Patents for H05K 1 - Printed circuits (98,583)
06/2011
06/22/2011EP2335936A1 Aromatic polycarbonate composition
06/22/2011EP2215900B1 Filter in a multi-layer substrate with an electrical circuit arrangement having compact elements
06/22/2011EP1459611B1 Housing system for an electric device
06/22/2011DE102009060480A1 Leiterstrukturelement und Verfahren zum Herstellen eines Leiterstrukturelements Conductor structure element and method for manufacturing a conductor structure element
06/22/2011DE102009060123A1 Electrical circuit e.g. frequency converter, for driving induction motor, has cooling regions comprising cooling holes that are designed such that fluid surrounding regions flows from board lower side towards upper side for removal of heat
06/22/2011DE102009057788A1 Planartransformator Planar
06/22/2011DE102009054767A1 Abschlusselement für ein Gehäuse Termination element for a housing
06/22/2011DE102008042571B4 Hausgerätvorrichtung Domestic appliance device
06/22/2011DE102004006312B4 Mehrschichtige Leiterplatte, ein Verfahren zu deren Herstellung und einen isolierenden Film Multilayer printed wiring board, a process for their preparation and an insulating film
06/22/2011DE10064629B4 Verfahren zum Verbinden von Leiterplatten A method for connecting printed circuit boards
06/22/2011CN201878426U Power module board card
06/22/2011CN201878425U Printed circuit board (PCB) bare board capable of being provided with surface mounted parts and PCB provided with surface mounted parts
06/22/2011CN201878424U Printed circuit board for wave soldering of electronic product
06/22/2011CN201878423U Pad structure of flexible circuit board
06/22/2011CN201878422U Printed circuit board and backlight module using same
06/22/2011CN201878421U Printed circuit board
06/22/2011CN201878420U Radiating PCB (printed circuit board) structure
06/22/2011CN201878419U Gradevin electrical control board
06/22/2011CN201878418U Sampling block for detection of FPCB
06/22/2011CN201878417U Circuit board for improving board pressing and glue filling of buried hole or blind hole
06/22/2011CN201878416U Small circuit board convenient for installation
06/22/2011CN201878415U Multilayer circuit part and assembly thereof
06/22/2011CN201877461U System circuit support plate of light-emitting diode module
06/22/2011CN201875585U FPC (flexible printed circuit) backlight of LED (light-emitting diode) bonding pad structure
06/22/2011CN1765161B Rigid-flex wiring board
06/22/2011CN1663120B Electronic component comprising a multilayer substrate
06/22/2011CN102106196A Capacitively coupled connector for flexible printed circuit applications
06/22/2011CN102106194A Ceramic package substrate with recessed device
06/22/2011CN102106095A Compensating conductive circuit
06/22/2011CN102105971A Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein
06/22/2011CN102105418A Silicon nitride board, method for manufacturing the silicon nitride board, and silicon nitride circuit board and semiconductor module using the silicon nitride board
06/22/2011CN102105019A Mounting structure and mounting method of parts on the flexible printed circuit board
06/22/2011CN102105018A Multilayer circuit board
06/22/2011CN102105017A Printed wiring board connecting structure
06/22/2011CN102102861A Surface mounted light emitting diode (LED) light strip
06/22/2011CN102102000A Adhesive of medium glass transition temperature epoxy glass cloth-based copper-clad laminate suitable for lead-free process
06/22/2011CN101621170B Power supply and modular power connection interface thereof
06/22/2011CN101605427B One-way separation type extensible interconnection mother board
06/22/2011CN101591465B Composition for improving tellite material
06/22/2011CN101525511B Curable cross-linked type ink composition and dielectric film
06/22/2011CN101410973B Wafer-level chip scale package and method for fabricating and using the same
06/22/2011CN101356863B Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method
06/22/2011CN101346042B Rolled copper foil
06/22/2011CN101312620B Manufacturing process for metal circuit of multi-layer substrate and construction thereof
06/22/2011CN101296566B Electric element carrier plate and manufacturing method thereof
06/22/2011CN101262738B Printed circuit boards
06/22/2011CN101236797B Copper conductor slurry, conductor circuit board and electronic elements
06/22/2011CN101203986B Porous resin base, method for manufacturing same, and multilayer substrate
06/22/2011CN101147433B Multilayer circuit board with embedded components and method of manufacture
06/22/2011CA2726179A1 Light emitting diode light source modules
06/21/2011US7965425 Image processing apparatus having card reader for applying effects stored on a card to a stored image
06/21/2011US7965366 Flexible printed circuit board with alignment marks in particular positions
06/21/2011US7964950 Electronic parts packaging structure and method of manufacturing the same
06/21/2011US7964802 Interposer for decoupling integrated circuits on a circuit board
06/21/2011US7964801 Circuit board structure and fabrication method thereof
06/21/2011US7964800 Printed wiring board, method for forming the printed wiring board, and board interconnection structure
06/21/2011US7964237 Fluid flow of electroconductive paste onto sheet; positioning punch exterior to bore; contactors surface with paste; retraction of punch to clean
06/21/2011US7963646 Ink-jet inks containing metal nanoparticles
06/21/2011US7963029 Holding/convey jig and holding/convey method
06/16/2011WO2011070709A1 Display panel module and display device
06/16/2011WO2011070332A1 Resins
06/16/2011US20110141712 Package substrate and semiconductor package having the same
06/16/2011US20110141711 Electronic component embedded printed circuit board and method of manufacturing the same
06/16/2011US20110141705 Printed wiring board and electronic apparatus
06/16/2011US20110141704 Circuit board, electronic device and method for manuacturing the same
06/16/2011US20110141059 Transparent conductive film, method for production thereof and touch panel therewith
06/16/2011US20110141036 Substrate for touch panel and touch panel
06/16/2011US20110140581 1-d tire apparatus
06/16/2011US20110140286 Multilayer wiring substrate mounted with electronic component and method for manufacturing the same
06/16/2011US20110139502 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
06/16/2011US20110139501 Electronic chip and substrate with shaped conductor
06/16/2011US20110139500 Electrical connecting method and electrically connected connection structure
06/16/2011US20110139499 Printed circuit board and manufacturing method of the same
06/16/2011US20110139498 Printed wiring board and method for manufacturing the same
06/16/2011US20110139497 Via Structure Integrated in Electronic Substrate
06/16/2011US20110139496 Resin composition
06/16/2011US20110139495 Circuit board including mask for controlling flow of solder
06/16/2011US20110139494 Embedded wiring board and method for manufacturing the same
06/16/2011US20110139493 Flexible substrate and electric circuit structure
06/16/2011US20110139492 Multilayer flexible printed wiring board and electronic apparatus
06/16/2011US20110139491 Electrode of biosensor, manufacturing method thereof, and biosensor thereof
06/16/2011US20110139490 Wired circuit board assembly sheet
06/16/2011US20110139489 Printed circuit board
06/16/2011DE102010062093A1 Ultra niedrig schmelzende Metallnanopartikelzusammensetzung für Dickfilm-Anwendungen Ultra low-melting metal nanoparticle composition for thick film applications
06/16/2011DE102009055857A1 Verfahren zum Kontaktieren einer Leiterplatte mit einem Flachbandkabel und Leiterplatte Method of contacting a circuit board with a ribbon cable and PCB
06/16/2011DE102009047703A1 Electronic circuit for use in automotive area, has heat producing component exhibiting housing side that is connected with printed circuit board by attachment element, which separates housing side regarding heat transfer from circuit board
06/16/2011DE10019888B4 Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung Transparent electronic component assembly and process for their preparation
06/16/2011CA2820148A1 Resins
06/15/2011EP2334159A1 Coupling modules of an electronic device
06/15/2011EP2334158A1 Bridge coupling of modules in an electronic device
06/15/2011EP2334157A2 Flexible wiring substrate
06/15/2011EP2334156A1 Flexible cable and methods of manufacturing same
06/15/2011EP2127504B1 Electronic device with flip module having low height
06/15/2011EP1793658B1 Wiring board and wiring board module
06/15/2011EP1715996B1 Hot pressing ceramic distortion control
06/15/2011EP1645023B1 Printed circuit board for a three-phase power device having embedded directional impedance control channels
06/15/2011EP1634342B1 Method of fabricating electronic interconnect devices using direct imaging of dielectric material
06/15/2011EP1477048B1 Method for embedding a component in a base
06/15/2011EP0840676B2 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
06/15/2011CN201869444U Structure of flexible circuit board of LED (light-emitting diode) light strip