Patents for H05K 1 - Printed circuits (98,583)
07/2013
07/03/2013CN103188882A Circuit board and manufacture method thereof
07/03/2013CN103188880A Circuit board and fabrication method thereof
07/03/2013CN103188874A Controlled depth milling location method and printed circuit board
07/03/2013CN103188873A Forming machining method of PCB and PCB
07/03/2013CN103188872A Transplant structure of multi-linkage printed circuit board
07/03/2013CN103188871A Transplant anti-deviation anti-break structure of multi-linkage printed circuit board
07/03/2013CN103188870A Transplant strengthening structure of multi-linkage printed circuit board
07/03/2013CN103188869A 柔性印刷线路板 Flexible printed circuit boards
07/03/2013CN103188868A 电路板结构 Circuit board structure
07/03/2013CN103188867A Multilayer electronic structure having novel transmission line
07/03/2013CN103188866A Printed wiring board and method for manufacturing printed wiring board
07/03/2013CN103188865A Wiring substrate and method of manufacturing the same
07/03/2013CN103188864A A printed circuit board and a manufacturing method thereof
07/03/2013CN103188863A Printed circuit board plate and manufacturing method thereof and printed circuit board and packaging method thereof
07/03/2013CN103188862A Printed circuit board (PCB) and manufacturing method thereof and electronic component
07/03/2013CN103188861A Printed circuit board laid with differential pairs
07/03/2013CN103187615A Antenna, manufacturing method of antenna, printed circuit board and communication terminal
07/03/2013CN103187384A Metal dielectric layer, manufacturing method thereof and circuit board
07/03/2013CN103187073A Suspension board with circuit
07/03/2013CN103186277A Printed circuit, and printed circuit for touch screen
07/03/2013CN103186276A Printed circuit, and printed circuit for touch screen
07/03/2013CN103183961A Polyamic acid resin solution containing interpenetrating polymer and laminate using same
07/03/2013CN103183926A Resin composition and sheet thereof, and sheet preparation method, wiring plate material, wiring plate, light source component and semiconductor device
07/03/2013CN103183809A Epoxy resin composition for transparent circuit board, and laminated glass sheet
07/03/2013CN102843857B Printed wiring board with pads
07/03/2013CN102143653B Printed circuit board for preventing point discharge
07/03/2013CN102124824B Additional functionality single lammination stacked via with plated through holes for multilayer printed circuit boards
07/03/2013CN102113423B Substrate module and method for manufacturing same
07/03/2013CN102047774B Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board
07/03/2013CN101836341B Surge protection circuit for passing DC and RF signals
07/03/2013CN101631424B Rigid and flexible circuit board and manufacture method thereof
07/02/2013US8477512 Electronic device
07/02/2013US8477507 Suspension board assembly sheet with circuits and method for manufacturing the same
07/02/2013US8477506 Injection molded control panel with in-molded decorated plastic film that includes an internal connector
07/02/2013US8476538 Wiring substrate with customization layers
07/02/2013US8476537 Multi-layer substrate
07/02/2013US8476536 Wiring substrate and method for manufacturing the same
07/02/2013US8476535 Multilayered printed wiring board and method for manufacturing the same
07/02/2013US8476534 Multilayer printed board and method for manufacturing the same
07/02/2013US8476533 Printed circuit board
07/02/2013US8476532 Multilayer flexible printed circuit board and electronic device
07/02/2013US8476531 Flex-rigid wiring board and method of manufacturing the same
07/02/2013US8475178 Electrical connector having improved insulative housing
07/02/2013US8475177 Backplane cable interconnection
07/02/2013US8474722 Image sensor based optical reader
07/02/2013US8474138 Method of manufacturing the ink-jet head
06/2013
06/27/2013WO2013095922A1 Printed circuit boards and methods of manufacturing printed circuit boards
06/27/2013WO2013095402A1 Low profile zero/low insertion force package top side flex cable connector architecture
06/27/2013WO2013094950A1 Heat radiation printed circuit board, method of manufacturing the same, backlight unit including the same, and liquid crystal display device
06/27/2013WO2013094922A1 Printed circuit board for memory card and method of manufacturing the same
06/27/2013WO2013094842A1 Printed circuit board and method of fabricating the same
06/27/2013WO2013094213A1 Ceramic copper circuit board and semiconductor device employing same
06/27/2013WO2013092683A1 Operating device
06/27/2013WO2013092435A1 Connection board, optoelectronic component arrangement, and illumination device
06/27/2013WO2013092127A2 Circuit carrier having a conducting path and an electric shield, and method for producing said circuit carrier
06/27/2013WO2013092070A1 Control device for a motor vehicle
06/27/2013WO2013092014A1 Control device and method for producing a control device for a motor vehicle
06/27/2013WO2013091784A1 Method for producing an electrical radiofrequency connection between two plate-shaped conductor track sections and an associated electrical radiofrequency connection
06/27/2013WO2013091197A1 Resin composition and dielectric layer and capacitor produced therefrom
06/27/2013US20130165189 Terminal device and transparent substrate
06/27/2013US20130164954 Attachment mechanism for electronic component
06/27/2013US20130164556 Circuit board with thermally conductive layers and manufacturing method therefor
06/27/2013US20130164487 Encapsulation and production of an encapsulated printed circuit board assembly
06/27/2013US20130163996 Printed Circuit Board and Optical Transmission Device
06/27/2013US20130163253 White reflective flexible printed circuit board
06/27/2013US20130163210 Integrated flex tail circuit packaging
06/27/2013US20130163209 Electronics assembly divider plate
06/27/2013US20130162929 Display Device
06/27/2013US20130162922 Connecting structure of electronic apparatus and display device using the same
06/27/2013US20130161809 Substrate structure, semiconductor package device, and manufacturing method of substrate structure
06/27/2013US20130161085 Printed circuit board and method for manufacturing the same
06/27/2013US20130161084 Noise filter and transmission apparatus
06/27/2013US20130161083 Printed circuit boards and methods of manufacturing printed circuit boards
06/27/2013US20130161082 Z-Directed Delay Line Components for Printed Circuit Boards
06/27/2013US20130161081 Connecting structure of touch panel
06/27/2013US20130161080 Halogen-free resin composition and its application for copper clad laminate and printed circuit board
06/27/2013US20130161079 Multi-layer wiring substrate and manufacturing method thereof
06/27/2013US20130161078 Rigid-flex circuit board and manufacturing method
06/27/2013US20130161077 Differential signal transmission circuit and method for manufacturing same
06/27/2013US20130161076 Connection unit
06/27/2013US20130161075 Connerting structure of touch panel and method for manufacturing the same
06/27/2013US20130161073 Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the method
06/27/2013US20130161072 Methods and Apparatuses for Detecting Registration Offsets
06/27/2013US20130161071 Connection structure, connection method and differential signal transmission cable
06/27/2013US20130161070 Touch panel and method for manufacturing the same
06/27/2013US20130160841 Adhesive composition, film-like adhesive and circuit connecting material using the same, connecting structure of circuit member and manufacturing method thereof
06/27/2013US20130160813 Back contact photovoltaic module with integrated circuitry
06/27/2013US20130160183 Textile arrangement and method for manufacturing
06/27/2013DE102012203318A1 Method for exposing objective layer within multilayer circuit board, involves forming recess from surface of multilayer printed circuit board upto sacrificial layer or into sacrificial layer by erosion process
06/27/2013DE102012101057A1 Verfahren zur Herstellung von DCB-Substraten Process for the preparation of DCB substrates
06/27/2013DE102011121921A1 Arrangement for heating front pane of passenger car, has humidity sensor unit, rain sensor unit and temperature sensor unit detecting data relevant for heating pane and/or heating power, and integrally designed with connection line
06/27/2013DE102011121808A1 Multilayer printed circuit board, has heat conducting layers connected with each other by heat conducting vias i.e. microvias, where total area of heat conducting layers increases at space of component increasing along z-direction
06/27/2013DE102011089927A1 Kontaktsystem mit einem Verbindungsmittel und Verfahren Contact system with a connecting means and methods
06/27/2013DE102011089891A1 Circuit carrier of circuit device has supporting layer having surface on which cooling structure is formed for cooling circuit carrier by directly plating on surface of supporting layer
06/27/2013DE102011089382A1 Printed circuit board has several plug pins which are connected with conducting layer, and are arranged protruding from circuit board
06/27/2013DE102011089372A1 Circuit board e.g. printed circuit board for power supply device used in automotive application, has circuit board portion that is provided with cavity so that passive components are arranged in cavity
06/27/2013DE102011056743A1 Control device for vehicle e.g. motor car, has ground connection that is arranged between circuitry carrier and electrical conductive element of base plate and is extended in circuitry carrier arranged on base plate
06/26/2013EP2608643A1 Cable
06/26/2013EP2608641A1 Device for protecting an electronic printed circuit board.
06/26/2013EP2608640A2 Light-emitting element mounting package, light-emitting element package, and method of manufacturing these