Patents for H05K 1 - Printed circuits (98,583)
05/2011
05/10/2011USRE42332 Integrated circuit package, ball-grid array integrated circuit package
05/10/2011US7940218 Multilayer PCB antenna
05/10/2011US7939377 Method of manufacturing semiconductor element mounted wiring board
05/10/2011US7939171 For forming conductor patterns; thermosetting resins; electroless plating; electrostatic latent imaging
05/05/2011WO2011052989A2 Etching solution composition
05/05/2011WO2011052746A1 Element mounting substrate, semiconductor module, and portable apparatus
05/05/2011WO2011052556A1 Copper or copper-alloy foil and method of manufacturing double-sided copper-clad laminate using same
05/05/2011WO2011052493A1 Multi-piece substrate and production method for same
05/05/2011WO2011052399A1 Wiring board and method for producing same
05/05/2011WO2011052358A1 Wiring board and method for producing same
05/05/2011WO2011052212A1 Substrate-connecting structure
05/05/2011WO2011052208A1 Wiring board unit
05/05/2011WO2011052068A1 Substrate connecting structure
05/05/2011WO2011051412A1 Polyamideimide adhesives for printed circuit boards
05/05/2011WO2011050444A1 Circuit board with variable topography solder interconnects
05/05/2011WO2011003948A3 Electrically conductive adhesives
05/05/2011WO2010105800A8 Printed circuit board with an elastically deformable formed sensor region
05/05/2011US20110106287 Wiring forming system and wiring forming method for forming wiring on wiring board
05/05/2011US20110104948 Surface mount footprint in-line capacitance
05/05/2011US20110103744 Card-based mounting assembly and maintenance system
05/05/2011US20110103031 Package substrate, semiconductor package having the package substrate
05/05/2011US20110103029 Lead pin and wiring substrate with lead pin, and method of manufacturing the same
05/05/2011US20110102729 Flexible printed circuit and electric circuit structure
05/05/2011US20110102385 Anisotropic conductive film, method of manufacturing the same and display apparatus having the same
05/05/2011US20110101532 Device fabricated using an electroplating process
05/05/2011US20110100700 Multilayer printed wiring board
05/05/2011US20110100699 Printed circuit board and method of manufacturing the same
05/05/2011US20110100698 Wiring board and method for manufacturing the same
05/05/2011US20110100697 Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for beol integration
05/05/2011US20110100696 Device mounting board and semiconductor module
05/05/2011US20110100695 Printed circuit board structure
05/05/2011US20110100693 Low-resistance conductive pattern structures and methods of fabricating the same
05/05/2011US20110100692 Circuit Board with Variable Topography Solder Interconnects
05/05/2011US20110100691 Circuit Board and Structure Using the Same
05/05/2011US20110100690 Electrically conductive body and printed wiring board and method of making the same
05/05/2011US20110100689 Electronics component embedded pcb
05/05/2011US20110100688 Electro-Optical Device and Method of Manufacturing the Same
05/05/2011US20110100687 Carrier tape for tab-package and manufacturing method thereof
05/05/2011US20110100686 Printed circuit board including via pad with concavo-convex patterns and method of manufacturing the same
05/05/2011US20110100685 Substrate anchor structure and method
05/05/2011US20110100684 Method for manufacturing an electrical conductor by applying at least one paste, in particular a thick-film paste
05/05/2011US20110100683 Electronic textile
05/05/2011US20110100682 Differential signal transmission cable
05/05/2011US20110100681 Substrate-mounted circuit module having components in a plurality of contacting planes
05/05/2011US20110100680 Wiring board and method for manufacturing the same
05/05/2011DE202011003115U1 Prüfanschlussvorrichtung für eine Datenbuchse Prüfanschlussvorrichtung for a data jack
05/05/2011DE102010060194A1 Kopplungsstruktur mit hoher Spannungsfestigkeit Coupling structure with high electric strength
05/05/2011DE102009051759A1 Electrical energy collection device for use inn autonomous wireless sensor e.g. temperature sensor, which is utilized for measuring e.g. heart rate, has electronic switches accommodated in circuit board and supplied with electrical energy
05/05/2011DE10142361B4 Speichermodul Memory module
05/05/2011CA2779065A1 Polyamideimide adhesives for printed circuit boards
05/04/2011EP2317600A1 Electronic circuit having multiple transmission lines
05/04/2011EP2317208A1 Illumination device with heat dissipation structure
05/04/2011EP2316870A1 Poly(phenylene ether) - polyvinyl thermosetting resin
05/04/2011EP2316784A1 Interconnection structure in a cavity having one or more contact rises on the walls of the cavity, and manufacturing method
05/04/2011EP2316131A1 Thermally optimised led chip-on-board module
05/04/2011EP2080075B1 Operating an integrated circuit
05/04/2011EP1832148B1 Circuit boards
05/04/2011EP1726419B1 Process for producing a ceramic sheet
05/04/2011EP1634127B1 Multi functional timepiece module with application specific printed circuit boards
05/04/2011EP1473328B1 Resin composition
05/04/2011CN201821575U Connecting finger structure of flexible circuit board
05/04/2011CN201821574U Aluminium base board with radiating function
05/04/2011CN201821573U Asymmetric pressboard structure of four-layered circuit board
05/04/2011CN201821572U Compressed board structure of six-layer circuit board
05/04/2011CN201821571U Internal-layer board structure applied to printed circuit board
05/04/2011CN201821570U PCB (printed circuit board) provided with thicker inner layers of baseplates
05/04/2011CN201821569U Mounting groove used for welding source electrode of power amplifier tube
05/04/2011CN201821568U Circuit board provided with internal fiducial mark protecting ring
05/04/2011CN201821567U Character structure on big copper surface of circuit board
05/04/2011CN201821566U Flexible circuit board provided with external antenna and applied to mobile phone card
05/04/2011CN201821389U Superimposition type mobile phone circuit board
05/04/2011CN102047774A Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board
05/04/2011CN102047772A 金属基电路板 Metal base circuit board
05/04/2011CN102047771A Electronic device and method for testing a circuit board
05/04/2011CN102047770A Electronic device and method for testing a circuit board
05/04/2011CN102047769A Electronic device and method for testing a circuit board
05/04/2011CN102047347A Circuit connection material and circuit connection structure
05/04/2011CN102046726A Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board
05/04/2011CN102046442A Protective arrangement for the protection of safety-relevant electronic circuits from malfunction
05/04/2011CN102045993A Anti-EMI (Electromagnetic Interference) circuit module and preparation method thereof
05/04/2011CN102045986A Heat dissipating substrate
05/04/2011CN102045967A Manufacturing method of multilayer printed wiring board
05/04/2011CN102045965A Lamination manufacturing method for imbedded inductance magnet ring
05/04/2011CN102045951A Metal surface plated nickel/gold treatment method of ceramic metalized substrate and manufactured ceramic metalized substrate
05/04/2011CN102045950A 印刷电路板及其制造方法 The method of manufacturing a printed circuit board and
05/04/2011CN102045942A 柔性印刷布线板 The flexible printed wiring board
05/04/2011CN102045941A Embedded type circuit board structure and manufacturing method thereof
05/04/2011CN102045940A Wiring circuit board and method of manufacturing the same
05/04/2011CN102045939A Metal layer structure of flexible multilayer base plate and preparation method thereof
05/04/2011CN102045938A A trench substrate and a fabricating method the same
05/04/2011CN102045937A Circuit board and display device adopting same
05/04/2011CN102045936A Circuit board structure
05/04/2011CN102044518A Low temperature co-fired ceramic substrate structure
05/04/2011CN102043332A Photosensitive resin composition, metal-base-containing circuit board and production method thereof
05/04/2011CN102042525A Light-emitting diode (LED) lighting device
05/04/2011CN102040837A Method for preparing nanocomposite materials comprising surface-modified nanofiller for substrates
05/04/2011CN102040803A Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
05/04/2011CN102040801A Epoxy resin composition as well as film and substrate
05/04/2011CN102039710A Preparation method for flame-retarded epoxy phenolic paper single-sided copper-clad plate
05/04/2011CN102039709A Method for manufacturing flame retardant type epoxy phenolic paper glass cloth single-side copper-clad plate