| Patents for C09J 201 - Adhesives based on unspecified macromolecular compounds (8,003) | 
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| 07/14/2011 | WO2011083809A1 Tac base for cycloolefin polymer bonding, tac bonding member, and liquid crystal display device | 
| 07/14/2011 | US20110172372 Curable composition and method for improving recovery properties and creep properties | 
| 07/13/2011 | CN102120927A Adhesive composition for semiconductor device and die attach film | 
| 07/12/2011 | US7976670 Surface insensitive anaerobic adhesive and sealant compositions | 
| 07/07/2011 | WO2011082327A1 Moisture curable adhesive composition and method for installing hardwood floors | 
| 07/07/2011 | CA2785892A1 Moisture curable adhesive composition and method for installing hardwood floors | 
| 07/06/2011 | EP2341116A1 Polymeric compound comprising a polymer chain and at least one silyl group bound to the polymer chain and one silyl group bound to the polymer chain | 
| 07/06/2011 | EP2341106A1 Curable composition and cured product thereof | 
| 07/06/2011 | CN102119427A Conductive adhesive and LED substrate using the same | 
| 07/06/2011 | CN102115659A Processing technology of foaming material | 
| 07/06/2011 | CN102115650A Carboxylated lignin based binders | 
| 07/05/2011 | US7973403 Adhesive sheet for light-emitting diode device and light-emitting diode device | 
| 07/05/2011 | US7973108 Curable composition | 
| 07/05/2011 | CA2624095C Method of affixation, and pressure-sensitive adhesive for use in affixation | 
| 07/05/2011 | CA2359054C Autodepositable adhesive | 
| 06/30/2011 | WO2011078313A1 Intermediate film for laminated glass, multilayer intermediate film for laminated glass, and laminated glass | 
| 06/30/2011 | WO2011077922A1 Temporarily fixing composition | 
| 06/29/2011 | EP2339695A1 Circuit connecting material, connection structure for circuit member using the same and production method thereof | 
| 06/29/2011 | EP2338938A1 Curable composition and cured product thereof | 
| 06/29/2011 | CN102112568A Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device | 
| 06/29/2011 | CN101570681B Bond composition and optical film | 
| 06/28/2011 | US7968188 Electrically disbonding materials | 
| 06/23/2011 | WO2011074619A1 Near-infrared absorptive coloring matter and near-infrared absorptive composition | 
| 06/23/2011 | WO2011074414A1 Aqueous dispersion adhesive composition, and adhesive sheet | 
| 06/23/2011 | US20110147952 Dicing die-bonding film | 
| 06/22/2011 | EP2336263A1 Heat-resistant and highly heat-conductive adhesive agent | 
| 06/22/2011 | EP2336260A1 Adhesive laminate | 
| 06/22/2011 | EP2336210A1 Silane-functional polymer that does not liberate methanol upon cross-linking | 
| 06/22/2011 | DE102009059210A1 Radikalisch polymerisierbarer Befestigungsmörtel mit Silanzusätzen Radically polymerizable fixing mortar with Silanzusätzen | 
| 06/22/2011 | CN102105935A Adhesive, sheet for manufacturing optical recording medium, and optical recording medium | 
| 06/22/2011 | CN102105552A Adhesive material, pressure-sensitive adhesive sheet, and use thereof | 
| 06/22/2011 | CN102105546A Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor | 
| 06/22/2011 | CN101523561B Film for semiconductor, method for producing film for semiconductor, and semiconductor device | 
| 06/16/2011 | WO2011071036A1 Member adhesion method and polymer composite | 
| 06/16/2011 | US20110139819 Multiphase acrylic adhesives | 
| 06/15/2011 | EP2333875A1 Back sheet of colar cell and manufacturing method thereof | 
| 06/15/2011 | EP2331645A2 Patterned soft adhesives and method of manufacture | 
| 06/15/2011 | CN1918583B Electronic device | 
| 06/15/2011 | CN1910249B Adhesive composition | 
| 06/15/2011 | CN102093737A Composition for copper foil-clad laminated sheet and copper foil-clad laminated sheet prepared from composition | 
| 06/15/2011 | CN101346449B Adhesive composition, circuit connecting material and connecting structure of circuit member | 
| 06/14/2011 | CA2573531C Adhesive composition for the manufacturing of corrugated paper board | 
| 06/08/2011 | EP2328990A2 Pressure sensitive adhesive compositions and articles prepared using such compositions | 
| 06/03/2011 | WO2011065341A1 Double-sided pressure-sensitive adhesive sheet for optical use | 
| 06/01/2011 | EP2328147A1 Adhesive, sheet for manufacturing optical recording medium, and optical recording medium | 
| 05/25/2011 | CN1950459B Curable composition improved in solidification and adhesiveness | 
| 05/25/2011 | CN102077688A Process for producing organic electroluminescent panel | 
| 05/25/2011 | CN102077135A Electronic paper manufacturing method and double-sided adhesive tape for electronic paper formation process | 
| 05/19/2011 | WO2011057896A1 Adhesive and sealant system | 
| 05/19/2011 | DE102010043486A1 Binding flat, flexible substrates to non-flexible substrates, comprises applying an adhesive to flexible substrate and adhering flexible substrate coated with adhesive to non-flexible substrate, where adhesive contains carbodiimide groups | 
| 05/19/2011 | DE102009046739A1 Two-component adhesive and sealant system, useful e.g. for bonding plastics, comprises a first and/or second component comprising e.g. self-crosslinking polymers based on e.g. maleic acid-polystyrene-co-polymers and/or polyurethane | 
| 05/18/2011 | EP2322585A1 Adhesive composition, circuit connecting material and connecting structure of circuit member | 
| 05/18/2011 | EP2322445A1 Decorative can body and process for producing the same | 
| 05/18/2011 | CN102066515A Novel polyamide-based hot-melt adhesive composition | 
| 05/12/2011 | WO2011055784A1 Thermopolymerization initiator system and adhesive composition | 
| 05/12/2011 | WO2011055580A1 Adhesive composition, circuit connecting structure, semiconductor device and adhesion improvement agent for glass | 
| 05/11/2011 | EP2319893A1 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition | 
| 05/11/2011 | EP2319892A1 Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component | 
| 05/11/2011 | CN102057012A Flame-retardant adhesive composition and laminated film | 
| 05/11/2011 | CN102057011A Heat curable adhesive and resin laminated-type IC card | 
| 05/11/2011 | CN102051140A Thermally conductive composition | 
| 05/10/2011 | US7939604 Pressure sensitive adhesive composition for optical members, pressure sensitive adhesive layer for optical members, pressure sensitive adhesive optical member and image display | 
| 05/05/2011 | WO2011052730A1 Film for protecting coating film | 
| 05/05/2011 | WO2011051056A1 Laminating adhesive having silane cross-linking | 
| 05/05/2011 | DE102009046269A1 Harnstoffgebundende Alkoxysilane zum Einsatz in Dicht- und Klebstoffen Harnstoffgebundende alkoxysilanes used in sealants and adhesives | 
| 05/05/2011 | DE102009046268A1 Curable composition, useful as an adhesive-, a sealant- or a coating material, comprises polyether or polyacrylic acid ester with silyl end group, an organotin compound and a compound exhibiting at least two functional groups | 
| 05/05/2011 | DE102009046190A1 Kaschierklebstoff mit Silanvernetzung Laminating with silane | 
| 05/04/2011 | CN201815271U Adhesive substance coloring system | 
| 05/04/2011 | CN102047347A Circuit connection material and circuit connection structure | 
| 05/04/2011 | CN102040873A Multifunctional reflecting heat-insulating waterproof paint | 
| 05/04/2011 | CN101056946B Curable composition | 
| 05/04/2011 | CN101040023B Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | 
| 04/28/2011 | WO2011048874A1 Pressure-sensitive adhesive layer for optical film, pressure-sensitive adhesive type optical film, and image display device | 
| 04/27/2011 | EP2315500A1 Process for producing organic electroluminescent panel | 
| 04/27/2011 | EP2315215A1 Conductive adhesive and led substrate using the same | 
| 04/27/2011 | CN1930262B Heat-peelable pressure-sensitive adhesive sheet and method of processing adhered with the heat-peelable pressure-sensitive adhesive sheet | 
| 04/27/2011 | CN102031009A Heat-conductive composition | 
| 04/21/2011 | WO2011047131A2 Primer compositions to toughen adhesive bonds | 
| 04/21/2011 | WO2011046176A1 Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module | 
| 04/21/2011 | WO2011045962A1 Light reflecting conductive particles, anisotropic conductive adhesive, and light emitting device | 
| 04/20/2011 | EP2311921A1 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device | 
| 04/20/2011 | CN201801482U Automatic production machine for mining anchoring agent | 
| 04/20/2011 | CN102026795A Bendable polycarbonate resin laminate, optically transparent electromagnetic wave shield laminate, and manufacturing method thereof | 
| 04/20/2011 | CN102020973A Hot melt adhesive for bonding fabrics | 
| 04/20/2011 | CN101578698B Adhesive for connection of circuit member and semiconductor device using the same | 
| 04/20/2011 | CN101016441B Pressure-sensitive adhesive tape or sheet, and method for producing the same | 
| 04/19/2011 | US7927703 Stability, long term clarity, bond strength; high glass transition temperature pressure sensitive adhesive and crosslinking agent; optical multilayer assemblies | 
| 04/19/2011 | CA2398709C Block copolymer based hot melt adhesive | 
| 04/13/2011 | EP2308940A1 Adhesive material, pressure-sensitive adhesive sheet, and use thereof | 
| 04/13/2011 | CN1746249B Adhesive tape and mounting method for image sensor therewith | 
| 04/13/2011 | CN102017816A Circuit connecting material, film-like adhesive, adhesive reel, and circuit connecting structural body | 
| 04/13/2011 | CN102017016A Connecting material and semiconductor device | 
| 04/13/2011 | CN102011459A Glass fiber reinforced plastic wall panel with acid gas corrosion resistance | 
| 04/13/2011 | CN101056945B Curable composition | 
| 04/07/2011 | WO2011040498A1 Adhesive | 
| 04/07/2011 | WO2011040442A1 Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal | 
| 04/07/2011 | WO2011040438A1 Adhesive composition | 
| 04/06/2011 | EP2305451A1 Bendable polycarbonate resin laminate, optically transparent electromagnetic wave shield laminate, and manufacturing method thereof | 
| 04/06/2011 | CN1923905B Polymer binding resins | 
| 04/06/2011 | CN102007190A Adhesive material tape and adhesive material tape wound body |