C09J 201 - Adhesives based on unspecified macromolecular compounds

Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003)
11/2011
11/16/2011	CN102245728A Adhesive composition and adhesive sheet
11/16/2011	CN102245726A 粘合片 Adhesive sheet
11/16/2011	CN101495591B Silane functional adhesive composition and method of bonding a window to a substrate without a primer
11/16/2011	CN101454419B Thermally conductive pressure-sensitive adhesive composition and thermally conductive pressure-sensitive adhesive sheet-like molded body
11/09/2011	EP1619219B1 Curable composition
11/02/2011	EP2383320A1 Adhesive product and transfer tool
11/02/2011	CN102232104A Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same
11/02/2011	CN101605860B Conductive adhesive composition, conductive adhesive sheet and conductive adhesive tape
11/02/2011	CN101568574B Oxetane-containing resin, and adhesive agent and resist agent each using the same
10/2011
10/27/2011	WO2011132749A1 Adhesive laminate and surface protective sheet
10/27/2011	WO2011132578A1 Anisotropic conductive film, bonded body, and connection method
10/27/2011	DE102010018434A1 One-component adhesive, useful assembly adhesive for bonding absorbent and non absorbent substrates, comprises silane-terminated polymer, which is solvent-free, and cross-linked under the influence of moisture without foam
10/26/2011	EP2046909B1 Silane functional adhesive composition and method of bonding a window to a substrate without a primer
10/25/2011	US8044117 Latent hardener, process for producing the same, and adhesive containing latent hardener
10/25/2011	US8043534 An adhesive comprising a maleimide and an aromatic diene or an aromatic monoene which cure to form useful thermosetting resins for the microelectronic packaging industry; semiconcuctor dies; addition polymerization/Diels-Alder reaction; heat and acid resistance; toughness; noncracking; nondestructive
10/20/2011	WO2011129373A1 Light-reflective anisotropic conductive adhesive agent, and light emitting device
10/20/2011	WO2011129372A1 Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film
10/20/2011	WO2011087741A3 Moisture cure hot melt adhesives
10/19/2011	EP2377906A1 Adhesive composition and adhesive sheet
10/19/2011	EP2377904A1 Adhesive sheet
10/19/2011	CN102224215A Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same
10/19/2011	CN102224211A Double-faced pressure-sensitive adhesive tape for solar cell module
10/19/2011	CN101279526B Method for manufacturing high heat-resistant copper-clad panel
10/18/2011	CA2439361C Adhesive prepreg face sheets for sandwich panels
10/18/2011	CA2416258C Absorbable adhesive compositions
10/13/2011	WO2011125778A1 Adhesive composition, bonding sheet, and semiconductor device
10/13/2011	WO2011125711A1 Sheet for forming resin film for chip, and method for manufacturing semiconductor chip
10/13/2011	WO2011125683A1 Adhesive sheet for semiconductor wafer processing
10/13/2011	WO2011125088A1 Bonding material for fuel cell, and fuel cell
10/12/2011	EP2152831B1 Improved structural adhesive materials
10/11/2011	CA2551476C Systems for attaching wood products
10/05/2011	EP2371916A1 Double-faced pressure-sensitive adhesive tape for solar cell module
10/05/2011	CN101195731B Emulsion based adhesive product
10/04/2011	US8030427 Curable composition
09/2011
09/29/2011	WO2011118719A1 Adhesive composition, use thereof, connection structure for circuit members, and method for producing same
09/29/2011	WO2011118506A1 Adhesive composition, adhesive tape, method for processing semiconductor wafer and method for producing tsv wafer
09/29/2011	WO2011118488A1 Adhesive composition and adhesive tape
09/29/2011	WO2011118367A1 Laminated body
09/29/2011	DE102010016104A1 Two-component adhesive and sealant system, useful e.g. for bonding plastics, comprises a first and/or second component comprising e.g. self-crosslinking polymers based on e.g. maleic acid-polystyrene-co-polymers and/or polyurethane
09/28/2011	CN102199414A Macromolecular adhesive
09/28/2011	CN101137718B Conductive-polymer solution manufacture method
09/28/2011	CN101052477B Particle classifying apparatus, and adhesive containing particle classified by the apparatus
09/22/2011	WO2011114993A1 Cross-linked polymer particle and method for producing same
09/22/2011	WO2011114871A1 Polarizing plate, method for evaluating polarizing plate, and method for producing polarizing plate
09/22/2011	WO2011047131A3 Primer compositions to toughen adhesive bonds
09/21/2011	EP1339073B1 Electroconductive metal paste and method for production thereof
09/21/2011	CN101816221B Circuit connecting material, circuit connection structure, and method for producing the same
09/21/2011	CN101230241B Adhesive for electrode connection and connecting method using it
09/21/2011	CN101144000B Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
09/15/2011	WO2011111784A1 Adhesive reel
09/15/2011	WO2011110384A1 Tile adhesives based on silane-modified polymers
09/15/2011	WO2011110305A1 Dual curing compound and use of same
09/15/2011	DE102010002808A1 Fliesenkleber auf Basis Silan-modifizierter Polymere Tile adhesive based on silane-modified polymers
09/14/2011	EP1168980B2 Adhesive system for silicones
09/09/2011	WO2011108490A1 Electrically conductive adhesive tape
09/09/2011	WO2011108442A1 Pressure-sensitive adhesive sheet
09/09/2011	WO2011059994A3 Polymeric compositions and method of making and articles thereof
09/09/2011	CA2792037A1 Pressure-sensitive adhesive sheet
09/07/2011	EP2363440A1 Adhesive composition for the manufacturing of corrugated paper board
09/07/2011	EP2150495B1 Adhesive and sealant systems
09/07/2011	CN1977017B Laminated film using adhesive composition therein and its application, and the adhesive composition
09/07/2011	CN102177213A Adhesive laminate
09/07/2011	CN102177212A Adhesive film
09/01/2011	WO2011105211A1 Laminated glass lens for glasses
08/2011
08/31/2011	CN1856559B Adhesive agent and heating element using the same for adhesion
08/31/2011	CN1533724B Adhesive coated flat plate in shoe used for making shoe sole
08/31/2011	CN102171307A Heat-resistant and highly heat-conductive adhesive agent
08/31/2011	CN102171306A Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive
08/31/2011	CN101755328B Adhesive for electronic component
08/31/2011	CN101632199B Circuit-connecting material, and connection structure for circuit member
08/25/2011	WO2011102170A1 Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component
08/25/2011	DE102010009145A1 Leichte pastöse feuerfeste Kleber und ihre Verwendung Light pasty refractory cement and their use
08/24/2011	EP2358837A1 Composition comprising a hydrophobin for gluing paper products
08/24/2011	CN102165028A Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component
08/24/2011	CN102165016A Curable composition and cured product thereof
08/24/2011	CN101831248B Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
08/24/2011	CN101568994B Laser dicing sheet and method for manufacturing chip body
08/17/2011	EP2357215A1 Use of an adhesive composition, a circuit connecting material, a process for the production of a circuit member connection structure and a semiconductor device
08/17/2011	EP1519988B2 Polymeric compositions containing polymers and ionic liquids
08/17/2011	CN102160163A Semiconductor device and method for manufacturing same
08/17/2011	CN102157407A Use method of adhesive for circuit member connection
08/17/2011	CN102153963A Hot-melt pressure-sensitive structural adhesive film and preparation technique thereof
08/10/2011	CN102149778A Surface-protective film and laminate
08/03/2011	EP2351805A1 Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same
08/03/2011	EP2351804A1 Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same
08/03/2011	CN102144432A Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal
08/02/2011	US7988809 Aircraft floor and interior panels using edge coated honeycomb
07/2011
07/28/2011	WO2011090046A1 Curable resin composition
07/28/2011	WO2011072056A3 Composition comprising alkoxy group containing polymers, an aloxysilyl group containing reactant and a transesterification catalyst. sealant and adhesive made by transesterification process
07/27/2011	EP2348087A1 Adhesive composition, circuit connecting material and connecting structure of circuit member
07/27/2011	EP1303569B2 Binding agents and binding agent compositions containing alkoxy silyl groups, method for the production and use thereof
07/27/2011	CN102137796A Decorative can body and process for producing the same
07/27/2011	CN101297000B Fiber-reinforced composite resin composition, and adhesive and sealing agent
07/21/2011	US20110177329 Adhesive blends, articles, and methods
07/21/2011	US20110176288 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
07/21/2011	DE102010000881A1 1K- Kaschierklebstoff mit Silanvernetzung 1K laminating with silane
07/20/2011	CN102131883A Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition
07/20/2011	CN102131882A Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component
07/20/2011	CN101528842B Film base material and adhesive tape
07/14/2011	WO2011083824A1 Circuit connecting adhesion film and circuit connecting structure

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