| Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003) |
|---|
| 05/30/2012 | CN1908105B Aqueous compositions for use as adhesive and composite structure |
| 05/30/2012 | CN102482553A Light-reflective anisotropic electroconductive adhesive agent and light-emitting device |
| 05/30/2012 | CN101528594B Novel lamellar zirconium phosphate |
| 05/30/2012 | CN101443381B Alkoxysilane cross-linked polymers having improved elastic recovery properties |
| 05/30/2012 | CN101238168B Resin particle |
| 05/24/2012 | WO2012068573A2 Adhesive compositions and use thereof |
| 05/24/2012 | WO2012067232A1 Method for detaching light-transmitting rigid substrate laminate and method for manufacturing plate shaped product using same |
| 05/24/2012 | WO2012067145A1 Adhesive agent, adhesion method, and process for production of adhered material |
| 05/24/2012 | WO2012066897A1 Anisotropic conductive film, united object, and process for producing united object |
| 05/24/2012 | WO2012066805A1 Method for producing molded fiber-reinforced plastic, preform, method for producing same, and adhesive film |
| 05/24/2012 | WO2012066777A1 Protective film for use on wheel and protective-film layered body for use on wheel |
| 05/24/2012 | WO2012065716A1 Rapidly curing compound having good adhesive properties |
| 05/24/2012 | CA2818276A1 Rapidly curing compound having good adhesive properties |
| 05/23/2012 | EP1995290B1 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet making use of the same |
| 05/23/2012 | EP1263853B1 Lightweight ready-mix joint compound |
| 05/23/2012 | CN102474025A Circuit connecting adhesion film and circuit connecting structure |
| 05/23/2012 | CN102473837A Structure for bonding metal plate and piezoelectric body and bonding metho |
| 05/23/2012 | CN102473618A Film for semiconductor and semiconductor device manufacturing method |
| 05/23/2012 | CN102471664A Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
| 05/23/2012 | CN102471645A Heat-curable adhesive tape or sheet and flexible printed circuit board |
| 05/23/2012 | CN101611659B Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure |
| 05/23/2012 | CN101278024B Method of pasting, pressure-sensitive adhesive for pasting and adhesive product having pressure sensitive adhesive layer |
| 05/22/2012 | US8182648 Binders and materials made therewith |
| 05/18/2012 | WO2012064133A2 Conductive transparent adhesive composition, and conductive transparent adhesive produced by same |
| 05/18/2012 | WO2012064081A2 Underwater antifouling coating sheet and coating method |
| 05/18/2012 | WO2012063811A1 Water-dispersible oil-resistant adhesive agent composition, oil-resistant adhesive sheet, adhesion method, and oil-resistant adhesive structure |
| 05/18/2012 | WO2012063810A1 Oil-resistant, heat-resistant adhesive sheet, adhesion method, and oil-resistant, heat-resistant adhesive structure |
| 05/18/2012 | WO2012063554A1 Anisotropic conductive film |
| 05/16/2012 | EP2453468A1 Film for semiconductor and semiconductor device manufacturing method |
| 05/16/2012 | EP2453467A1 Film for semiconductor and semiconductor device manufacturing method |
| 05/16/2012 | EP2452989A1 Heat-curable adhesive tape or sheet and flexible printed circuit board |
| 05/16/2012 | DE102010051520A1 Multi-layer spacer fabrics e.g. knitted fabric or crocheted fabric for thermal regulation of building interiors, where latent heat storage materials are glued or bound in the surface layers and/or spacer threads |
| 05/16/2012 | DE102010043871A1 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung Adhesive and method for encapsulating an electronic arrangement |
| 05/16/2012 | DE102010043866A1 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung Adhesive and method for encapsulating an electronic arrangement |
| 05/16/2012 | DE102010043853A1 Haft- oder Schmelzklebmassen für feuchtigkeitsunempfindliche Verklebungen Adhesive or Schmelzklebmassen for moisture-resistant bonds |
| 05/16/2012 | CN102459489A Adhesive composition, bonding method, laminate and tire |
| 05/16/2012 | CN102459487A Moisture curable silylated polymer compositions containing reactive modifiers |
| 05/16/2012 | CN102459288A 有机硅化合物以及使用其的橡胶组合物、轮胎、底漆组合物、涂料组合物和粘合剂 Organosilicon compounds and the use thereof in the rubber composition, a tire, the primer composition, paint composition and adhesive |
| 05/16/2012 | CN102453461A Formed adhesive used for polypropylene fiber filter tips of cigarette and its preparation method |
| 05/16/2012 | CN102453448A Adhesive substance coloring method and system |
| 05/10/2012 | WO2012018232A3 Aqueous tackifier composition and method for preparing same |
| 05/09/2012 | EP2449033A2 Curable composition having a silane-modified reactive thinner |
| 05/09/2012 | EP1715016B1 Pressure sensitive adhesive composition |
| 05/09/2012 | CN1715356B Novel adhesive composition |
| 05/09/2012 | CN102449096A Adhesive composition, connection structure, connection structure manufacturing method and application of adhesive composition |
| 05/09/2012 | CN102449095A Adhesive composition, connection structure, connection structure manufacturing method and application of adhesive composition |
| 05/09/2012 | CN102443376A Strong adhesive |
| 05/08/2012 | US8172979 Porous adhesive for corrugated cardboard and method of manufacturing corrugated cardboard using the same |
| 05/03/2012 | WO2012056511A1 Adhesive film and wafer-processing tape |
| 05/03/2012 | WO2012033626A3 Uv resistant clear laminates |
| 05/02/2012 | CN102439105A Adhesive material having redetachability |
| 05/01/2012 | CA2470522C Aqueous dispersions of polymer particles |
| 04/26/2012 | WO2012053589A1 Adhesive composition, method for producing semiconductor device, and semiconductor device |
| 04/26/2012 | WO2012053478A1 Moisture-curable reactive hot-melt adhesive composition |
| 04/26/2012 | WO2012053373A1 Conductive adhesive composition, electronic device, and production method for electronic device |
| 04/26/2012 | WO2012051687A1 A concentrated gel for use in a compound mixture for promoting adherence, waterproofing and fastening power |
| 04/24/2012 | CA2477660C Assembly tape with slits and folds |
| 04/19/2012 | WO2012022493A3 Water-, solvent- and plasticizer-free, silane-modified, one-component parquet adhesive and use thereof for bonding parquet, wood floor coverings and wood-based material boards to all - including problem - substrates customary in interior fitment |
| 04/18/2012 | EP2440627A2 Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds |
| 04/18/2012 | CN1665549B Absorbent binder desiccant composition and articles incorporating it |
| 04/18/2012 | CN102421814A (meth)acrylate polymer, resin composition, and molded article |
| 04/17/2012 | US8158723 Moisture cross-linkable adhesive compositions |
| 04/17/2012 | US8157950 Aldimine and composition containing aldimine |
| 04/12/2012 | WO2012046710A1 Heat-conductive adhesive agent |
| 04/12/2012 | WO2012046695A1 Method for manufacturing semiconductor device |
| 04/12/2012 | WO2012045566A1 Curable composition having a special catalyst / softener system |
| 04/11/2012 | EP2132274B1 One-component structural adhesive having high initial adhesion |
| 04/11/2012 | CN102414288A 胶粘性树脂组合物、以及使用其的层压体和柔性印刷线路板 The adhesive resin composition and the use thereof and a flexible printed wiring board laminate |
| 04/11/2012 | CN102407574A 一种覆铜板导热胶的生产工艺 One kind CCL thermal plastic production process |
| 04/10/2012 | CA2535548C Two-pack curable composition |
| 04/05/2012 | WO2012043657A1 Adhesive |
| 04/05/2012 | WO2012043652A1 Resin film with adhesive layer, laminated film, and touchpanel |
| 04/05/2012 | WO2012043472A1 Conductive particles, anisotropic conductive material and connection structure |
| 04/05/2012 | WO2012042869A1 Expandable film, dicing film, and method for producing semiconductor device |
| 04/04/2012 | EP2436741A1 Adhesive material having redetachability |
| 04/04/2012 | CN102405266A Bonding sheet |
| 04/03/2012 | CA2555834C Tackifier dispersion |
| 03/29/2012 | WO2012039323A1 Adhesive layer for optical film, method for producing same, optical film with adhesive layer, and image display device |
| 03/28/2012 | EP2433945A1 Organosilicon compound, and rubber composition, tire, primer composition, coating composition and adhesive agent each utilizing same |
| 03/28/2012 | EP2294155B1 Novel polyamide-based hot-melt adhesive composition |
| 03/28/2012 | CN1970673B Material for connecting circuit |
| 03/28/2012 | CN102391784A Quick-acting water-proof adhesive |
| 03/22/2012 | WO2012037509A2 Electrically conductive adhesive for temporary bonding |
| 03/22/2012 | WO2012036209A1 Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method |
| 03/22/2012 | WO2012036109A1 Curable composition |
| 03/22/2012 | US20120068106 Resin composition and semiconductor device produced by using the same |
| 03/22/2012 | US20120067519 Nacre composites, methods of synthesis, and methods of use |
| 03/21/2012 | CN102388079A One-pack type cyanate-epoxy composite resin composition |
| 03/21/2012 | CN102382622A Recycling technology of waste plastic |
| 03/21/2012 | CN102382621A White latex preparation method |
| 03/21/2012 | CN102382620A Regenerating bonding glue made from waste foamed plastic |
| 03/21/2012 | CN102382591A Temporary fixing sheet for manufacturing process of electronic parts |
| 03/21/2012 | CN101578324B Dual curing polymers and methods for their preparation and use |
| 03/21/2012 | CN101426859B Curable composition |
| 03/20/2012 | US8138268 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 03/15/2012 | WO2012033626A2 Uv resistant clear laminates |
| 03/15/2012 | WO2012033030A1 Moisture-curable reactive hot-melt adhesive agent composition |
| 03/15/2012 | WO2012032958A1 Film for semiconductor device and semiconductor device |
| 03/15/2012 | WO2012031824A1 Functional materials having a controllable viscosity or reversible crosslinking via aza diels-alder reactions with bishydrazones or conjugated bis-schiff bases |
| 03/15/2012 | US20120063109 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |