| Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003) |
|---|
| 04/02/2008 | CN100378129C Michael addition compositions |
| 04/01/2008 | US7351645 Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip |
| 04/01/2008 | US7351456 Pressure-sensitive adhesive sheet roll made with recycled components of the pressure-sensitive adhesive |
| 04/01/2008 | US7351368 Flocked articles and methods of making same |
| 04/01/2008 | US7351361 Metal or alloy having a melting point of 230 degrees C. or higher, alloy having a melting point lower than 230 degrees C.; epoxy-based, phenolic-based or acrylic-based thermosetting or thermoset resin or polyethylene type, polyester type, polypropylene type or acrylic type thermoplastic resin |
| 03/27/2008 | WO2008035825A1 Adhesive sheet for marking |
| 03/27/2008 | WO2008035791A1 Bonding method and adhesive resin composition |
| 03/27/2008 | WO2008035709A1 Solvent-type removable adhesive composition and removable adhesive product |
| 03/27/2008 | US20080076878 Curable Composition Having Improved Curability and Adhesion |
| 03/26/2008 | CN101151343A Radiation-curable desiccant-filled adhesive/sealant |
| 03/26/2008 | CN100377629C Adhesive system and method for printed circuit board surface |
| 03/26/2008 | CN100376650C Polyhexanoic acid lactone adhesive composition |
| 03/25/2008 | US7348378 Formed by combining a vinyl acetate polymer, an alkali swellable thickener, an alkali material, and water; adhesive composition has a stringing length of 9 cm or less and a phase lag of 45 degrees or less; improved dispensability |
| 03/20/2008 | WO2008032539A1 MOISTURE-CURABLE POLYMER HAVING SiF GROUP AND CURABLE COMPOSITION CONTAINING THE SAME |
| 03/20/2008 | WO2008031537A1 Powder and water-based adhesive composition |
| 03/20/2008 | US20080069996 Articles and Methods for Applying Color on Surfaces |
| 03/19/2008 | EP1899432A2 Aqueous dispersions |
| 03/19/2008 | CN101146885A Anisotropic conductive adhesive and method of electrode connection therewith |
| 03/19/2008 | CN101146884A Adhesion-imparting agent and adhesion-imparting resin emulsion |
| 03/19/2008 | CN101144000A Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package |
| 03/19/2008 | CN101143997A Heat-sensitive adhesive agent and heat-sensitive adhesive sheet |
| 03/18/2008 | US7345105 Conductive adhesive composition |
| 03/18/2008 | US7344664 Pressure waveform setting method for injection pressure control and an injection molding machine |
| 03/18/2008 | CA2260257C Adhesive agent and use of such agent |
| 03/13/2008 | WO2008029580A1 Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
| 03/12/2008 | EP1897926A1 Powder and water-based adhesive composition |
| 03/12/2008 | CN101142292A Adhesive, adhesive for connecting circuit, connecting body and semiconductor device |
| 03/11/2008 | US7341642 Manufacturing method for electric device |
| 03/06/2008 | WO2008026517A1 Conductive bonding material and electronic device |
| 03/05/2008 | CN101137718A Conductive-polymer solution, antistatic coating material, antistatic hard coating layer, optical filter, conductive coating film, antistatic pressure-sensitive adhesive, antisatatic pressure-sensitive |
| 03/04/2008 | US7338685 Pressure-sensitive adhesive tape or sheet, and method for producing it |
| 02/28/2008 | WO2008023565A1 Circuit connecting material, connection structure for circuit member using the same and production method thereof |
| 02/28/2008 | WO2008023452A1 Adhesive tape, joint structure, and semiconductor package |
| 02/28/2008 | US20080051547 Curable Composition |
| 02/27/2008 | CN100371408C Pressure-sensitive adhesive tape |
| 02/27/2008 | CN100371407C Double-sided pressure-sensitive adhesive tape or sheet and process of producing the same |
| 02/26/2008 | US7335415 Tearaway adhesive tape on nonwoven support |
| 02/21/2008 | WO2008021923A1 Method for detaching pressure-sensitive adhesive film |
| 02/21/2008 | WO2008020768A1 Composite material manufactured from a binder system including waste powder coating powder |
| 02/21/2008 | US20080041522 Low volatile isocyanate monomer containing polyurethane prepolymer and adhesive system |
| 02/21/2008 | DE10337878B4 Montageband mit abschnittsweiser Abdeckfolie Assembly line with section by section covering |
| 02/20/2008 | EP1890324A2 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 02/20/2008 | CN101128886A Insulation-coated electroconductive particles |
| 02/20/2008 | CN100369982C Diester tartaric acid used as biodegradable surfactant |
| 02/19/2008 | US7332218 Electrically disbonding materials |
| 02/13/2008 | CN100368498C Pressure-sensitive adhered sheet for processing semiconductor chip |
| 02/13/2008 | CN100368459C Cationically photopolymerizable resin composition and optical disk surface protection material |
| 02/07/2008 | US20080033087 Polyoxyalkylene glycol or a methacrylate polymer containing a crosslinkable silicon group; a titaniuim chelate of an alkyl acetoacetoate or derivative; and an amide wax thickener; highly curable |
| 02/07/2008 | US20080032127 Hydroxyethyl (meth)acrylate copolymer containing a plasticizer and a pseudo-crosslinking agent that is hexamethylenediamine, ethylenediamine, diethylenetriamine, potassium aluminate, sodium or calcium aluminate, resorcinol or hydroquinone; increased cohesive force by hydrogen bonding, electrostatics. etc |
| 02/05/2008 | US7326754 Thermoset adhesive films |
| 01/31/2008 | US20080026216 Adhesive tape and edging method using same |
| 01/30/2008 | CN100365793C Adhesive sheet for processing semiconductor and semiconductor processing method |
| 01/29/2008 | US7323588 Mixture of plasticizers |
| 01/29/2008 | US7323076 Method of making a plank assembly having a protective film |
| 01/24/2008 | US20080019078 Heat-Peelable Pressure-Sensitive Adhesive Sheet and Method for Processing Adherend Using the Heat-Peelable Pressure-Sensitive Adhesive Sheet |
| 01/23/2008 | EP1881049A1 Adhesive agent for thermally insulating material and carbonized laminate for thermally insulating material using the same |
| 01/23/2008 | CN100363399C Photocurable composition and mfg. method, photocurable pressure-sensitive adhesive sheet and mfg. and bonding method |
| 01/16/2008 | EP1506267B1 Foamed contact adhesives |
| 01/16/2008 | CN101107338A Transfer-type pressure sensitive adhesive tape |
| 01/16/2008 | CN101104165A Method of improving the drying time of a thick coating |
| 01/16/2008 | CN100361998C Ionic compound, resin composition containing the same and use thereof |
| 01/15/2008 | CA2341417C Electrically disbonding materials |
| 01/10/2008 | WO2008004399A1 Bonding resin composition for fluororesin substrates and metal-clad laminates made by using the composition |
| 01/10/2008 | WO2008004367A1 Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |
| 01/10/2008 | WO2008004287A1 Conductive adhesive |
| 01/10/2008 | US20080008831 Heat-peelable pressure-sensitive adhesive sheet |
| 01/09/2008 | EP1876212A1 Pressure-sensitive adhesive containing near infrared absorbing coloring matter |
| 01/09/2008 | EP1874885A1 Radiation-curable desiccant-filled adhesive/sealant |
| 01/09/2008 | EP1507837B1 Segmented curable transfer tapes |
| 01/09/2008 | EP0966503B2 Cure-on-demand, moisture-curable compositions having reactive silane functionality |
| 01/09/2008 | CN101103087A Solid adhesive agent and raw material composition for the same |
| 01/09/2008 | CN101100197A Automobile assembly |
| 01/09/2008 | CN100360628C Adhesive |
| 01/09/2008 | CN100360626C Linerless printable adhesive tape |
| 01/09/2008 | CN100360625C Adhesive composition and adhesive article |
| 01/09/2008 | CN100360303C Method of conforming a film to a surface |
| 01/08/2008 | US7317051 comprising polymer having reactive silyl end groups and bituminous material, used as seals for waterproofing construction surfaces, saturating felts in roofing systems, bonding bitumen roofing sheets or fleece backed single ply roof membranes to roof decks and/or rigid roof insulation boards |
| 01/02/2008 | EP1519988B1 Polymeric compositions containing polymers and ionic liquids |
| 01/02/2008 | EP1268703B2 Reactive hot-melt-type adhesive granulate for insulating glass |
| 01/02/2008 | EP0946949B2 Use of swellable hot-melt adhesives |
| 12/27/2007 | US20070299214 Curable Composition |
| 12/27/2007 | US20070298672 Adhesive Composition for Sealing Electronic Component, and Process for Manufacturing Organic Electroluminescent Apparatus with Use Thereof |
| 12/26/2007 | CN101095215A Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet |
| 12/26/2007 | CN100357335C Compsns. of silylated polymer and aminosilane adhesion promoters |
| 12/25/2007 | US7312265 Acrylic pressure sensitive adhesive composition and pressure sensitive adhesive tape |
| 12/21/2007 | WO2007008558A3 Aqueous dispersions |
| 12/19/2007 | EP1319053B1 Adhesive compositions containing graft copolymers |
| 12/19/2007 | EP0928207B2 Adhesive agent and use of such agent |
| 12/18/2007 | US7309925 Dicing die-bonding film |
| 12/13/2007 | US20070287780 Curable Composition |
| 12/13/2007 | US20070286986 Method of sealing an array of cell microstructures using microencapsulated adhesive |
| 12/12/2007 | EP1865041A1 Adhesion-imparting agent and adhesion-imparting resin emulsion |
| 12/12/2007 | EP1865040A1 Fabric pressure-sensitive adhesive tape |
| 12/12/2007 | CN101085873A 可固化组合物 The curable composition |
| 12/12/2007 | CN100354372C Compositions having improved bath life |
| 12/12/2007 | CN100354315C Polymeric photoinitiators |
| 12/12/2007 | CN100354314C Emulsion polymerization methods involving lightly modified clay and compositions comprising same |
| 12/11/2007 | US7307350 Integrated circuit chip bonding sheet and integrated circuit package |
| 12/06/2007 | WO2003037849A3 Acicular crystals of hydrazine-based diurea derivatives and their use as rheology modifiers in coating and adhesive compositions |
| 12/05/2007 | EP1862520A1 film labels |