Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
10/2007
10/18/2007WO2007116848A1 Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method
10/18/2007WO2007091196A3 A semiconductor process system having an optical instrument comprising an apparatus for aligning an optical device with an object
10/18/2007US20070242804 Radiation Detector Module
10/18/2007US20070241028 Method and Device for Exposing Electronic Components
10/18/2007DE19751435B4 Vorrichtung zum Vereinzeln von elektrischen Kontaktelementen Apparatus for separating electrical contact elements
10/18/2007DE102006024493A1 Loading method for circuit board, involves assigning selected component variant corresponding category and another component variant extracted to component variant to item code in each component variant
10/18/2007DE102006016275A1 Verfahren zum Platzieren von elektrisch kontaktierbaren Bauelementen auf einem Schaltungsträger sowie zur Durchführung dieses Verfahrens geeignetes Montagesystem Method of placing electrically contactable components on a circuit carrier and for carrying out this method suitable mounting system
10/17/2007EP1845767A1 Loading head for populating substrates with electrical components
10/17/2007CN200962711Y A circuit board clamp transport claw
10/17/2007CN200962698Y Thermal fusion clamp pole structure
10/17/2007CN200962691Y A line board clamping transport claw
10/17/2007CN101056533A Automatic assembling machine for substrate equipping electric components
10/17/2007CN101056532A Automatic assembling machine for substrate equipping electric components
10/17/2007CN101056502A Electronic device for avoiding excessive glue pollution
10/17/2007CN100343969C Single plate temperature circulation aging device and its aging method
10/17/2007CN100343009C Method and apparatus for supporting a substrate
10/16/2007US7283373 Electronic device
10/11/2007WO2007082611B1 Apparatus and method for transferring a plurality of chips from a wafer to a substrate
10/11/2007US20070235371 Method for carrying a semiconductor device
10/10/2007CN200959698Y Supporter
10/10/2007CN101053294A Mounter and board positioning method
10/10/2007CN101053293A Holder identifying apparatus, component supplying method and mounter
10/10/2007CN101053292A Illumination array and optical measuring system for detecting object
10/10/2007CN101052927A Monitoring method, monitoring apparatus, and mounter
10/10/2007CN101052294A Factor estimation apparatus, factor estimation method and recording medium
10/10/2007CN101052293A Control method for reflux welding curve on surface sticking process production line
10/10/2007CN100342768C Electronic component with shielding case and method of manufacturing the same
10/09/2007US7279366 Method for assembling semiconductor die packages with standard ball grid array footprint
10/09/2007US7278204 Electric-component holding apparatus
10/09/2007US7278203 Random-period chip transfer apparatus
10/04/2007WO2007111296A1 Nozzle mechanism, mounting head, and electronic component mounting equipment
10/04/2007WO2007110318A1 Method for producing an electrically insulating cast body and a base for a lamp
10/04/2007US20070227941 Receiver for Component Feed Plates and Component Feeder
10/04/2007US20070226993 Apparatus for adhering electronic device and a method for adhering electronic device
10/04/2007US20070226992 Substrate holding rotating mechanism, and substrate processing apparatus
10/04/2007DE202005021343U1 Trenneinrichtung für flächenhafte Werkstücke, insbesondere zum Vereinzeln von bestückten Leiterplatten Separating device for planar workpieces, especially for separating assembled PCBs
10/04/2007DE102006002367B3 Vorrichtung und Verfahren zur Übertragung einer Mehrzahl von Chips von einem Wafer auf ein Substrat Apparatus and method for transmitting a plurality of chips from a wafer to a substrate
10/04/2007DE102005046963B4 Maschinengrundkörper und Bestücksystem zum Bestücken von Substraten mit elektrischen Bauteilen Machine base and placement system for loading substrates with electrical components
10/03/2007EP1840503A1 A component placement unit as well as a component placement device comprising such a component placement unit
10/03/2007EP1839763A1 Liquid discharge device
10/03/2007EP1839473A2 Holder identifying apparatus, component supplying method and mounter
10/03/2007EP1839472A2 Pick-and-place machine comprising a locking device for coupling a feeding unit to it
10/03/2007EP1839471A2 Component carrier and method for making
10/03/2007CN200956712Y Punching-cutting assembling device
10/03/2007CN200956688Y Circuit board connector pressing machine positioning device
10/03/2007CN200956687Y Circuit board connector pressing machine
10/03/2007CN200956686Y Circuit board fixing post
10/03/2007CN101049056A Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
10/03/2007CN101048058A A component placement unit as well as a component placement device comprising such a component placement unit
10/03/2007CN101047136A Manufacturing method of mobile storage equipment
10/03/2007CN100341391C Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board
10/03/2007CN100341390C 半导体装置 Semiconductor device
10/03/2007CN100341388C Device and method for aligning assembly with electric circuit board
10/03/2007CN100341125C Eqipment and method for mounting electronic part
10/02/2007US7275314 Electronic component mounting apparatus and electronic component mounting method
09/2007
09/27/2007WO2007108352A1 Electronic part mounting device and electronic part mounting method
09/27/2007WO2007106990A1 Thermal pre-scanning of electric circuits using thermally-trimmable resistors
09/27/2007DE102004026534B4 Halbleiter-Montageeinrichtung Semi-conductor mounting means
09/26/2007CN200953691Y Automatic pin-punching machine
09/26/2007CN101043795A Electronic component having shield case and method for manufacturing the same
09/26/2007CN101042356A Method for confirming maintenance station and making substrates as defect
09/26/2007CN100340146C Carsette turning over and positioning device
09/25/2007US7273166 Component information applying method and apparatus
09/25/2007US7272887 Component placement device and method
09/20/2007WO2007105870A1 Method and apparatus for inspecting touch function of touch panel
09/20/2007WO2007105687A1 Paste transfer apparatus and electronic component mounting apparatus
09/20/2007WO2007105608A1 Component mounting condition determination method
09/20/2007US20070218737 Printed-Board Supporting Apparatus
09/20/2007US20070218721 Electrical Equipment for Junction and Method of Manufacturing the Same
09/20/2007US20070218257 Circuit board, its manufacturing method, and joint box using circuit board
09/20/2007US20070214629 Device and method for mounting part
09/20/2007DE112005002446T5 Bestückungsmaschine mit verbesserter Bauteilaufnahmeprüfung Component placement machine with improved entrance examination
09/20/2007DE102005005895B4 Zuführvorrichtung für in einem Transportband aufbewahrte Bauelemente Feeder kept in a conveyor belt components
09/19/2007EP1835796A1 Interposer bonding device
09/19/2007EP1834516A1 Method for equipping a component support
09/19/2007CN200950697Y Supports
09/19/2007CN100338987C Base board operation result checking device and method and electric circuit producing system and method
09/19/2007CN100338975C Coating technique on surface of testing covering plate and is manufacturing method
09/18/2007US7270712 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
09/18/2007US7269892 Electric part handling device
09/13/2007US20070212901 Circuit Board With Holding Mechanism For Holding Wired Electronic Components Method For Manufacture Of Such A Circuit Board And Their Use In A Soldering Oven
09/13/2007DE102005061680B3 Einrichtung und Verfahren zur gleichzeitigen Übertragung einer Mehrzahl von elektronischen Bauteilen Apparatus and method for the simultaneous transmission of a plurality of electronic components
09/13/2007DE102005013763B4 Herstellungsverfahren für eine Anordnung zur Wärmeableitung A method for manufacturing an arrangement for heat dissipation
09/13/2007DE10163270B4 Bildaufnahmevorrichtung und zugehöriges Verfahren An image pickup apparatus and associated method
09/12/2007EP1833290A1 Electronic component production method and electronic component production equipment
09/12/2007CN200947030Y Device for detecting coplanarity
09/12/2007CN101035726A Singulating and loading device for elongate holders for electronic components
09/12/2007CN101035425A Side cover assembly of feeder
09/12/2007CN100336638C Tool exchange device and tool
09/11/2007US7268304 Microelectronic connection components having bondable wires
09/11/2007US7267522 Method and device for the introduction of planar substrates into a receiving container
09/11/2007US7267382 Low maintenance vacuum generation
09/11/2007US7266887 Substrate transportation apparatus, component mounting apparatus and substrate transportation method in component mounting operation
09/07/2007WO2007100022A1 Mounting method and component mounter
09/07/2007WO2007099873A1 Method and apparatus for mounting electronic component and semiconductor device manufacturing method
09/07/2007WO2007099725A1 Suction nozzle member for electronic part
09/06/2007US20070208449 Method For Manufacturing A High-Frequency Assembly
09/06/2007DE102006024733B3 Insert feeder for mounting machine of conductor board, has housing, gear and sprocket wheel fixed with conveyor belt, and stator is fasten directly on side wall of housing and forms side wall of housing together side wall of derive motors
09/06/2007DE102006021762A1 Substrate mounting machine base, has base body with thread having thread diameter for screwing base with chassis of mounting machine, and another thread formed at base body with thread diameter larger than former thread diameter
09/05/2007CN200944705Y Clamping device of circuit board combined machine
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