Patents for H05K 1 - Printed circuits (98,583)
07/2011
07/06/2011CN102115597A Composite material for substrate containing inorganic filling material and liquid crystal thermosetting oligomer with negative thermal expansion coefficient
07/06/2011CN102115569A Dielectric material composition and circuit substrate
07/06/2011CN101790285B Communication device and method for manufacturing circuit board of communication device
07/06/2011CN101546759B Method for manufacturing an electronic module and an electronic module
07/06/2011CN101543142B Printed wiring board
07/06/2011CN101500372B Electronic appliance and heat radiation substrate
07/06/2011CN101443285B Needled glass mat
07/06/2011CN101415317B Anti electromagnetic interference structure for multi-layer printed circuit board
07/06/2011CN101370356B Circuit board and its manufacturing method
07/06/2011CN101312615B Printed circuit board and manufacturing method thereof
07/06/2011CN101296557B Flexible printing circuit board
07/06/2011CN101207971B Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board
07/06/2011CN101147434B ITFC with optimized C(T)
07/05/2011US7974102 Integrated circuit carrier assembly
07/05/2011US7974044 Solder control features for a disc drive head flex interconnect
07/05/2011US7973391 Tapered dielectric and conductor structures and applications thereof
07/05/2011US7973249 Multilayer printed wiring board
07/05/2011US7973248 Printed circuit board using paste bump and manufacturing method thereof
07/05/2011US7973247 Connecting portion of circuit board and circuit board-connecting structure technical field
07/05/2011US7973246 Electronic component
07/05/2011US7973245 Wiring board and capacitor to be built into wiring board
07/05/2011US7973244 Printed circuit board
07/05/2011US7972460 Method of manufacturing printed circuit board
07/05/2011US7972145 Electrical connector having adapter with hook so as to prevent and reduce distortion of the adapter
07/05/2011US7971354 Method of manufacturing a multilayer printed wiring board
07/05/2011CA2563936C Method and device for continuously producing electronic film components, and an electronic film component
07/05/2011CA2543386C Aerogel/ptfe composite insulating material
06/2011
06/30/2011WO2011078355A1 Circuit board, circuit board manufacturing method, suspension board, suspension assembly, suspension assembly with elements, and hard disk drive
06/30/2011WO2011078349A1 Many-up wiring substrate, wiring substrate, and electronic device
06/30/2011WO2011078345A1 Through-wired substrate and manufacturing method therefor
06/30/2011WO2011078339A1 Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
06/30/2011WO2011078259A1 Flexible circuit board and structure of bend section of flexible circuit board
06/30/2011WO2011078214A1 Assembly structure for injection molded substrate and for mounting component
06/30/2011WO2011077979A1 Anisotropic conductive adhesive
06/30/2011WO2011077918A1 Circuit module
06/30/2011WO2011077917A1 Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board
06/30/2011WO2011077886A1 Interconnect-use electronic component and method for producing same
06/30/2011WO2011077777A1 Flexible circuit board and manufacturing method thereof
06/30/2011WO2011076730A1 Aromatic polycarbonate composition
06/30/2011WO2011012993A3 Modular prototyping of a circuit for manufacturing
06/30/2011US20110158077 Connection structure of flexible printed circuits and optical pickup device
06/30/2011US20110157858 System-in-package having embedded circuit boards
06/30/2011US20110157857 Circuit board laminated module and electronic equipment
06/30/2011US20110157853 Fan-out wafer level package with polymeric layer for high reliability
06/30/2011US20110157845 Touch panel
06/30/2011US20110157844 Flat Panel Display Module Having Anti-Shock Screw-Tightening Structure
06/30/2011US20110157843 Portable terminal with hinge apparatus
06/30/2011US20110157842 Use of hybrid pcb materials in printed circuit boards
06/30/2011US20110157838 Card device
06/30/2011US20110156578 Electronic device, organic light emitting device, and protection multilayer structure
06/30/2011US20110156083 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
06/30/2011US20110155450 Printed circuit board and electronic apparatus
06/30/2011US20110155444 Electroless method for in-line metallization of substrates by spraying them, with prior surface treatment and device for implementing the method
06/30/2011US20110155443 Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate
06/30/2011US20110155442 Multilayer wiring board
06/30/2011US20110155441 Circuit board and process for fabricating the same
06/30/2011US20110155440 Circuit board and process for manufacturing the same
06/30/2011US20110155439 Multilayer wiring substrate and method of manufacturing the same
06/30/2011US20110155438 Multilayer Wiring Substrate
06/30/2011US20110155437 Printed circuit board
06/30/2011US20110155436 Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same
06/30/2011US20110155435 Method to form lateral pad on edge of wafer
06/30/2011US20110155434 Bga footprint pattern for increasing number of routing channels per pcb layer
06/30/2011US20110155433 Wiring board capable of containing functional element and method for manufacturing same
06/30/2011US20110155432 Metallic copper dispersion, process for producing the metallic copper dispersion, electrode, wiring pattern, and coating film formed using the metallic copper dispersion, decorative article and antimicrobial article with the coating film formed thereon, and processes for producing the decorative article and the antimicrobial article
06/30/2011US20110155431 Mixed-metal system conductors for ltcc (low-temperature co-fired ceramic)
06/30/2011US20110155430 Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same
06/30/2011US20110155429 Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof
06/30/2011US20110155428 Circuit board and manufacturing method thereof
06/30/2011US20110155427 Circuit substrate and manufacturing method thereof
06/30/2011US20110155426 Embedded circuit board and manufacturing method thereof
06/30/2011US20110155425 Underfill film having thermally conductive sheet
06/30/2011US20110155424 Producing electrical circuit patterns using multi-population transformation
06/30/2011US20110155423 Circuit Board, Image Forming Apparatus, Thermal Head, and Image Sensor
06/30/2011US20110155422 Wire insulating terminal and circuit board module employing same
06/30/2011US20110155421 Wired circuit board assembly sheet
06/30/2011DE102010009984A1 Verstärkerbaustein mit einem Kompensationselement Amplifier module with a compensation element
06/30/2011DE102009060777A1 Elektronisches Steuergerät und Verfahren zur Herstellung einer Einheit aus einem Grundkörper und einer Leiterplatte zum Einsatz in einem solchen Steuergerät Electronic control unit and method for producing a unit consisting of a base body and a circuit board for use in such a control unit
06/29/2011EP2339903A2 Lead plate and protection circuit module having the same
06/29/2011EP2339902A1 Printed wiring board connecting structure
06/29/2011EP2339901A1 BGA footprint pattern for increasing the number of routing channels per PCB layer
06/29/2011EP2339900A2 Light module for a lighting device of a motor vehicle and lighting device with such a light module
06/29/2011EP2339695A1 Circuit connecting material, connection structure for circuit member using the same and production method thereof
06/29/2011EP2339039A2 Copper alloy sheet for electric and electronic part
06/29/2011EP2339038A2 Copper alloy sheet for electric and electronic part
06/29/2011EP2338680A1 Metal foil with electric resistance film and method for manufacturing the metal foil
06/29/2011EP2338320A1 Protective cover for a flexible printed circuit board
06/29/2011EP2338176A1 Illumination apparatus with steps and an led array
06/29/2011EP1747438B1 Temperature sensor and temperature monitoring device
06/29/2011CN201888027U Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide
06/29/2011CN201888026U Structure for connecting two assembly substrates
06/29/2011CN201888025U Burr-prevention structure for golden fingers of circuit board
06/29/2011CN201888024U PTFE (polytetrafluoroethylene) high-frequency aluminum-based circuit board
06/29/2011CN201888023U PTFE high-frequency copper base circuit board
06/29/2011CN201888022U LED circuit board adopting aluminum substrate and filled with ceramic powder
06/29/2011CN201888021U High-power circuit board adopting copper substrate and filled with ceramic powder
06/29/2011CN201888020U 陶瓷印刷电路板结构 A ceramic printed circuit board structure
06/29/2011CN201888019U Printed circuit board
06/29/2011CN201888018U Circuit board with shielding function and short circuit closed loop for rotary encoder
06/29/2011CN201888017U Multilayer circuit board made from PTFE (polytetrafluoroethylene)