| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/14/2012 | WO2012076986A1 Printed circuit board assembly and a method for manufacturing the printed circuit board assembly |
| 06/14/2012 | WO2012076508A1 Printed circuit board arrangement having a microswitch clamped between a printed circuit board and a printed circuit board carrier |
| 06/14/2012 | WO2012076166A1 Printed circuit board |
| 06/14/2012 | US20120149136 Fabrication method of semiconductor integrated circuit device |
| 06/14/2012 | US20120147571 Printed circuit board radio-frequency shielding structures |
| 06/14/2012 | US20120146464 Conductive crosslinked body and production process thereof, and transducer, flexible wiring board and electromagnetic wave shield using the conductive crosslinked body |
| 06/14/2012 | US20120146463 Reconfigurable Printed Circuit Sensor Systems |
| 06/14/2012 | US20120146209 Packaging substrate having through-holed interposer embedded therein and fabrication method thereof |
| 06/14/2012 | US20120145448 Printed circuit board with compound via |
| 06/14/2012 | US20120145447 Via structure, method for forming the via structure, and circuit board with the via structure and method for manufacturing the circuit board |
| 06/14/2012 | US20120145446 Brace for long wire bond |
| 06/14/2012 | US20120145445 Resin multilayer substrate and method for manufacturing the resin multilayer substrate |
| 06/14/2012 | US20120145444 Electronic assembly and method for manufacturing same |
| 06/14/2012 | US20120145443 Circuit board with double-sided universal circuit layout and layout method thereof |
| 06/14/2012 | US20120145442 Interconnect structure |
| 06/14/2012 | US20120145441 Dielectric layer of printed circuit board, method for preparing the same, and printed circuit board including the same |
| 06/14/2012 | US20120145440 Offset Electrode |
| 06/14/2012 | US20120145439 Printed circuit board grounding structure for use with communication apparatus |
| 06/14/2012 | US20120145438 Copper alloy foil, flexible printed circuit board using the same, and method for producing copper alloy foil |
| 06/14/2012 | US20120145437 Wiring board and electronic component device |
| 06/14/2012 | US20120145436 Packaging board |
| 06/14/2012 | DE102011088279A1 Electronic device for use as electronic control unit at engine block of vehicle, has substrate and main body part connected by screw by screw connection between screw and nut, where screw runs through substrate for insertion into nut |
| 06/14/2012 | DE102011082113A1 Erdungsstruktur für Gedruckte Leiterplatten zur Verwendung mit einer Kommunikationsvorrichtung Grounding structure for printed circuit boards for use with a communication device |
| 06/14/2012 | DE102010062944A1 Printed circuit board for control device of motor vehicle, has enlarged planar surface that is formed at side surface opposite to planar surface of surface structure formed apart from function structure of board main portion |
| 06/14/2012 | DE102010062759A1 Printed circuit board arrangement e.g. high-density interconnect printed circuit board arrangement, for gear box control device of motor car, has two printed circuit boards extending adjacent to each other in common plane |
| 06/14/2012 | DE102010062758A1 Printed circuit board arrangement for electronic control device used in motor car, has contacting element overmolded with overmold material, which is provided at end face of upper circuit board contacted with lower circuit board |
| 06/14/2012 | DE102010062757A1 Printed circuit board arrangement for electronic control device used in motor car, has engaging elements which are provided with discrete contacting elements for electrically contacting with complementarily formed contact areas |
| 06/14/2012 | DE102010000091B4 Leiterplattenanordnung Printed circuit board assembly |
| 06/14/2012 | DE102005002751B4 Leiterplatte mit funktionalem Element und Verfahren zur Positionisierung eines funktionalen Elements auf einer Leiterplatte Circuit board with a functional element and method for Positionisierung a functional element on a printed circuit board |
| 06/13/2012 | EP2464202A1 Multi-Layer Substrate and Electronic Device Having the Same |
| 06/13/2012 | EP2463046A1 Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT |
| 06/13/2012 | EP2462788A1 Assembly and method for illuminating through a circuit board |
| 06/13/2012 | EP2057869B1 Power core devices and methods of making thereof |
| 06/13/2012 | EP1882401B1 Control unit comprising a flexible circuit board |
| 06/13/2012 | EP1784064B1 Flexible printed wiring board terminal part or flexible flat cable terminal part |
| 06/13/2012 | EP1696559B1 Noise filter mounting structure |
| 06/13/2012 | EP1425945B1 Pin-free socket compatible with optical-electrical interconnects |
| 06/13/2012 | CN202276573U 防腐蚀水电站监控装置 Corrosion monitoring device Station |
| 06/13/2012 | CN202276549U Electric connection component |
| 06/13/2012 | CN202276548U 电连接组件 The electrical connector assembly |
| 06/13/2012 | CN202276547U 连片印刷电路板移植结构 Printed circuit board structure contiguous transplant |
| 06/13/2012 | CN202276546U 带纠偏结构的高多层不对称电路板结构 Multi-layer structure with high asymmetry correction circuit board structure |
| 06/13/2012 | CN202276545U High-frequency substrate structure |
| 06/13/2012 | CN202276544U 一种多层单面铝基线路板 A multi-sided aluminum circuit board |
| 06/13/2012 | CN202276543U 一种新型的塑料件定位顶紧装置 A new top-tight plastic parts positioning device |
| 06/13/2012 | CN202276542U Composition heat conducting copper foil base plate |
| 06/13/2012 | CN202276541U 采用一分为二电阻接法的外置拼接器电路板 Divided into two using a resistor connected in external splice circuit board |
| 06/13/2012 | CN202276540U PCB routing structure |
| 06/13/2012 | CN202276539U 陶瓷基刚挠结合多层印制电路板 Ceramic-based rigid-flex multilayer printed circuit boards |
| 06/13/2012 | CN1856213B Flexible printed circuit board for catheter, catheter using same, and production method of catheter |
| 06/13/2012 | CN102498562A Flexible circuit module |
| 06/13/2012 | CN102498238A Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition |
| 06/13/2012 | CN102497747A Circuit board structure and manufacturing method thereof |
| 06/13/2012 | CN102497743A Method for embedding resistor and capacitor into same thin substrate |
| 06/13/2012 | CN102497732A PCB (printed circuit board) spliced plate |
| 06/13/2012 | CN102497731A Signal line compensation method and apparatus thereof |
| 06/13/2012 | CN102497730A Ceramic substrate assembly and grounding welding method thereof |
| 06/13/2012 | CN102497729A Electromagnetic band-gap structure |
| 06/13/2012 | CN102497728A Printed circuit board (PCB) |
| 06/13/2012 | CN102497727A Printed circuit board (PCB) with stamp holes |
| 06/13/2012 | CN102497726A Printed circuit board with liquid-vapor phase transition heat transfer substrate and preparation method thereof |
| 06/13/2012 | CN102497725A Circuit board capable of reducing antenna electromagnetic interference |
| 06/13/2012 | CN102497724A PCB with high reliability and processing method thereof |
| 06/13/2012 | CN102497723A Circuit wiring board incorporating heat resistant substrate |
| 06/13/2012 | CN102496794A Blind placement connector, single board, related device and related system |
| 06/13/2012 | CN102496793A Connector, PCB (printed circuit board) of LED light bar and LED light bar |
| 06/13/2012 | CN102496614A Packaging structure and packaging method of collimated light device |
| 06/13/2012 | CN102496458A Multilayer capacitor |
| 06/13/2012 | CN102492261A Adhesive for producing common Tg lead-free copper foil-coated plates and preparation method for adhesive |
| 06/13/2012 | CN101627447B Non-adhesive-type flexible laminate and method for production thereof |
| 06/13/2012 | CN101610634B Flexible printed circuit board, touch panel, display panel and display |
| 06/13/2012 | CN101455129B Shielded via |
| 06/13/2012 | CN101395975B Electronic part mounting structure and its manufacturing method |
| 06/13/2012 | CN101370892B Polyimide resin composition and metal polyimide laminate |
| 06/13/2012 | CN101360387B Flexible circuit board base membrane, flexible circuit board substrate and flexible circuit board |
| 06/13/2012 | CN101166395B Semiconductor mounting substrate and method for manufacturing the same |
| 06/12/2012 | US8199522 Printed circuit board |
| 06/12/2012 | US8199519 Chip adapter |
| 06/12/2012 | US8199517 Flexible printed circuit board, method of fabricating the flexible printed circuit board, and display device having the flexible printed circuit board |
| 06/12/2012 | US8199512 Memory card connector |
| 06/12/2012 | US8198723 Low inductance power distribution system for an integrated circuit chip |
| 06/12/2012 | US8198551 Power core for use in circuitized substrate and method of making same |
| 06/12/2012 | US8198549 Multi-layer printed wiring board |
| 06/12/2012 | US8198548 Z-directed capacitor components for printed circuit boards |
| 06/12/2012 | US8198547 Z-directed pass-through components for printed circuit boards |
| 06/12/2012 | US8198546 Printed wiring board |
| 06/12/2012 | US8198545 Printed circuit board removing bonding sheet around signal transmission line |
| 06/12/2012 | US8198544 Printed wiring board and manufacturing method thereof |
| 06/12/2012 | US8198543 Rigid-flexible circuit board and method of manufacturing the same |
| 06/12/2012 | US8198542 Flexible printed circuit board and method of manufacturing the same |
| 06/12/2012 | US8198540 Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module |
| 06/12/2012 | US8198539 Heat radiator and power module |
| 06/12/2012 | US8198538 Capacitor devices having multi-sectional conductors |
| 06/12/2012 | US8198138 Methods for providing and using grid array packages |
| 06/12/2012 | US8198135 Method for producing flexible integrated circuits which may be provided contiguously |
| 06/07/2012 | WO2012074101A1 High-frequency signal line and electronic device |
| 06/07/2012 | WO2012074100A1 High-frequency signal line |
| 06/07/2012 | WO2012074015A1 Anisotropic conductive material and method for manufacturing same |
| 06/07/2012 | WO2012073591A1 High-frequency signal line |
| 06/07/2012 | WO2012073466A1 Substrate, semiconductor device, and method for manufacturing substrate |