| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/15/2011 | CN201869443U Connection structure for hard circuit board and flexible circuit board of light-emitting diode (LED) light strip |
| 06/15/2011 | CN201869442U Pcb |
| 06/15/2011 | CN201869441U Improved golden finger of flexible circuit board of LED (light-emitting diode) light strip |
| 06/15/2011 | CN201869440U 散热焊盘 Thermal Pad |
| 06/15/2011 | CN201869439U Metal-based circuit board with high heat radiation |
| 06/15/2011 | CN201869438U Baseplate with high-density wiring |
| 06/15/2011 | CN201869437U Circuit board of spray irrigation controller |
| 06/15/2011 | CN201869436U PCB (printed circuit board) |
| 06/15/2011 | CN201869435U Structure for connecting baseplate of flexible circuit board with golden finger copper foil |
| 06/15/2011 | CN201869434U Flexible shapable circuit board |
| 06/15/2011 | CN201869433U PCB circuit board for energy-saving lamp |
| 06/15/2011 | CN201869432U Circuit board with die cut line |
| 06/15/2011 | CN201868715U Screen cable |
| 06/15/2011 | CN201866609U CCD recognition lamp of automatic exposure machine |
| 06/15/2011 | CN1995469B High temperature high ductibility electrolytic copper foil production process |
| 06/15/2011 | CN1922252B Fire retardant compositions using siloxanes |
| 06/15/2011 | CN1918583B Electronic device |
| 06/15/2011 | CN1870857B Shielded electronic circuit unit and method of manufacturing the same |
| 06/15/2011 | CN1849856B Method for manufacturing double-sided printed glass board |
| 06/15/2011 | CN1798479B Printed circuit board including embedded chips and method of fabricating the same |
| 06/15/2011 | CN1765162B Ceramic multilayer substrate |
| 06/15/2011 | CN1645991B 多层印刷电路板 Multilayer printed circuit board |
| 06/15/2011 | CN1616451B Process for the purification of thiophenes |
| 06/15/2011 | CN1599513B Ultra-thin copper foil with carrier and method of producing ultra-thin copper foil with carrier and printed circuit board |
| 06/15/2011 | CN102100130A Circuit materials, circuits laminates, and method of manufacture thereof |
| 06/15/2011 | CN102100129A Electrical circuit arrangement |
| 06/15/2011 | CN102100010A Transceiver module with dual printed circuit boards |
| 06/15/2011 | CN102099846A Electronic package, display device and electronic apparatus |
| 06/15/2011 | CN102098877A Printed wiring board and electronic apparatus |
| 06/15/2011 | CN102098876A Manufacturing process for circuit substrate |
| 06/15/2011 | CN102098875A Jointed board connecting structure of flexible printed circuit (FPC) and printed circuit board (PCB) in flexible/rigid printed board |
| 06/15/2011 | CN102098874A Central electrical appliance box printed wiring board of vehicle |
| 06/15/2011 | CN102098873A Pad structure for preventing pad from fracturing |
| 06/15/2011 | CN102098872A Pad structure and manufacturing method thereof |
| 06/15/2011 | CN102098871A Anti-stripping soldering-pan for printed circuit board |
| 06/15/2011 | CN102098870A Composite printed circuit board (PCB) and manufacturing method thereof |
| 06/15/2011 | CN102098869A Flexible circuit board of one-layered connector, and slider phone thereof |
| 06/15/2011 | CN102098868A 电路板 Board |
| 06/15/2011 | CN102098867A Flexible wiring substrate |
| 06/15/2011 | CN102098866A Printed circuit board |
| 06/15/2011 | CN102097334A Manufacture method for wiring board and stitch arrangement device |
| 06/15/2011 | CN102097333A Method for designing circuit board, circuit board and electronic device |
| 06/15/2011 | CN102093672A Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate |
| 06/15/2011 | CN102093670A Halogen-free flame retardant epoxy resin composition and copper clad plate prepared from same |
| 06/15/2011 | CN102093667A Epoxy resin composite and covering film prepared from same |
| 06/15/2011 | CN102093666A Halogen-free resin composite and preparation method of halogen-free copper clad laminate using same |
| 06/15/2011 | CN101683788B Liquid container and liquid supply system |
| 06/15/2011 | CN101568228B Electronic component, circuit substrate and circuit device |
| 06/15/2011 | CN101459782B Photoelectric conversion element unit and imaging apparatus |
| 06/15/2011 | CN101453825B Low loss multilayered circuit board |
| 06/15/2011 | CN101346449B Adhesive composition, circuit connecting material and connecting structure of circuit member |
| 06/15/2011 | CN101312086B Electric resistance layout manufacture method and its structure |
| 06/15/2011 | CN101174487B Conductive paste for multilayer electronic part |
| 06/15/2011 | CN101115351B Electronic components packaging structure |
| 06/15/2011 | CN101049056B Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method |
| 06/15/2011 | CN101047048B Conductive composition and conductive paste |
| 06/14/2011 | USRE42457 Methods of packaging an integrated circuit and methods of forming an integrated circuit package |
| 06/14/2011 | US7961992 Integrated transceiver with lightpipe coupler |
| 06/14/2011 | US7961477 Housing comprising a liquid-tight electric bushing |
| 06/14/2011 | US7961476 Stiffening plate for circuit board and switch assembly |
| 06/14/2011 | US7961475 Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
| 06/14/2011 | US7960990 Closed-grid bus architecture for wafer interconnect structure |
| 06/14/2011 | US7960655 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module |
| 06/14/2011 | US7959446 Electrical element and electrical connector |
| 06/14/2011 | US7958632 Flexible printed-circuit boards bonding method and printed circuit board |
| 06/14/2011 | CA2550896C Polyimide film |
| 06/14/2011 | CA2342440C L.e.d. thermal management |
| 06/09/2011 | WO2011068207A1 Phosphorus-containing polyimide and method for producing same |
| 06/09/2011 | WO2011068157A1 Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board, and multilayer flexible printed circuit board |
| 06/09/2011 | WO2011067969A1 Printed wiring board connection structure, method for manufacturing the same, and anisotropic conductive adhesive |
| 06/09/2011 | WO2011067946A1 Circuit board, circuit module, and electronic device |
| 06/09/2011 | WO2011067945A1 Circuit board, circuit module, and electronic device |
| 06/09/2011 | WO2011067281A1 Metallization having high power compatibility and high electrical conductivity |
| 06/09/2011 | WO2011067053A1 High-speed ceramic modules with hybrid referencing scheme |
| 06/09/2011 | WO2011067051A1 Reducing plating stub reflections in a chip package using resistive coupling |
| 06/09/2011 | WO2011067019A1 Flexible circuit board and electric device |
| 06/09/2011 | US20110136061 Crosslinked polyimide, composition comprising the same and process for producing the same |
| 06/09/2011 | US20110134655 Formed body with curved surface shape, method of producing the formed body, front cover for vehicle lighting device, and method of producing the front cover |
| 06/09/2011 | US20110134621 Electro-optical device, electro-optical panel, and electronic apparatus |
| 06/09/2011 | US20110134613 Stacked inductor-electronic package assembly and technique for manufacturing same |
| 06/09/2011 | US20110134597 Printed circuit board having a non-plated hole with limited drill depth |
| 06/09/2011 | US20110134514 Flexible Substrate Having Electrical And Optical Functions |
| 06/09/2011 | US20110134377 Liquid crystal display panel and active device array substrate thereof |
| 06/09/2011 | US20110134161 Flexible printed circuit board, backlight unit using the same, and liquid crystal display device comprising the same |
| 06/09/2011 | US20110133340 Package substrate and semiconductor apparatus |
| 06/09/2011 | US20110133326 Reducing Plating Stub Reflections in a Chip Package Using Resistive Coupling |
| 06/09/2011 | US20110132654 Multilayer printed circuit board, method for manufacturing the same, and electronic apparatus |
| 06/09/2011 | US20110132652 Structure of very high insertion loss of the substrate noise decoupling |
| 06/09/2011 | US20110132651 Circuit board and method of manufacturing the same |
| 06/09/2011 | US20110132649 1-d tire patch apparatus and methodology |
| 06/09/2011 | US20110132648 Channel performance of electrical lines |
| 06/09/2011 | US20110132647 Substrates Having Voltage Switchable Dielectric Materials |
| 06/09/2011 | US20110132646 Flame retardant epoxy resin composition, prepreg and laminate thereof |
| 06/09/2011 | US20110132645 Granular varistor and applications for use thereof |
| 06/09/2011 | US20110132644 Metal base circuit board |
| 06/09/2011 | US20110132643 Flexible circuit board and method for producing same and bend structure of flexible circuit board |
| 06/09/2011 | US20110132642 Flexible Wiring Substrate |
| 06/09/2011 | US20110132641 Flexible cable and methods of manufacturing same |
| 06/09/2011 | US20110132640 Printed wiring board and method of suprressing power supply noise thereof |
| 06/09/2011 | US20110132639 Printed wiring board and method for producing the same |