Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003)
08/2007
08/15/2007CN101016441A Pressure-sensitive adhesive tape or sheet, and method for producing the same
08/09/2007WO2007089705A1 Sealant composition having reduced permeability to gas
08/09/2007WO2007088666A1 Heat curable adhesive
08/09/2007CA2640370A1 Sealant composition having reduced permeability to gas
08/08/2007EP1816168A1 Curable composition
08/08/2007EP1816088A1 Water-soluble film roll and method for paying out water-soluble film
08/08/2007CN1330727C Laminates with structured layers
08/08/2007CN1330681C Aqueous silylated urethane composition, aqueous adhesives for wrapping, and aqueous contact adhesives
08/07/2007CA2353400C Coacervate stabilizer systems
08/01/2007CN1329470C Binding composition, electric circuit connecting material, electric component connecting structure and production thereof
07/2007
07/31/2007US7250467 Room-temperature-curable organopolysiloxane composition
07/31/2007CA2282462C Discoloration prevention in pyrithione-containing coating compositions
07/31/2007CA2179907C Use of bicontinuous microemulsions as pressure sensitive adhesives
07/26/2007WO2007083566A1 Oxidant-containing demountable adhesive
07/26/2007US20070172648 Double-sided pressure-sensitive adhesvie sheet
07/25/2007EP1810996A1 Curable composition
07/25/2007EP1810995A1 Curable composition
07/25/2007EP1810994A1 Curable composition
07/25/2007EP1387874B1 Adhesive composition and adhesive article
07/24/2007US7247606 Ethoxylated triethanolamines and alkyl polyglycosides; surfactants and defoaming agents
07/19/2007US20070167584 Pressure senstive adhesive composition
07/18/2007EP1807468A1 Method of primerless bonding
07/18/2007CN1326943C Two-part polyurethane adhesives for structural finger joints and method therefor
07/18/2007CN1326636C Cleaning sheet, cleaning functional carrier member, and method for cleaning substrate processors comprising them
07/18/2007CN101001920A Reactive hot-melt resin composition and reactive hot-melt adhesive
07/12/2007WO2007077833A1 Potting material, hollow-fiber module, and process for producing the same
07/12/2007WO2007077779A1 Inorganic sulfate ion scavenger, inorganic scavenging composition, and electronic component-sealing resin composition, electronic component-sealing material, electronic component, varnish, adhesive, paste and product using those
07/11/2007EP1185596B1 Non-fogging pressure sensitive adhesive film material
07/10/2007US7240873 Machine-detectable adhesive tape
07/05/2007WO2007074652A1 Adhesive composition, circuit connecting material and connecting structure of circuit member
07/04/2007CN1993388A Bonding compositions
07/04/2007CN1993193A Work subject material, surface protection sheet and method of working
07/04/2007CN1990811A Latex binder and binding tablet
07/03/2007US7239380 Tensioning rail applied by injection molding
06/2007
06/28/2007WO2007072799A1 Adhesive composition for optical use and optical functional film
06/27/2007EP1800865A2 A printing plate for flexographic printing
06/27/2007EP1800864A2 Carrier for a printing plate in a flexographic printing press
06/27/2007EP1664229B1 Water soluble hot-melt-type adhesive
06/27/2007EP1438362B1 Polyolefin pressure sensitive adhesive tape with an improved priming layer
06/27/2007EP1395639B1 Hot-extrudable thermofusible self-adhesives and the use thereof in multi-layer films
06/26/2007US7235600 Waterborne copolymer dispersion
06/26/2007US7235302 Fluoropolymer bonding composition and method
06/26/2007CA2173855C Pressure-sensitive adhesives having microstructured surfaces
06/21/2007US20070142499 Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor
06/21/2007US20070137791 Formed by combining a vinyl acetate polymer, an alkali swellable thickener, an alkali material, and water; adhesive composition has a stringing length of 9 cm or less and a phase lag of 45 degrees or less; improved dispensability
06/21/2007US20070137782 Dicing die-bonding film, method of fixing chipped work and semiconductor device
06/20/2007EP1472323B1 Stretch releasable foams articles including same and methods for the manufacture thereof
06/20/2007EP1461365B1 INITIATOR SYSTEMS COMPRISING beta-KETONE COMPOUNDS AND BONDING COMPOSITIONS MADE THEREWITH
06/20/2007EP1441827A4 Branched reaction products
06/20/2007CN1322530C Lamp-capping cement for electric lamps
06/20/2007CN1322082C Pressure-sensitive adhesive tape
06/20/2007CN1322060C Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
06/19/2007US7232613 Base material for pressure-sensitive adhesive tape or sheet, pressure-sensitive tape or sheet using the base material, and process of producing the base material
06/14/2007WO2007067404A2 Emulsifiers for use in water-based tackifier dispersions
06/14/2007WO2007066640A1 Hardenable pressure-sensitive adhesive film
06/14/2007US20070135543 Hot melt adhesive composition
06/13/2007EP1794235A1 Electroconductive resin composition, production method and use thereof
06/13/2007EP1168980B1 Adhesive system for silicones
06/13/2007CN1981012A Improved adhesive
06/13/2007CN1978537A Aqueous polymer dispersions for stabilizing actives
06/13/2007CN1978536A Novel material forming supramolecular structures, process and uses
06/12/2007US7230122 Arylsulfonium salts of 1-halothioxanthones and 2-decyl-1-tetradecyl bromide as an intermediate for their preparation; photocurable adhesive, coating or sealant compositions
06/07/2007US20070125890 Method for the production of powder with high tannin content and its use
06/06/2007EP1792962A1 Iodine/iodide-containing hot melt coatable adhesive, and uses therefor
06/06/2007EP1537185B1 Smoke suppressant hot melt adhesive composition
06/06/2007CN1977017A Laminated film using adhesive composition therein and its application, and the adhesive composition
06/06/2007CN1320076C Adhesive for sealing organic electroluminescent element and use thereof
06/05/2007US7226967 Crosslinked hot melt pressure sensitive adhesive; mixture of tackifier resin, phenol-formaldehyde resin and promoter
06/01/2007CA2569291A1 Novel material forming supramolecular structures, process and use
05/2007
05/31/2007US20070123662 Pressure sensitive adhesive composition
05/30/2007EP1499679B1 Compositions having improved bath life
05/30/2007EP1373388B1 Release films
05/30/2007CN1971888A Adhesives and electric devices
05/30/2007CN1970673A Material for connecting circuit
05/30/2007CN1970671A Adhesives and electric devices
05/30/2007CN1319075C Electro-conductive metal paste
05/30/2007CN1318532C Flame retardant foams
05/30/2007CN1318531C Adhesive agent, water contact indicating system and label containing same
05/24/2007WO2007058159A1 Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method
05/24/2007US20070116949 Shading decorative sheet
05/23/2007EP1788035A1 Reactive hot-melt resin composition and reactive hot-melt adhesive
05/23/2007EP1788016A1 Radiation curable silicone composition
05/23/2007EP1786878A2 An adhesive compound composition, laminated film using it and uses thereof
05/23/2007CN1966596A Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive article
05/23/2007CN1317351C Improved adhesives for bonding composites
05/23/2007CN1317328C Aqueous nanocomposite water dispersions: processes, compositions, and uses thereof
05/23/2007CN1317172C Mark transfer tool, mark transfor web and manufacture method for mark transfer web
05/22/2007CA2197213C Method of making a packaged hot melt adhesive
05/18/2007WO2007055176A1 Pressure-sensitive adhesive base and adhesive patch of percutaneous absorption type
05/17/2007US20070111392 Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board
05/16/2007CN1965044A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
05/16/2007CN1962801A Process for treatment of waste rubber waterproof glue
05/16/2007CN1315966C Stretch releasable foams bonding articles
05/16/2007CN1315965C Segmented curable transfer tapes
05/16/2007CN1315963C Process for producing electrical apparatus
05/16/2007CN1315917C Superabsorbent-hydrophobic polymer two-phase compositions
05/10/2007WO2007052661A1 Conductive adhesive
05/10/2007US20070104973 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
05/09/2007EP1783820A1 Process for producing ic chip
05/03/2007WO2007049666A1 Fiber-reinforced composite resin composition, and adhesive and sealing agent
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