Patents for H05K 1 - Printed circuits (98,583)
04/2011
04/14/2011US20110083886 Method of manufacturing electrode substrate
04/14/2011US20110083885 Metal wiring structure comprising electroless nickel plating layer and method of fabricating the same
04/14/2011US20110083884 Novel polyimide precursor composition and use thereof
04/14/2011US20110083883 Wiring board and mount structure
04/14/2011US20110083882 Conductive structure and method of manufacturing the same
04/14/2011US20110083881 Device and Process for Making a Multilayer Circuit Device Having Electrically Isolated Tightly Spaced Electrical Current Carrying Traces
04/14/2011DE202010013046U1 Transformator Transformer
04/14/2011DE10165069B4 Verfahren zum Verbinden von gedruckten Leiterplatten A method for connecting printed circuit boards
04/13/2011EP2309831A1 Method for the manufacture of a circuit board, in particular a multi-layer printed board
04/13/2011EP2309829A1 Multilayer circuit board
04/13/2011EP2309521A1 Resistance component
04/13/2011EP2309294A2 Circuit board element and method for manufacturing a circuit board element
04/13/2011EP2308805A2 Ceramic material composition
04/13/2011EP2308274A1 Printed circuit board with electronic component
04/13/2011EP2220916B1 Device for protecting the pins of an electronic component
04/13/2011CN201797690U Heat dissipation device for circuit board
04/13/2011CN201797658U Ventilation hole structure for preventing board explosion for six-layered circuit board after aligned lamination
04/13/2011CN201797655U Double-side circuit board made of parallel flat leads
04/13/2011CN201797654U IC card socket build-in circuit board with insertion hole connected with flat cable
04/13/2011CN201797653U Printed wiring board of buried resistor
04/13/2011CN201797652U Structure for splicing multiple different types of PCB boards
04/13/2011CN201797651U PCB (printed circuit board) board with shunt copper sheet
04/13/2011CN201797650U Improved store house structure of circuit board
04/13/2011CN201797649U High filling glue plate for improving inner-layer thick copper and high filling glue structure
04/13/2011CN201797648U PCB board favorable for improving impedance control of PCB
04/13/2011CN201797647U Multi-layer plate structure contributing to improving signal integrity
04/13/2011CN201797646U Printed circuit board (PCB) structure capable for improving difference of dimensional stability of multilayer board
04/13/2011CN201797645U Printed circuit board (PCB) provided with test pad
04/13/2011CN201797644U Printed circuit board (PCB) with impedance module
04/13/2011CN201797643U Flexible circuit board structure of novel liquid crystal display module
04/13/2011CN201797642U Improved structure of circuit board
04/13/2011CN201797641U Circuit board insulating strip
04/13/2011CN201797640U Improved structure of circuit board connector
04/13/2011CN201797639U Fixing rivet for circuit board
04/13/2011CN201797638U Film circuit board with spacer
04/13/2011CN201797637U Electromagnetic shielding device for circuit board
04/13/2011CN201797636U Structure for preventing circuit board from falling to be cracked
04/13/2011CN201797635U Flexible printed circuit board
04/13/2011CN201797634U Printed circuit board
04/13/2011CN201797466U Solar-powered driving circuit unit
04/13/2011CN201797376U Power supply with Ethernet interface
04/13/2011CN201797029U High-frequency filter with resonator
04/13/2011CN1993498B Printed wiring board
04/13/2011CN1715030B Structure of parts made from plural composite pieces and method of building those parts
04/13/2011CN102017829A Unit with power circuit mounted therein, and motor drive apparatus
04/13/2011CN102017820A Substrate, structure for mounting surface mounting component, and electronic device
04/13/2011CN102017817A Electric circuit connection member
04/13/2011CN102017816A Circuit connecting material, film-like adhesive, adhesive reel, and circuit connecting structural body
04/13/2011CN102017815A Reduction of jitter in a semiconductor device by controlling printed circuit board or package substrate stackup
04/13/2011CN102017814A Electronic textile
04/13/2011CN102017339A Substrate incorporating ESD protection function
04/13/2011CN102017164A Methods for forming composite nanoparticle-metal metallization contacts on a substrate
04/13/2011CN102014602A Design method for improving electromagnetic compatibility performance of high-power element and high-power element module
04/13/2011CN102014600A Radiating structure and manufacturing method thereof as well as electronic device with radiating structure
04/13/2011CN102014590A Production method of multi-layer printed circuit board and multi-layer printed circuit board
04/13/2011CN102014586A Method for gold-plating long and short gold fingers
04/13/2011CN102014579A Gold-plating method of long and short golden fingers
04/13/2011CN102014573A Printed circuit board with radio frequency identification and production method thereof
04/13/2011CN102014572A Electronic piece of metal sheet fillet and processing technology thereof
04/13/2011CN102014571A Flexible printed circuit board and liquid crystal display device
04/13/2011CN102014570A PCB (printed circuit board) carried tape for phone card with non-contact function
04/13/2011CN102013418A Novel PCB (Printed Circuit Board) carrier tape for SIM card package
04/13/2011CN102012005A Completely-metal integrated illuminating and backlight LED heat radiating structural body
04/13/2011CN102011952A Method for making LED (Light Emitting Diode) light resource module and product made by the method
04/13/2011CN102009515A Two-layer-method double-sided flexible CCL (Copper-Clad Laminate) and manufacture method thereof
04/13/2011CN101754576B Flexible circuit board and manufacturing method thereof and display
04/13/2011CN101583250B Method for processing through hole of printed circuit board, printed circuit board and communication equipment
04/13/2011CN101578927B Printed wiring board and method for manufacturing the same
04/13/2011CN101577159B Film resistance structure and manufacturing method thereof
04/13/2011CN101562949B Manufacturing method of rigid-flexible plate
04/13/2011CN101557678B Wired circuit board
04/13/2011CN101547558B Copper clad base plate and preparation method thereof
04/13/2011CN101516162B Method and device for connecting circuit boards
04/13/2011CN101488116B Universal serial bus
04/13/2011CN101472388B Layout structure of circuit board
04/13/2011CN101427614B Contact bank, measurement arrangement, telecommunications module and telecommunications assembly provided with a contact bank or a measurement arrangement
04/13/2011CN101409980B Soft and hard composite circuit board
04/13/2011CN101401491B Insulating resin layer, insulating resin layer with carrier and multilayer printed wiring board
04/13/2011CN101401304B High frequency module
04/13/2011CN101365296B Printed circuit board structure
04/13/2011CN101342817B Circuit board
04/13/2011CN101316479B Circuit board and production method thereof
04/13/2011CN101307872B Lighting system and liquid crystal display using the same
04/13/2011CN101276800B Circuit board and method of manufacturing same
04/13/2011CN101247697B Reusable flexible printed circuit board
04/13/2011CN101198211B Laminated substrate and manufacturing method thereof
04/13/2011CN101060756B Wired circuit board
04/13/2011CN101035406B Embedded capacitor core having multilayer structure
04/13/2011CN101022703B Method and process for embedding electrically conductive elements in a dielectric layer
04/12/2011US7924575 Electronic apparatus
04/12/2011US7924574 High-frequency circuit components
04/12/2011US7923645 Metal etch stop fabrication method and structure
04/12/2011US7923644 Printed circuit board and method of manufacturing the same
04/12/2011US7923273 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
04/12/2011US7922298 Ink jet printhead with displaceable nozzle crown
04/07/2011WO2011041510A1 A device interface board with cavity back for very high frequency applications
04/07/2011WO2011041051A2 Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets
04/07/2011WO2011040442A1 Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal
04/07/2011WO2011040399A1 Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate
04/07/2011WO2011040393A1 Circuit substrate and method of manufacture thereof