| Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003) |
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| 07/08/2009 | CN100510806C Optical film with surface protection film and image display |
| 07/08/2009 | CN100509933C Hardening particle, manufacturing method of hardening particle and binder |
| 07/01/2009 | CN100506867C Polymer having charged units |
| 06/30/2009 | US7553902 Water-emulsifiable isocyanates having improved properties |
| 06/30/2009 | US7553882 Adding dibutylethanolamine/N,N-/ or butylethanolamine/N-/ microbiocide synergist to stabilize a stored latex paint, uncured coating, uncured sealant, or uncured adhesive formulation under anaerobic conditions |
| 06/25/2009 | WO2009078409A1 Circuit connecting material and structure for connecting circuit member |
| 06/25/2009 | WO2009025787A4 Adhesives with thermal conductivity enhanced by mixed silver fillers |
| 06/24/2009 | EP2073316A1 Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles |
| 06/24/2009 | EP2072564A1 One-component moisture-curable polymer foam |
| 06/24/2009 | EP1373424B1 Adhesive layers and release liners with pyramidal structures |
| 06/24/2009 | CN101463246A Heat-sensitive adhesive and heat-sensitive adhesive material |
| 06/24/2009 | CN101463245A Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods |
| 06/24/2009 | CN100504965C Discriminating medium and article to be discriminated |
| 06/23/2009 | US7550548 Room-temperature-curable organopolysiloxane composition |
| 06/17/2009 | CN101457134A Binder composition |
| 06/16/2009 | CA2458054C Superabsorbent-hydrophobic polymer two-phase compositions |
| 06/11/2009 | WO2009072497A1 Circuit member connecting adhesive and semiconductor device |
| 06/11/2009 | US20090149003 Dicing die-bonding film |
| 06/11/2009 | US20090148645 Double-sided pressure-sensitive adhesive tape or sheet and process of producing the same |
| 06/10/2009 | EP1238032B1 Embossed film having controlled tear |
| 06/10/2009 | DE602005005872T2 Herstellungsverfahren einer Klebefolie zum Lasersplaten mit einer kontrollierten Oberflächenrauhigkeit (Ra) Manufacturing process of an adhesive sheet for laser Platen with controlled surface roughness (Ra) |
| 06/10/2009 | CN101454419A Thermally conductive pressure-sensitive adhesive composition and thermally conductive pressure-sensitive adhesive sheet-like molded body |
| 06/10/2009 | CN100497494C Discoloration prevention in pyrithione-containing coating compositions |
| 06/09/2009 | US7544746 Hyperbranched polymers |
| 06/04/2009 | WO2009069783A1 Circuit member connecting adhesive and semiconductor device |
| 06/04/2009 | WO2008146014A3 Improved structural adhesive materials |
| 06/03/2009 | EP2065454A1 Adhesive sheet for marking |
| 06/03/2009 | CN100494298C Adhering sheet for barrel wafer processing |
| 05/28/2009 | US20090133826 Hot melt adhesives; polymeric reinforcement phase, adsorber phase; PVC-free; homogeneous molten blend; hybrid plastisol/hot melt; adhesive for packaging |
| 05/28/2009 | US20090133822 Dispersion of superparamagnetic nanoscale particles of mixed metal oxide of two divalent and one trivalent metals and having a volume-averaged particle diameter of 20 to 100 nm in a surfactant; for the production of adhesives whose properties can be modified by heating |
| 05/28/2009 | DE102007055595A1 Producing organic composition, useful e.g. as washing agent, comprises mixing n-nonyl ester (obtained by reacting n-nonyl alcohol-component with further component e.g. carboxylic acid), functional component e.g. enzyme and further additive |
| 05/28/2009 | DE102007055594A1 Producing an organic composition, useful e.g. as washing agent, comprises mixing a n-nonyl ether (obtained by reacting n-nonyl alcohol-component with a further component), functional component e.g. enzyme and further additive |
| 05/27/2009 | EP2062929A1 MOISTURE-CURABLE POLYMER HAVING SiF GROUP AND CURABLE COMPOSITION CONTAINING THE SAME |
| 05/27/2009 | EP1406980B1 Mixtures which contain carbamate groups and/or allophanate groups and can be cured thermally and by using actinic radiation |
| 05/27/2009 | CN101443381A Alkoxysilane cross-linked polymers having improved elastic recovery properties |
| 05/27/2009 | CN101440220A Biomass based Michael addition compositions |
| 05/27/2009 | CN100492586C Adhesive sheet for semiconductor device manufacture, semiconductor device using it and manufacturing method |
| 05/27/2009 | CN100491473C Two-liquid curable composition |
| 05/27/2009 | CN100491116C Building panel assembly having a protective film, method of making same and adhesive system for bonding the protective film |
| 05/26/2009 | US7536937 Cutting method of fabric material |
| 05/26/2009 | CA2399230C Oriented multilayer polyolefin films |
| 05/26/2009 | CA2180751C Vulcanized thermoplastic article |
| 05/20/2009 | EP2060589A2 Polymeric Photoinitiators |
| 05/20/2009 | CN100490119C Dicing die-bonding film |
| 05/20/2009 | CN100488788C Articles and methods for applying color on surfaces |
| 05/19/2009 | CA2417668C An acid pretreatment method to improve adhesion to aluminum alloys |
| 05/19/2009 | CA2375146C Nonwoven sheets, adhesive articles, and methods for making the same |
| 05/14/2009 | WO2009060927A1 Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor |
| 05/13/2009 | EP2058903A1 Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
| 05/13/2009 | EP2058822A1 Conductive bonding material and electronic device |
| 05/13/2009 | CN101432383A Nonaqueous pressure-sensitive adhesive composition, patches and process for production of patches |
| 05/13/2009 | CN101429341A Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods |
| 05/13/2009 | CN100487061C Curable composition |
| 05/07/2009 | WO2009058018A1 Moisture sealant wood adhesive |
| 05/07/2009 | WO2009057530A1 Adhesive composition for semiconductor and semicondutor device produced using the adhesive composition |
| 05/06/2009 | EP2056406A1 Circuit connecting material, connection structure for circuit member using the same and production method thereof |
| 05/06/2009 | EP2055756A1 Adhesive tape, joint structure, and semiconductor package |
| 05/06/2009 | EP2055753A1 Moisture sealant wood adhesive |
| 05/06/2009 | CN101426875A Adhesive tape, semiconductor package, and electronic device |
| 05/06/2009 | CN101426859A Curable composition |
| 05/06/2009 | CN101423723A Coating material compositions |
| 04/30/2009 | WO2009054410A1 Conductive particle, circuit connecting material, and connection structure |
| 04/30/2009 | WO2009054387A1 Coated conductive powder and conductive adhesive using the same |
| 04/30/2009 | WO2009054386A1 Coated conductive powder and conductive adhesive using the same |
| 04/29/2009 | EP2052380A1 Method for detaching pressure-sensitive adhesive film |
| 04/29/2009 | CN101421886A Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| 04/29/2009 | CN101421370A Vulcanizing adhesive composition |
| 04/29/2009 | CN101420826A Case and surface treating method |
| 04/29/2009 | CN101418193A Adhesive material tape and method of producing the same |
| 04/29/2009 | CN101417758A Adhesive material tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, and adhering apparatus |
| 04/29/2009 | CN100482073C Composition for providing physical anti microbial synergistic agent activity during storaging paint, coating, seal agent and adhesive |
| 04/28/2009 | CA2344666C Hand-tearable tape |
| 04/23/2009 | WO2009025787A3 Adhesives with thermal conductivity enhanced by mixed silver fillers |
| 04/23/2009 | US20090101280 Method of producing flexible single-sided polyimide copper-clad laminate |
| 04/22/2009 | EP2050766A2 Polymeric Photoinitiators |
| 04/22/2009 | EP1456303B1 Method for adhesively joining wood product surfaces and a laminated wood product |
| 04/22/2009 | CN101415769A Radiation solidified rubberized adhesive/sealant |
| 04/16/2009 | WO2009048176A1 Pressure-sensitive adhesive sheet and process for producing the same |
| 04/16/2009 | WO2009047984A1 Pressure sensitive adhesive double coated sheet for electronic components and process for producing the pressure sensitive adhesive double coated sheet |
| 04/15/2009 | EP2046909A2 Silane functional adhesive composition and method of bonding a window to a substrate without a primer |
| 04/15/2009 | CN101410340A Sealant composition having reduced permeability to gas |
| 04/15/2009 | CN100479105C Adhesive sheet semiconductor device manufacturing method using the adhesive sheet |
| 04/09/2009 | WO2009044801A1 Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device |
| 04/09/2009 | WO2009044678A1 Circuit connecting material, circuit connection structure, and method for producing the same |
| 04/09/2009 | DE102007047633A1 Vernetzbare Polymere mit heteroaromatischen Gruppen Crosslinkable polymers with heteroaromatic groups |
| 04/09/2009 | DE102007000833A1 Silan-substituierte RAFT-Reagenzien und Silan-vernetzbare Polymere Silane-substituted RAFT reagents and silane crosslinkable polymers |
| 04/08/2009 | CN101405361A Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet making use of the same |
| 04/08/2009 | CN101402832A Adhesive material tape and anisotropic conductive material tape |
| 04/08/2009 | CN101402423A Adhesive material tape, method of connecting, and press-connecting the tape, adhesive material-tape reel, adhering device |
| 04/08/2009 | CN100475923C Double faced adhesive tape for shielding light |
| 04/08/2009 | CN100475854C High acid aqueous nanocomposite dispersions |
| 04/07/2009 | US7514143 Re-peelable pressure-sensitive adhesive sheet |
| 04/07/2009 | CA2422670C Tape for flying splice, method of use, and method of manufacture |
| 04/07/2009 | CA2237676C Repositionable adhesive article |
| 04/02/2009 | WO2009041674A1 Electroconductive pressure-sensitive adhesive tape |
| 04/02/2009 | WO2009041550A1 Adhesive set and bonding method using the same |
| 04/01/2009 | EP2042580A1 Conductive adhesive |
| 04/01/2009 | EP1434827B1 Laminates with structured layers |
| 03/26/2009 | WO2009038020A1 Adhesive composition for electronic components and adhesive sheet for electronic components using the same |
| 03/25/2009 | EP2040268A1 Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |