Patents for H05K 1 - Printed circuits (98,583)
03/2011
03/22/2011US7910664 3 to 6 Polyalkylene oxide, polyacrylate, a polylactone, polylactam or derivative side-branches connected to a benzene central molecule by a methylene group, especially initiated by hexakis(bromomethyl)benzene; films for electronic devices; nucleophilic substitution; benzene ring formation; ATRP
03/22/2011US7910202 Reducing dusting of epoxy laminates
03/22/2011US7909666 Solder attached contact and a method of manufacturing the same
03/22/2011US7909621 Socket connector having contact terminal tail with split solder ball retained thereon and method fabricating the same
03/22/2011US7909619 Cassette with locking feature
03/22/2011US7909614 Anti-rotation connector for shielding structure
03/22/2011US7908745 Method of manufacturing multi-layer printed circuit board
03/22/2011US7908738 Apparatus for manufacturing a wireless communication device
03/22/2011CA2413181C Method for producing a contactless chip card using transfer paper
03/17/2011WO2011032106A1 Board-to-board connector
03/17/2011WO2011030899A1 Copper alloy foil, flexible printed wiring board obtained using same, and process for producing copper alloy foil
03/17/2011WO2011030504A1 Body having electronic component mounted thereon, method for manufacturing same, and interposer
03/17/2011WO2011030214A1 Electromedical device
03/17/2011WO2011029757A1 Circuit configuration having a prescribed capacitance, and method and device for the production thereof
03/17/2011US20110064369 Flexible wiring board, manufacturing method thereof and flexible wiring device
03/17/2011US20110063816 Wired circuit board, connection structure thereof, and connection method therefor
03/17/2011US20110063815 Robust FBEOL and UBM Structure of C4 Interconnects
03/17/2011US20110063813 Circular electronic apparatus
03/17/2011US20110063811 Multilayer printed wiring board
03/17/2011US20110063808 Package of environmental sensitive element
03/17/2011US20110063806 Heat resistant substrate incorporated circuit wiring board
03/17/2011US20110063805 Stack-type semiconductor package, method of forming the same and electronic system including the same
03/17/2011US20110063790 Apparatus capable of selectively using different types of connectors
03/17/2011US20110063492 Pcb and camera module having the same
03/17/2011US20110062577 Substrate and package with micro bga configuration
03/17/2011US20110061928 Flexible printed wiring board and electronic apparatus having flexible printed wiring board
03/17/2011US20110061923 Double-sided pressure-sensitive adhesive tape and wiring circuit board
03/17/2011US20110061922 Package substrate and method of fabricating the same
03/17/2011US20110061921 Wiring board with built-in capacitor
03/17/2011US20110061920 Circuit module
03/17/2011US20110061919 Low temperature co-fired ceramics assembling system and method thereof
03/17/2011US20110061918 Backboard assembly and electronic device having the same
03/17/2011US20110061917 Laminated substrate for an integrated circuit bga package and printed circuit boards
03/17/2011US20110061916 Wiring board and manufacturing method thereof
03/17/2011US20110061915 Novel resin composition and use thereof
03/17/2011US20110061914 Novel polyimide precursor composition, use of the same, and production method of the same
03/17/2011US20110061913 Method of manufacturing mounting structure and mounting structure
03/17/2011US20110061912 Printed circuit board and manufacturing method thereof
03/17/2011US20110061911 Interposer and method for manufacturing the same
03/17/2011US20110061910 Multi-layer ceramic circuit board, method of manufacturing the same, and electric device module using the same
03/17/2011US20110061909 Circuit module and method of manufacturing the same
03/17/2011US20110061908 Pattern electrode manufacturing method and pattern electrode
03/17/2011US20110061907 Printed circuit board and method of manufacturing the same
03/17/2011US20110061906 Printed circuit board and fabrication method thereof
03/17/2011US20110061905 Printed circuit board and method of manufacturing the same
03/17/2011US20110061904 Display array substrate and method of manufacturing display substrate
03/17/2011US20110061903 Multilayered printed wiring board and method for manufacturing the same
03/17/2011US20110061902 Circuit board and method of manufacturing the same
03/17/2011US20110061901 Heat-dissipating substrate and fabricating method thereof
03/17/2011US20110061900 Wired-circuit-board assembly sheet and producing method thereof
03/17/2011US20110061899 Pixel array
03/17/2011US20110061898 Reducing cross-talk in high speed ceramic packages using selectively-widened mesh
03/17/2011US20110061445 Sensor arrangement
03/17/2011US20110061233 Rib reinforcement of plated thru-holes
03/17/2011US20110061230 Methods for Fabricating Current-Carrying Structures Using Voltage Switchable Dielectric Materials
03/17/2011DE19616847B4 Gedrucktes Dickschichtsubstrat und Verfahren zu dessen Herstellung Printed thick-film substrate and process for its preparation
03/16/2011EP2296450A1 Printed wiring board, electronic device and manufacturing method of the printed wiring board
03/16/2011EP2296156A1 Composite capacitance and use thereof
03/16/2011EP2296021A1 Mounting board for an LED with heat dissipation in a liquid crystal display device
03/16/2011EP2294902A1 Cooling system for an led chip array
03/16/2011EP2294586A1 Conductive compositions and processes for use in the manufacture of semiconductor devices
03/16/2011EP2193695B1 Electronic component with a printed circuit, toll transponder, telematics device and system with such an electronic circuit, and method for integrating a communication unit on a printed circuit
03/16/2011EP1757174B1 High current charge pump for intelligent power switch driver
03/16/2011CN201766810U Electronic component and circuit module having electromagnetic wave interference inhibiting device
03/16/2011CN201766769U Radiating structure
03/16/2011CN201766768U Circuit board provided with removing area
03/16/2011CN201765988U Archimedean curve shaped metal dome pad
03/16/2011CN201765928U High isolation planar transformer
03/16/2011CN201764433U Flexible circuit board fixing structure for LED light bars
03/16/2011CN1968577B Printed circuit board using paste bump and manufacturing method thereof
03/16/2011CN1956624B Rigid-flexible printed circuit board and method for manufacturing the same
03/16/2011CN1662120B Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
03/16/2011CN1617654B Anti-interference circuit board design and related program and storage medium
03/16/2011CN1592528B Conductive film pattern forming method, electrooptical apparatus and electronic apparatus
03/16/2011CN101986772A Method for manufacturing flexible circuit board
03/16/2011CN101986770A Multi-order high-density circuit board registration hole and manufacturing method thereof
03/16/2011CN101986769A Method for processing high speed signal wire on printed circuit board and device thereof
03/16/2011CN101651133B Chip wiring method on film for decreasing electromagnetic interference and structure
03/16/2011CN101600306B Method for processing stamped rigid-flexible board and rigid-flexible board
03/16/2011CN101591471B Resin composition for processing halogen-free copper foil base plate materials
03/16/2011CN101583236B Circuit board and fixing method for plug-in type element applying to same
03/16/2011CN101543143B Wiring board
03/16/2011CN101516163B Packaging method for combining screw to printed circuit board
03/16/2011CN101453828B Electromagnetic bandgap structure and printed circuit board
03/16/2011CN101441357B Luminous module, molding mode
03/16/2011CN101330071B Mounting substrate and manufacturing method thereof
03/16/2011CN101231990B Tape coiling type packaging construction capable of inserting and electronic device using the construction
03/16/2011CN101168829B Rolled copper foil and manufacturing method thereof
03/16/2011CN101026936B Printed circuit board button solder pad holing method and its button solder pad
03/15/2011US7907420 Bare chip mounted structure and mounting method
03/15/2011US7907417 Printed circuit board (PCB)with enhanced structural integrity
03/15/2011US7907415 Hinge mechanism of foldable device, and foldable device provided with hinge mechanism
03/15/2011US7906843 Substrate having a functionally gradient coefficient of thermal expansion
03/15/2011US7906734 Electrical terminal footprints for a printed circuit board
03/15/2011US7906732 Method for producing a glass plate with a conductive printed wire and glass plate with a conductive printed wire
03/15/2011US7905730 Interposer with a pair of contact points
03/10/2011WO2011027792A1 Circuit board manufacturing method and circuit board
03/10/2011WO2011027583A1 Circuit board for electronic device, method for producing same, and touch panel
03/10/2011WO2011026892A1 Printing method for printing electronic devices and relative control apparatus
03/10/2011WO2011026165A1 Method for connecting a plurality of elements of a circuit board, circuit board, and use of such a method