| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/29/2011 | CN201888016U Multilayer polyphenyl ether circuit board |
| 06/29/2011 | CN201888015U Ceramic multi-layer circuit board |
| 06/29/2011 | CN201888014U Multilayer circuit board formed by mixed pressing of epoxy glass fiber cloth and MPPO (modified polyphenylene oxide) |
| 06/29/2011 | CN201888013U Multi-layer circuit board formed by compressing epoxy glass fiber cloth and PTPE in mixed manner |
| 06/29/2011 | CN201888012U Multi-layer circuit board formed by pressing mixture of epoxy fiberglass cloth and ceramic material |
| 06/29/2011 | CN201887040U QFN/DFN (quad flat non-lead/dual flat non-lead) packaged integrated circuit using PCB (printed circuit board) as substrate |
| 06/29/2011 | CN201885038U Novel high-voltage patch LED (light-emitting diode) lamp strip |
| 06/29/2011 | CN201881601U High-dielectric-constant double-sided copper clad laminate |
| 06/29/2011 | CN201881597U Multilayer board favorable for improving CAF (conductive anodic filament) |
| 06/29/2011 | CN1930927B A method of creating electronic packages |
| 06/29/2011 | CN1810065B Printed wiring board |
| 06/29/2011 | CN102113425A 刚挠性电路板以及电子设备 Rigid wiring board and an electronic device |
| 06/29/2011 | CN102113423A 基板模块及其制造方法 Base module and its manufacturing method |
| 06/29/2011 | CN102113421A 柔性基板和电路构造体 The flexible substrate and the circuit structure |
| 06/29/2011 | CN102113420A 电路构造体 Circuit structure |
| 06/29/2011 | CN102112544A Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
| 06/29/2011 | CN102111984A Heat dissipation device |
| 06/29/2011 | CN102111968A Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| 06/29/2011 | CN102111959A Connecting structure of hard circuit board and flexible circuit board in LED (light-emitting diode) light bar |
| 06/29/2011 | CN102111958A Connection structure of flexible substrate and optical pickup device |
| 06/29/2011 | CN102111957A BGA footprint pattern for increasing number of routing channels per PCB layer |
| 06/29/2011 | CN102111956A Base material for printed circuit board |
| 06/29/2011 | CN102111955A Connecting structure and connecting method for PCB |
| 06/29/2011 | CN102111954A Circuit board and manufacturing process thereof |
| 06/29/2011 | CN102111953A Printed circuit board (PCB) and manufacturing method thereof |
| 06/29/2011 | CN102111952A Multilayer wiring substrate |
| 06/29/2011 | CN102111951A Multilayered wiring substrate |
| 06/29/2011 | CN102110920A High-speed connector package and packaging method |
| 06/29/2011 | CN102110727A Solar cell module and wiring circuit board for solar cell module |
| 06/29/2011 | CN102109757A Negative, design method for same, and circuit substrate made of same |
| 06/29/2011 | CN102108068A Polymer material and application thereof |
| 06/29/2011 | CN101668386B Pin wiring structure of card insertion end of flexible printed circuit board |
| 06/29/2011 | CN101616536B Circuit board with electrostatic discharge protection as well as liquid crystal module and electronic device applying same |
| 06/29/2011 | CN101562944B Circuit board and manufacturing technology thereof |
| 06/29/2011 | CN101553081B Hollow-out double-sided flexible printed circuit board with ACP conductive adhesive being printed thereon |
| 06/29/2011 | CN101553079B Hollow-out flexible printed circuit board |
| 06/29/2011 | CN101014460B Electrolytic copper foil with carrier foil furnished with primer resin layer and process for producing the same |
| 06/28/2011 | US7969745 Circuit board structure having electronic components integrated therein |
| 06/28/2011 | US7968991 Stacked package module and board having exposed ends |
| 06/28/2011 | US7968803 Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate |
| 06/28/2011 | US7968802 Printed circuit board with differential traces |
| 06/28/2011 | US7968801 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| 06/28/2011 | US7968800 Passive component incorporating interposer |
| 06/28/2011 | US7968799 Interposer, electrical package, and contact structure and fabricating method thereof |
| 06/28/2011 | US7968798 Flexible printed board |
| 06/28/2011 | US7968141 Method for producing contact terminal with textured surface and use thereof |
| 06/28/2011 | US7967938 Fabrics with high thermal conductivity coatings |
| 06/23/2011 | WO2011075491A1 Via structure integrated in electronic substrate |
| 06/23/2011 | WO2011074684A1 Substrate and method for manufacturing circuit device that use same |
| 06/23/2011 | WO2011074422A1 Suspension circuit substrate, hard disk-use suspension and hard disk drive |
| 06/23/2011 | WO2011074351A1 Mounting structure of electronic component |
| 06/23/2011 | WO2011073057A1 System to improve coreless package connections and associated methods |
| 06/23/2011 | WO2011072990A2 Multi-tiered circuit board and method of manufacture |
| 06/23/2011 | WO2011072629A1 Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller |
| 06/23/2011 | WO2011045264A3 Protection device against electromagnetic interference |
| 06/23/2011 | WO2011020946A3 Cover comprising a flexible connecting element for an electronic device |
| 06/23/2011 | US20110151627 Overcoming laminate warpage and misalignment in flip-chip packages |
| 06/23/2011 | US20110151273 Laminate for printed circuit board |
| 06/23/2011 | US20110149543 Printed wiring board connection structure |
| 06/23/2011 | US20110149539 Base plate for use in a multi-chip module |
| 06/23/2011 | US20110149538 Electronic Devices with Embedded Electromagnetic Materials and Process of Making the Same |
| 06/23/2011 | US20110149533 Integrated circuit film for smart card |
| 06/23/2011 | US20110149532 Laminate, circuit board and semiconductor device |
| 06/23/2011 | US20110149530 Printed circuit board assembly |
| 06/23/2011 | US20110149529 Processing of electric and/or electronic elements on cellulosic substrates |
| 06/23/2011 | US20110149528 Methods and compositions for dielectric materials |
| 06/23/2011 | US20110149522 Electronic control unit and method for producing component of same |
| 06/23/2011 | US20110149519 Apparatus and method for embedding components in small-form-factor, system-on-packages |
| 06/23/2011 | US20110149493 Stacked semiconductor packages, methods of fabricating the same, and/or systems employing the same |
| 06/23/2011 | US20110149184 Pixel structure |
| 06/23/2011 | US20110148777 Method for bonding fpc onto baseboard, bonding assembly, and touch screen |
| 06/23/2011 | US20110148447 Multilayer ceramic substrate and probe board using pillar-type conductor and fabricating methods of the same |
| 06/23/2011 | US20110147951 Wiring substrate and semiconductor device |
| 06/23/2011 | US20110147072 Method for surface treatment of copper and copper |
| 06/23/2011 | US20110147071 Apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof |
| 06/23/2011 | US20110147070 Method and Apparatus for Reducing Signal Noise |
| 06/23/2011 | US20110147068 Structure for Enhancing Reference Return Current Conduction |
| 06/23/2011 | US20110147067 Method and apparatus for optically transparent via filling |
| 06/23/2011 | US20110147066 Substrate metallization and ball attach metallurgy with a novel dopant element |
| 06/23/2011 | US20110147065 Integrated Circuit with Adjusting Elements and Method for Its Manufacture |
| 06/23/2011 | US20110147064 Boron nitride agglomerated powder |
| 06/23/2011 | US20110147063 Multilayer board for suppressing unwanted electromagnetic waves and noise |
| 06/23/2011 | US20110147062 Feedthrough flat-through capacitor |
| 06/23/2011 | US20110147061 Circuit Board with Via Trace Connection and Method of Making the Same |
| 06/23/2011 | US20110147060 Dielectric film, dielectric element, and process for producing the dielectric element |
| 06/23/2011 | US20110147059 Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
| 06/23/2011 | US20110147058 Electronic device and method of manufacturing electronic device |
| 06/23/2011 | US20110147057 Printed wiring board and method for manufacturing printed wiring board |
| 06/23/2011 | US20110147056 Circuit board and process for fabricating the same |
| 06/23/2011 | US20110147055 Glass core substrate for integrated circuit devices and methods of making the same |
| 06/23/2011 | US20110147054 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate |
| 06/23/2011 | US20110147053 Printed wiring board |
| 06/23/2011 | US20110147052 Polyimide film |
| 06/23/2011 | US20110147051 Capacitive switch sensors on decorative in-mold films background |
| 06/23/2011 | US20110147050 Printed wiring board and method for manufacturing printed wiring board |
| 06/22/2011 | EP2337225A1 Icon illumination for capacitive touch switch |
| 06/22/2011 | EP2337210A1 Power converter |
| 06/22/2011 | EP2337171A1 Electrostatic discharge protector |
| 06/22/2011 | EP2337165A2 Methods and apparatus for reducing crosstalk in electrical connectors. |
| 06/22/2011 | EP2336952A2 Automatic RFID circuit tuning |