Patents for H05K 1 - Printed circuits (98,583)
03/2013
03/20/2013CN102024772B Heat-dissipating substrate and fabricating method thereof
03/20/2013CN101973145B Method for preparing embedded material and embedded material prepared thereby
03/20/2013CN101939677B Manufacturing method of optical wiring printed board and optical wiring printed circuit board
03/20/2013CN101932193B Printed circuit board and method for manufacturing the same
03/20/2013CN101820725B Flexible printed board
03/20/2013CN101785371B Fpc-based relay connector
03/20/2013CN101759857B Biomass-derived epoxy compound and manufacturing method thereof
03/20/2013CN101742819B Circuit board compobination
03/20/2013CN101677487B Printed wiring board and method for manufacturing the same
03/20/2013CN101647325B Method for removing a part of a planar material layer and multilayer structure
03/20/2013CN101616540B Wired circuit board and method of manufacturing the same
03/20/2013CN101582225B Flexible light emitting diode (LED) display screen
03/20/2013CN101557679B Flexible printing patch panel, input module and portable device
03/19/2013US8400782 Wiring board and method for manufacturing the same
03/19/2013US8400781 Using interrupted through-silicon-vias in integrated circuits adapted for stacking
03/19/2013US8400780 Stacked microfeature devices
03/19/2013US8400776 Multilayered printed wiring board
03/19/2013US8400775 Capacitor with direct DC connection to substrate
03/19/2013US8400774 Packaging techniques and configurations
03/19/2013US8400057 Sealing substrate, organic electroluminescence apparatus and method of fabricating the same
03/19/2013US8400013 Electrical appliance
03/19/2013US8399779 Wiring board and method of manufacturing the same
03/19/2013US8399778 Circuit board structure and fabrication method thereof
03/19/2013US8399776 Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
03/19/2013US8399775 Flex-rigid wiring board and method of manufacturing the same
03/19/2013US8399774 Substrate for suspension
03/19/2013US8399773 Substrates having voltage switchable dielectric materials
03/19/2013US8399772 Control of carbon nanostructure growth in an interconnect structure
03/19/2013US8397378 Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board
03/19/2013CA2660875C Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same
03/19/2013CA2526461C Process for producing modified epoxy resin
03/19/2013CA2506846C Display of operational instructions
03/18/2013DE202013100614U1 Ein Chip, ein Printmaterialbehälter und ein Drucksystem A chip, a printed material container and a printing system
03/14/2013WO2013036505A1 Low dielectric glass and fiber glass
03/14/2013WO2013036230A1 Patterned adhesive tape for backgrinding processes
03/14/2013WO2013036026A2 Printed circuit board, display device including the same, and method of fabricating the same
03/14/2013WO2013035933A1 Transformer using symmetrical printing pattern
03/14/2013WO2013035888A1 Wiring board
03/14/2013WO2013035717A1 Module, and manufacturing method for module
03/14/2013WO2013035284A1 Terminal unit with security features
03/14/2013WO2013035164A1 Adhesive composition and connection body
03/14/2013WO2013035021A1 Method for manufacturing a component interconnect board
03/14/2013WO2013035017A1 Method for manufacturing a led matrix and a device comprising a led matrix
03/14/2013WO2013034661A1 Current sensor and printed circuit board for this sensor
03/14/2013WO2013034659A1 Printed circuit board and magnetic field or current sensor
03/14/2013WO2013034501A2 An led lighting apparatus, a method for manufacturing the same and an led advertisement module having the led lighting apparatus
03/14/2013WO2013033935A1 Liquid crystal display module and liquid crystal display panel
03/14/2013US20130063919 Liquid crystal display module and liquid crystal panel
03/14/2013US20130063918 Low cte interposer
03/14/2013US20130063916 Protection for Circuit Boards
03/14/2013US20130063906 Circuit board assembly and electronic device with circuit board
03/14/2013US20130063905 Circuit board sensor and method for producing the same
03/14/2013US20130063891 Reducing the border area of a device
03/14/2013US20130063854 3-dimensional multi-layered modular computer architecture
03/14/2013US20130063568 Camera system comprising color display and processor for decoding data blocks in printed coding pattern
03/14/2013US20130062778 Wiring substrate and semiconductor package
03/14/2013US20130062754 Wiring substrate and semiconductor package
03/14/2013US20130062112 Fabrication method for carrier substrate, printed circuit board using the same, and fabrication method thereof
03/14/2013US20130062111 Stacked substrate module
03/14/2013US20130062110 Electronic device, cable coupling structure, and method of fabricating electronic device
03/14/2013US20130062109 Electrical Conductive Member and Electrical Conductive Member Assembly
03/14/2013US20130062108 Wiring board and method of manufacturing the same
03/14/2013US20130062107 Multilayer wiring board and production method of the same
03/14/2013US20130062106 Printed Circuit Board and Method of Manufacturing the Same
03/14/2013US20130062105 Apparatus for broadband matching
03/14/2013US20130062104 Resonant material layer apparatus, method and applications
03/14/2013US20130062103 Composite structure, solid film, and method for producing the composite structure
03/14/2013US20130062102 Double-sided flexible printed circuit board and method of manufacturing the same
03/14/2013US20130062101 Multilayer wiring substrate, and manufacturing method for multilayer substrate
03/14/2013US20130062100 Circuit board structure
03/14/2013US20130062099 Multiple layer z-axis interconnect apparatus and method of use
03/14/2013US20130061674 Method for producing a capping wafer for a sensor
03/14/2013DE19615481C5 Gewölbtes Metall-Keramik-Substrat Corrugated metal-ceramic substrate
03/14/2013DE102011082537A1 Leiterplatte und elektrische Bauteile zum Einsatz in aggressiver Umgebung und Verfahren zur Herstellung einer solchen Leiterplatte Printed circuit board and electrical components for use in an aggressive environment and method of manufacturing such a printed circuit board
03/14/2013CA2850418A1 Conductor track unit for a motor vehicle
03/14/2013CA2811360A1 Low dielectric glass and fiber glass
03/13/2013EP2568783A1 Electronic device, cable connection structure, and process for production of electronic device
03/13/2013EP2568782A1 Tool and method for embedding a module in a data carrier
03/13/2013EP2568781A1 Printed circuit
03/13/2013EP2568780A1 Coiled magnetic ring
03/13/2013EP2568779A1 Device for electronic contacting of an optical display unit
03/13/2013EP2568778A1 Flexible conductive material, method for manufacturing same, and electrode, wiring, electromagnetic wave shielding, and transducer using flexible conductive material
03/13/2013EP2568419A1 Apparatus comprising an RFID device
03/13/2013EP2568301A1 Current sensor and printed circuit board for such a sensor
03/13/2013EP2567853A2 Holder element for fixing an electric motor to an electronic circuit board, display device of a motor vehicle comprising an electrical display instrument with an electric motor fixed to an electronic circuit board by means of such a holder element and method for fixing an electric engine to an electronic circuit board by means of such a holder element
03/13/2013EP2567605A2 Printed circuit board with embossed hollow heatsink pad
03/13/2013EP2567603A2 Method of fabricating micro structured surfaces with electrically conductive patterns
03/13/2013EP2567600A1 Circuit board for display and display module with display and circuit board
03/13/2013CN202799468U Audio frequency equipment
03/13/2013CN202799402U PCB board and packaging structure of multipin component
03/13/2013CN202799401U Protective circuit board of direct current electromagnetic valve
03/13/2013CN202799400U PCB (printed circuit board) connection structure
03/13/2013CN202799399U Light-emitting diode (LED) straight guide aluminium-based circuit board
03/13/2013CN202799398U Communication circuit board
03/13/2013CN202799397U Surface mounted device
03/13/2013CN202799396U Flexible circuit board
03/13/2013CN202799395U Photoelectric direct reading water meter master control circuit board structure
03/13/2013CN202799394U Printed circuit board assembly
03/13/2013CN202799393U FPC (flexible printed circuit) golden finger
03/13/2013CN202799392U Printed circuit board and printed circuit board assembly including same