type chromophore bound to butadiene/styrene rubber so it does not remain in final odorless product; UV radiation curable hot melt pressure sensitive adhesive; photocurable composition with multifunctional thiol crosslinker and a polyene; thiol-ene |
| 09/16/2010 | WO2010104144A1 Modifier for resins, adhesive compositions, and thermoplastic resin compositions |
| 09/16/2010 | WO2010104055A1 (meth)acrylate polymer, resin composition, and molded article |
| 09/16/2010 | WO2010102691A1 Mounting means |
| 09/16/2010 | DE102010008452A1 Reversible Trockenklebstoffe für nasse und trockene Bedingungen Reversible dry adhesives for wet and dry conditions |
| 09/15/2010 | CN101836333A Conductive particle, circuit connecting material, and connection structure |
| 09/15/2010 | CN101836266A Coated conductive powder and conductive adhesive using the same |
| 09/15/2010 | CN101836265A Coated conductive powder and conductive adhesive using the same |
| 09/15/2010 | CN101835866A Circuit member connecting adhesive and semiconductor device |
| 09/15/2010 | CN101831248A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 09/15/2010 | CN101831247A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 09/15/2010 | CN101831246A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 09/14/2010 | US7795364 Amide linked maleinized addition polymer, especially a diene polymer, reacted with an aminated benzophenone, benzil, thioxanthone, 2,3-norboradione, anthraquinone, coumarone, or 3-carbonylcoumarone; UV curable adhesives, coatings, encapsulants; thiol-ene photocurable compositions |
| 09/14/2010 | US7795341 Ionomer-containing hot melt adhesive |
| 09/09/2010 | US20100227975 Aqueous dispersions of polymer particles |
| 09/09/2010 | US20100227101 Peeling Sheet With Adhesive of Epoxy Acrylate, Non-Unsaturated Resin and Bis(methacryloyloxyethyl) Hydrogen Phosphate |
| 09/09/2010 | US20100224316 Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet |
| 09/08/2010 | CN101827907A Self-adhesive sheet and method for producing the same |
| 09/08/2010 | CN101824301A Whole anti-UV antifatigue and anti-melanin cell adhesive and preparation method thereof |
| 09/08/2010 | CN101824285A Color-change optical protection film adhesive and preparation method thereof |
| 09/08/2010 | CN101824283A Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet |
| 09/07/2010 | US7789990 Silane functional adhesive composition and method of bonding a window to a substrate without a primer |
| 09/02/2010 | WO2010098431A1 Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article |
| 09/02/2010 | WO2010098155A1 Adhesive resin compositions, and laminates and flexible printed wiring boards using same |
| 09/01/2010 | EP2224141A1 Method and structure for bonding metal member to be bonded |
| 09/01/2010 | CN101821841A Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor |
| 09/01/2010 | CN101821352A Adhesive and connecting structure using the same |
| 09/01/2010 | CN101821348A Double-sided adhesive sheet for electronic component and method of manufacturing the same |
| 09/01/2010 | CN101821347A Adhesive film, connecting method and connected body |
| 09/01/2010 | CN101821275A Silane substituted raft reagent and silane crosslinkable polymer |
| 08/26/2010 | WO2010062624A3 Adhesive compositions for hydrophobic photopolymers |
| 08/25/2010 | EP2222146A1 Circuit connecting material and structure for connecting circuit member |
| 08/25/2010 | EP1299494B1 Preparation of hydrophilic pressure sensitive adhesives having optimized adhesive properties |
| 08/25/2010 | CN1990811B Latex binder and binding tablet |
| 08/25/2010 | CN101816221A Circuit connecting material, circuit connection structure, and method for producing the same |
| 08/25/2010 | CN101815770A Adhesive set and bonding method using the same |
| 08/24/2010 | US7780811 Dicing die-bonding film, method of fixing chipped work and semiconductor device |
| 08/19/2010 | WO2010093035A1 Conductive resin composition, process for producing electronic part using same, connecting method, connection structure, and electronic part |
| 08/19/2010 | WO2010092906A1 Heat-sensitive adhesive and heat-sensitive adhesive tape |
| 08/19/2010 | WO2010092831A1 Hydrogen energy storage system and hydrogen energy storage method |
| 08/18/2010 | EP2219212A1 Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor |
| 08/18/2010 | CN101809107A Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device |
| 08/18/2010 | CN101809105A Electroconductive pressure-sensitive adhesive tape |
| 08/17/2010 | CA2440984C Method of detackifying an edge face of a roll of tape using a radiation curable composition |
| 08/17/2010 | CA2396125C Lightweight ready-mix joint compound |
| 08/12/2010 | WO2009150328A3 Novel polyamide-based hot-melt adhesive composition |
| 08/12/2010 | DE202010001054U1 Wärmeleitfähiger elastischer Klebstoff zur Verwendung über Fußboden- bzw. Flächenheizungen Thermally conductive elastic adhesive for use on floor or surface heating |
| 08/12/2010 | DE102009007930A1 Lösung insbesondere zur Vorbehandlung eines hydrophilen Untergrundes zur Verbesserung einer Verklebung bei feuchten und nassen Bedingungen Solution, especially for pretreating a hydrophilic substrate for improving adhesion in damp and wet conditions |
| 08/10/2010 | US7772313 Pumpable heat-processable liquid dispersions for forming fused thermoplastic solids |
| 08/05/2010 | WO2010087079A1 Adhesive product and transfer tool |
| 08/05/2010 | WO2010086932A1 One-pack type cyanate-epoxy composite resin composition |
| 08/05/2010 | US20100192791 Method for obtaining a coating (metal-back printing blanket) of a typographic printing roll with non-adhesive plastic sheet, and metal-back printing blanket thus obtained |