| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/26/2013 | US8404978 Flex-rigid wiring board and method for manufacturing the same |
| 03/26/2013 | US8404977 Flexible circuit assembly without solder |
| 03/26/2013 | US8403226 Chip card holder |
| 03/26/2013 | US8402626 Heat sink installing device |
| 03/21/2013 | WO2013040396A1 Wireless communication with dielectric medium |
| 03/21/2013 | WO2013039957A2 Risers including a plurality of high aspect ratio electrical conduits and systems and methods of manufacture and use thereof |
| 03/21/2013 | WO2013039442A1 Circuit card configuration |
| 03/21/2013 | WO2013038851A1 Display device for use in vehicle |
| 03/21/2013 | WO2013038602A1 Epoxy resin composition and printed board obtained using same |
| 03/21/2013 | WO2013037989A1 Circuitry arrangement for reducing a tendency towards oscillations |
| 03/21/2013 | WO2013037698A1 Circuit board and electrical components for use in an aggressive environment and method for producing such a circuit board |
| 03/21/2013 | WO2012155135A3 Scalable high-bandwidth connectivity |
| 03/21/2013 | WO2012151371A3 High-voltage resistance for a connector attached to a circuit board |
| 03/21/2013 | WO2012150777A3 The printed circuit board and the method for manufacturing the same |
| 03/21/2013 | US20130070437 Hybrid interposer |
| 03/21/2013 | US20130070429 Integrated voltage divider |
| 03/21/2013 | US20130069750 System Using Multi-Layer Wire Structure for High Efficiency Wireless Communication |
| 03/21/2013 | US20130069749 System Comprising a Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Communication |
| 03/21/2013 | US20130069748 Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Communication |
| 03/21/2013 | US20130069680 Risers including a plurality of high aspect ratio electrical conduits and systems and methods of manufacture and use therof |
| 03/21/2013 | US20130069251 Wiring substrate, method of manufacturing the same, and semiconductor device |
| 03/21/2013 | US20130069087 Multi-layer wiring substrate, active matrix substrate, image display apparatus using the same, and multi-layer wiring substrate manufacturing method |
| 03/21/2013 | US20130068754 Variable watt density layered heater |
| 03/21/2013 | US20130068517 Substrate structure and method for manufacturing the same |
| 03/21/2013 | US20130068516 High io substrates and interposers without vias |
| 03/21/2013 | US20130068515 Interconnect board and electronic apparatus |
| 03/21/2013 | US20130068514 Flip-chip carrier and fabricating method of mps-c2 package utilized from the same |
| 03/21/2013 | US20130068513 Wiring board, production method of the same, and via paste |
| 03/21/2013 | US20130068512 Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
| 03/21/2013 | US20130068511 System and method for formation of electrical conductors on a substrate |
| 03/21/2013 | US20130068510 Method of manufacturing printed circuit board having vias and fine circuit and printed circuit board manufactured using the same |
| 03/21/2013 | US20130068509 Method and apparatus for connecting inlaid chip into printed circuit board |
| 03/21/2013 | US20130068508 Ceramic printed circuit board structure |
| 03/21/2013 | US20130068507 Multi-Layer Wire Structure for High Efficiency Wireless Communication |
| 03/21/2013 | US20130068506 Plating system and method of manufacturing the same |
| 03/21/2013 | US20130068505 Perforated mother sheet for partial edge chemical strengthening |
| 03/21/2013 | DE102011113929A1 Electromechanical circuit structure for use as rack for e.g. LED in automotive environment, has deriving device deriving heat dissipated from electrical component that is contacted with injection molding casing |
| 03/21/2013 | DE102011113523A1 Electronic component group, useful in cash control unit, comprises memory card with electrical pad, and printed circuit board with electrical contact surface, where electrical conductive connection is formed between pad and contact surface |
| 03/21/2013 | DE102011082971A1 Printed circuit board manufacturing method, involves applying printed circuit board protection coating with base composition and viscosity-increasing additive on current-carrying portion of printed circuit board |
| 03/21/2013 | DE102011082945A1 Elektronische leiterplatte und verfahren zur herstellung einer leiterplatte Electronic circuit board and method for manufacturing a printed circuit board |
| 03/21/2013 | DE102011053680A1 Schaltungsanordnung zur Verminderung von Oszillationsneigung Circuitry to reduce to oscillation |
| 03/20/2013 | EP2571341A1 Method for producing reuse paste and reuse paste |
| 03/20/2013 | EP2571340A1 Method for producing circuit board |
| 03/20/2013 | EP2571339A2 Thin electronic device comprising a conductive member |
| 03/20/2013 | EP2571068A1 Mounting board, method for manufacturing same, light emitting module, and illuminating apparatus |
| 03/20/2013 | EP2570720A1 Circuit board assembly and lighting device |
| 03/20/2013 | EP2570006A1 Extendable network structure |
| 03/20/2013 | EP2569577A1 High intensity led replacement of incandescent lamps |
| 03/20/2013 | CN202818857U Shielding case and PCB (printed circuit board) installation structure |
| 03/20/2013 | CN202818767U PCB (Printed Circuit Board) chip layout structure and electronic terminal applying the structure |
| 03/20/2013 | CN202818766U PCB board with components mounted on surface thereof |
| 03/20/2013 | CN202818765U High-frequency coil |
| 03/20/2013 | CN202818764U A flexible circuit board device provided with a fixing device |
| 03/20/2013 | CN202818763U A spliced LED substrate with clamping slots |
| 03/20/2013 | CN202818762U Pad structure of flexible circuit board |
| 03/20/2013 | CN202818761U Flexible circuit board |
| 03/20/2013 | CN202818760U Polytetrafluoroethylene fiberglass cloth and epoxy resin fiberglass cloth mixedly-compressed multilayer circuit board |
| 03/20/2013 | CN202818759U PCB board |
| 03/20/2013 | CN202818758U 印刷电路板阻抗条结构 PCB impedance strip structure |
| 03/20/2013 | CN202818757U Flexible circuit board |
| 03/20/2013 | CN202818756U Integrated design of circularly polarized antenna and electronic circuit |
| 03/20/2013 | CN202818755U Radial-wiring onboard memory structure |
| 03/20/2013 | CN202818754U Transparent multi-layer circuit board |
| 03/20/2013 | CN202818753U Flexible PCB board with electronic components mounted on surface thereof |
| 03/20/2013 | CN202818752U Cellphone circuit mainboard convenient to assemble |
| 03/20/2013 | CN202817823U Charging circuit, circuit board thereof, and charging end cover |
| 03/20/2013 | CN202817204U Spring clip used for connecting printed circuit board |
| 03/20/2013 | CN202816627U High frequency high voltage high power density transformer |
| 03/20/2013 | CN202816274U Improved patch nixie tube structure |
| 03/20/2013 | CN202805801U Copper-clad board and printed circuit board |
| 03/20/2013 | CN1784807B Coaxial waveguide microstructures and forming method |
| 03/20/2013 | CN102986318A A thermally controlled assembly |
| 03/20/2013 | CN102986309A A thermally controlled assembly |
| 03/20/2013 | CN102986308A High-frequency signal line |
| 03/20/2013 | CN102986307A Structured circuit board and method |
| 03/20/2013 | CN102986306A Circuit board having grown metal layer in a flexible zone |
| 03/20/2013 | CN102986024A Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both |
| 03/20/2013 | CN102985485A Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, printed circuit board, and build-up film |
| 03/20/2013 | CN102985252A Copper foil complex |
| 03/20/2013 | CN102984892A Hole metallization method of circuit board with high thickness-to-radius ratio, circuit board and electronic product |
| 03/20/2013 | CN102984891A Electronic device convenient to weld and position |
| 03/20/2013 | CN102984889A Method used for assembling printed circuit board |
| 03/20/2013 | CN102984887A 三维线路结构及其制造方法 Three dimensional wiring structure and manufacturing method |
| 03/20/2013 | CN102984884A Mounting technology for radiator and PCB |
| 03/20/2013 | CN102984883A Structure capable of avoiding cold solder joint of elements and method thereof |
| 03/20/2013 | CN102984882A High-frequency module and high-frequency device using the same |
| 03/20/2013 | CN102984881A Circuit board connection structure |
| 03/20/2013 | CN102984880A Metal dome packing pad structure, printed circuit board (PCB) and manufacturing method of the PCB |
| 03/20/2013 | CN102984879A 电路板 Board |
| 03/20/2013 | CN102983424A Connection structure and connection method for circuit board and casing plug-in piece |
| 03/20/2013 | CN102982932A Voltage induction variable resistance film envelope capable of absorbing instant electric pulse energy as well as manufacturing method and application of film |
| 03/20/2013 | CN102980048A Light emitting diode (LED) light source module |
| 03/20/2013 | CN102977340A A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom |
| 03/20/2013 | CN102301837B Multi-layer circuit board and manufacturing method thereof |
| 03/20/2013 | CN102260378B Composite material, high-frequency circuit board manufactured therefrom and manufacturing method of high-frequency circuit board |
| 03/20/2013 | CN102212240B Printed circuit board protective film and using method thereof |
| 03/20/2013 | CN102131337B Circuit board and manufacturing process thereof |
| 03/20/2013 | CN102106196B Capacitively coupled connector for flexible printed circuit applications |
| 03/20/2013 | CN102065632B Electromagnetic bandgap structure and printed circuit board comprising the same |
| 03/20/2013 | CN102045936B 线路板结构 Board structure |