| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/21/2012 | US20120153340 Submount, optical module provided therewith, and submount manufacturing method |
| 06/21/2012 | US20120153132 Element carrier and light receiving module |
| 06/21/2012 | US20120152607 Printed circuit board |
| 06/21/2012 | US20120152606 Printed wiring board |
| 06/21/2012 | US20120152605 Circuitized substrate with dielectric interposer assembly and method |
| 06/21/2012 | US20120152604 Mounting structure of circuit board having thereon multi-layered ceramic capacitor, method thereof, land pattern of circuit board for the same, packing unit for multi-layered ceramic capacitor taped horizontally and aligning method thereof |
| 06/21/2012 | US20120152603 Printed circuit board including at least one layer |
| 06/21/2012 | US20120152602 Printed circuit board |
| 06/21/2012 | US20120152601 Package substrate and die spacer layers having a ceramic backbone |
| 06/21/2012 | US20120152600 Printed wiring board and method for manufacturing printed wiring board |
| 06/21/2012 | US20120152599 Printed wiring board, build-up multi-layer board, and production method therefor |
| 06/21/2012 | US20120152598 Wiring board and method of manufacturing the same |
| 06/21/2012 | US20120152597 Wiring board and method of manufacturing the same |
| 06/21/2012 | US20120152596 Wiring board |
| 06/21/2012 | US20120152595 Multilayer printed circuit board and method of manufacturing the same |
| 06/21/2012 | US20120152594 Reduced circuit trace roughness for improved signal performance |
| 06/21/2012 | US20120152593 Anisotropic conductor, method of producing the same, and anisotropic conductor-arranged sheet |
| 06/21/2012 | US20120152592 Method for manufacturing printed circuit board, method for manufacturing printed circuit board assembly sheet, printed circuit board, and printed circuit board assembly sheet |
| 06/21/2012 | US20120152585 Electronic component package and base of the same |
| 06/21/2012 | US20120152482 Aluminum bonding member and method for producing same |
| 06/21/2012 | DE10358691B4 Verfahren zum Beladen einer Sockel-Einrichtung mit einem entsprechenden Halbleiter-Bauelement A method for loading a socket device with a corresponding semiconductor device |
| 06/21/2012 | DE102011086197A1 Anordnungsstruktur für ein elektrisches element vom chiptyp und elektrische vorrichtung mit dem elektrischen element vom chiptyp auf einer flexiblen platine Assembly structure of an electric element from the chip type and electrical apparatus with the electric element from the chip type on a flexible circuit board |
| 06/21/2012 | DE102011003622A1 Flexible multilayered circuit substrate, has flexible film substrates with opposing main surfaces, where bonding material of specific thickness is applied at connecting areas for separating flexible film substrates |
| 06/21/2012 | DE102010063718A1 Dielektrische Schicht für ein elektrisches Bauelement, elektrisches Bauelement mit dielektrischer Schicht und Verfahren zum Herstellen eines elektrischen Bauelements mit dielektrischer Schicht A dielectric layer for an electrical component, an electrical component with a dielectric layer and method for manufacturing an electrical component with a dielectric layer |
| 06/21/2012 | DE102010063387A1 Schaltungsanordnung mit mindestens zwei Teilmoduln Circuit arrangement with at least two sub-modules |
| 06/21/2012 | DE102010063245A1 Leiterplatte mit Schirmung PCB with shielding |
| 06/21/2012 | DE102010054974A1 Leiterplatte und Verfahren zur Herstellung von Leiterplatten Printed circuit board and process for the production of printed circuit boards |
| 06/20/2012 | EP2467004A2 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method |
| 06/20/2012 | EP2467001A1 Circuit assembly with at least two sub-modules |
| 06/20/2012 | EP2467000A1 Moulded part with a substrate with removable protective varnish coating and method for producing same |
| 06/20/2012 | EP2466999A1 Printed circuit board |
| 06/20/2012 | EP2466998A1 Circuit board with shielding |
| 06/20/2012 | EP2465575A1 In-situ fold-assisting frame for flexible substrates |
| 06/20/2012 | EP2465122A2 Composite capacitance and use thereof |
| 06/20/2012 | EP2465102A1 Mechanisms for detecting tampering of an electronic device |
| 06/20/2012 | EP2187717B1 Circuit board manufacturing method |
| 06/20/2012 | EP2056655B1 Wiring board |
| 06/20/2012 | EP1446238B1 Ultrasonic printed circuit board transducer |
| 06/20/2012 | CN202282911U 一种可弯曲防断裂的软硬结合板 One kind of anti-fracture bendable Flex PCB |
| 06/20/2012 | CN202282910U 电路板固定结构 Circuit board fixed structure |
| 06/20/2012 | CN202282909U 一种背光源的fpc板 A backlight plate of fpc |
| 06/20/2012 | CN202282908U 一种背光源的fpc结构 A backlight structure fpc |
| 06/20/2012 | CN202282907U 柔性线路板接口补强结构 Flexible circuit board interface reinforcement structure |
| 06/20/2012 | CN202282906U 具有双层pcb板的移动终端 A mobile terminal double pcb board |
| 06/20/2012 | CN202282905U 一种多层软硬结合板 A multilayer rigid-flex board |
| 06/20/2012 | CN202282413U Reworkable flexible package electrical core and circuit board structure |
| 06/20/2012 | CN202281123U 一种带有定位装置的led中小尺寸背光源 Led a small-size backlight with positioning device |
| 06/20/2012 | CN202279048U 具有改良式光感测器的车用后视镜 Car with improved optical-sensor with mirror |
| 06/20/2012 | CN1883240B Methods and devices for manufacturing of electrical components and laminated structures |
| 06/20/2012 | CN1829412B Double-side flexible circuit substrate capable of repeatedly bending |
| 06/20/2012 | CN1637960B Direct application voltage variable material, components thereof and devices employing |
| 06/20/2012 | CN102511204A Electronic circuit |
| 06/20/2012 | CN102511203A Electronic textile with local energy supply devices |
| 06/20/2012 | CN102510681A Manufacturing method for golden finger and circuit board with golden finger |
| 06/20/2012 | CN102510680A Manufacturing process for circuit board with long and short gold fingers |
| 06/20/2012 | CN102510678A Processing method of flexible folding region of soft and hard combination circuit board and soft and hard combination circuit board |
| 06/20/2012 | CN102510668A Super thick copper PCB plate production method and its circuit board |
| 06/20/2012 | CN102510663A Printed board component and processing method thereof |
| 06/20/2012 | CN102510662A Novel LED sinkless copper plated lamp tape circuit board and manufacturing process thereof |
| 06/20/2012 | CN102510661A Anisotropic electroconductive film and circuit board using same |
| 06/20/2012 | CN102510660A Single-layer impedance printed circuit board and manufacturing method thereof |
| 06/20/2012 | CN102510659A Lead outgoing structure of circuit board |
| 06/20/2012 | CN102510658A Implementation method of H-type groove fractal UC-EBG (Uniplanar Compact Electromagnetic Band Gap) structure oriented to multifrequency antenna substrate |
| 06/20/2012 | CN102510657A Multilayer circuit board and electronic device comprising same |
| 06/20/2012 | CN102504532A Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same |
| 06/20/2012 | CN102504333A Inorganic filler, resin composition and application thereof |
| 06/20/2012 | CN102504332A Inorganic filler and electric material containing same |
| 06/20/2012 | CN102504201A Epoxy resin composition and high-frequency circuit board manufactured thereby |
| 06/20/2012 | CN101916746B Submount and method for manufacturing same |
| 06/20/2012 | CN101877945B Method for removing via stub and PCB designed by using the method |
| 06/20/2012 | CN101877935B Mainboard wiring method and mainboard for wiring by using same |
| 06/20/2012 | CN101877934B Circuit board interconnecting device |
| 06/20/2012 | CN101873767B Sodium-sprayed circuit board |
| 06/20/2012 | CN101822129B Printed board unit and electronic device |
| 06/20/2012 | CN101815400B Divided type pad with surface mount elements |
| 06/20/2012 | CN101768327B Halogen-free bonding film and resin used for same |
| 06/20/2012 | CN101742810B Multilayered wiring board |
| 06/20/2012 | CN101682983B Wiring substrate, semiconductor package, and electronic device |
| 06/20/2012 | CN101600292B Circuit board |
| 06/20/2012 | CN101594729B Circuit board capable of compensating capacitance characteristics of via stump |
| 06/20/2012 | CN101593750B Core substrate and printed wiring board |
| 06/20/2012 | CN101395384B Integrated valve device and power supply device |
| 06/20/2012 | CN101316485B Electronic component module and method of manufacturing the same |
| 06/20/2012 | CN101047067B Thin film capacitor and method of manufacturing the thin film capacitor |
| 06/20/2012 | CN101035412B Method for manufacturing substrate by imprinting |
| 06/20/2012 | CN101004979B Double layer capacitor and its combination and method for mounting it on print circuit board |
| 06/19/2012 | US8205105 Electronic device |
| 06/19/2012 | US8204138 Symbol-based signaling device for an electromagnetically-coupled bus system |
| 06/19/2012 | US8203849 Semiconductor device and manufacture method thereof |
| 06/19/2012 | US8203847 Folding USB drive |
| 06/19/2012 | US8203846 Semiconductor photodetector element and semiconductor device |
| 06/19/2012 | US8203082 Printed circuit board |
| 06/19/2012 | US8203081 Printed circuit board preform with test facilitating means |
| 06/19/2012 | US8203080 Build-up printed wiring board substrate having a core layer that is part of a circuit |
| 06/19/2012 | US8202622 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same |
| 06/19/2012 | US8202566 Method of producing an electronic unit having a polydimethylsiloxane substrate and circuit lines |
| 06/14/2012 | WO2012078488A1 Composite diode, electronic device, and methods of making the same |
| 06/14/2012 | WO2012078377A1 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same |
| 06/14/2012 | WO2012077548A1 Conductive paste, conductive film-attached base material using the conductive paste, and method for manufacturing conductive film-attached base material |
| 06/14/2012 | WO2012077522A1 Circuit module |