| Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634) |
|---|
| 02/13/2008 | EP1887844A2 Wired electro-mechanical components and method for their manufacture |
| 02/13/2008 | EP1887518A2 Method of setting reference data for inspection of solder fillets and inspection device using same |
| 02/13/2008 | EP1887512A1 Automatic part teaching device |
| 02/13/2008 | CN201022242Y A tool for flexible printed circuit board welding sensor |
| 02/13/2008 | CN101124864A Positioning device with positioning unit capable of linearity moving |
| 02/13/2008 | CN101124453A System for 2-D and 3-D vision inspection |
| 02/13/2008 | CN101123867A Apparatus for and method of discharging tape |
| 02/13/2008 | CN101123848A Circuit module and its making method |
| 02/13/2008 | CN101122569A Method of setting reference data for inspection of solder fillets and substrate outer appearance inspection device |
| 02/13/2008 | CN100369536C Method and apparatus for fabricating circuit board, with three dimensional surface mounted array of semiconductor chips |
| 02/12/2008 | US7330773 Multiple insertion head |
| 02/12/2008 | US7329083 Loader and unloader for workpiece |
| 02/12/2008 | US7328769 Rigging system for loudspeaker arrays |
| 02/07/2008 | WO2008016437A2 Methods and apparatus for efficiently generating profiles for circuit board work/rework |
| 02/07/2008 | WO2008015988A1 Component mounting condition determining method |
| 02/07/2008 | DE102006036049A1 Electronic module for radiation sensor-component, has electronic components arranged in recess of printed circuit board as installation components such that electronic component do not project over board surface surrounding recess |
| 02/07/2008 | DE102004043282B4 Verfahren für die Justierung des Bondkopfs eines Die-Bonders A method for the adjustment of the bonding head of a die bonder |
| 02/06/2008 | CN201017863Y IC chip reworking station video synthetic para-position device |
| 02/06/2008 | CN101120630A Positioning device, transfer device and method for positioning a holder for electronic components |
| 02/06/2008 | CN101119631A Suction nozzle replacing device for part mounting machine |
| 02/06/2008 | CN101118899A Apparatus and method for arranging predetermined element on target platform |
| 02/06/2008 | CN100366392C Electric tweezers |
| 02/05/2008 | US7326863 Hinge for cable trough cover |
| 02/05/2008 | US7326065 Bridge clip with reinforced stiffener |
| 02/05/2008 | CA2346914C Apparatus and method for the visual inspection of concealed soldered joints |
| 01/31/2008 | US20080023368 Multi-row passive component carrier tape |
| 01/31/2008 | DE102006033685A1 Bestimmung der Orientierung einr Kamera ralativ zu einer Referenzebene Determining the orientation einr camera ralativ to a reference plane |
| 01/30/2008 | EP1881894A1 Adhesive film |
| 01/30/2008 | EP1776717B1 Gripper unit, mounting head, and method for fitting substrates with electrical components |
| 01/30/2008 | EP1265474B1 Method and device for part feeding and part mounting device using the method and device |
| 01/30/2008 | CN101115384A Feeder management system |
| 01/30/2008 | CN101115383A Setting device, component mounting system, program and calculating method |
| 01/30/2008 | CN100366137C Electronic part mounting apparatus and method therefor |
| 01/30/2008 | CN100365783C Designing method for improving breakdown potential of electronic element with epoxy powder pack |
| 01/29/2008 | CA2266471C Cover tape for formed tape packing system and process for making same |
| 01/24/2008 | US20080016947 Gas sensor and method for manufacturing gas sensor |
| 01/24/2008 | DE19707485B4 Haltevorrichtung und Haltebaugruppe für ein Leiterplatten-Prüfgerät Holding device and support assembly for a printed circuit board testing device |
| 01/23/2008 | EP1881753A2 Determination of the orientation of a camera relative to a reference plane |
| 01/23/2008 | EP1880398A1 Electronic component and method for fixing the same |
| 01/23/2008 | CN101112144A Electronic component mounting system and electronic component mounting method |
| 01/22/2008 | US7320772 System for embossing carrier tape and method for producing carrier tape |
| 01/17/2008 | US20080013240 Low forward voltage drop transient voltage suppressor and method of fabricating |
| 01/17/2008 | US20080013104 Pick and place machine with improved component placement inspection |
| 01/17/2008 | DE102007028379A1 Controlling method for processing of printed substrate, involves storing fault data in transponder of fault utilization, where fault data is selected and converted to control processing machine of transponder |
| 01/17/2008 | DE102006032821A1 Chip cards producing method, involves sucking card base body by hole in plates, where sucking is carried out by applying vacuum on plate and chip module is inserted into cavity through other hole in plate |
| 01/16/2008 | EP1879199A2 Device for leading one of two cables to a slot constituted by two powered friction rollers |
| 01/16/2008 | EP1878331A1 Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device |
| 01/16/2008 | EP1566088B1 Method for fixing a miniaturised component to a carrier plate |
| 01/16/2008 | CN201008256Y Connector clamping cover |
| 01/16/2008 | CN101107899A Method of mounting component and component mounter |
| 01/16/2008 | CN101107898A Electronic component mounting system and electronic component mounting method |
| 01/16/2008 | CN101107897A Component carrier and method for making |
| 01/16/2008 | CN101106899A Component mounting position correcting method and component mouting apparatus |
| 01/16/2008 | CN101106898A Substrate supportring device, device and method for manufactruring the same |
| 01/16/2008 | CN101106897A High-speed picker applying multi-header turning tower structure |
| 01/16/2008 | CN101106896A Panel overturn device |
| 01/16/2008 | CN101106871A A marking apparatus used in a process for producing multi-layered printed circuit board |
| 01/16/2008 | CN101106121A Wiring substrate, semiconductor device, and method of manufacturing the same |
| 01/16/2008 | CN100362905C Part inserting head device, part inserting device, and part inserting method |
| 01/15/2008 | US7318516 Substrate transfer apparatus for component mounting machine |
| 01/15/2008 | US7318307 Method and device for packaging and transporting electronic components |
| 01/15/2008 | US7318273 Method for producing pH probes |
| 01/10/2008 | WO2008004850A1 Collet head for placement machine |
| 01/10/2008 | WO2008004702A1 Acf attachment device and acf attachment method |
| 01/10/2008 | WO2008003429A1 Interface device |
| 01/10/2008 | WO2007120325A3 Shielding apparatus |
| 01/10/2008 | US20080007943 Modular light fixture with power pack with latching ends |
| 01/10/2008 | US20080007930 Photoelectric conversion module, assembling method thereof, high-speed transmission connector, and mounting system |
| 01/10/2008 | US20080005900 Component Shape Profiling Method and Component Mounting Method |
| 01/10/2008 | US20080005895 Random-period chip transfer method |
| 01/10/2008 | US20080005894 Component Mounting Apparatus And Method For Determining Component Holding Members |
| 01/10/2008 | DE112004000557T5 Meßtechnik für die Durchbiegung von Platinen unter Verwendung von photoelektrischen Verstärkern Test equipment for the deflection of boards using photoelectric amplifiers |
| 01/09/2008 | EP1876879A2 Classification of components when equipping component supports |
| 01/09/2008 | EP1876878A1 Setting device, component mounting sytem, program and calculating method |
| 01/09/2008 | EP1876877A1 Electronic component manufacturing apparatus |
| 01/09/2008 | EP1874550A2 Dynamic printhead alignment assembly |
| 01/09/2008 | EP1629706B1 Method for assembling a circuit |
| 01/09/2008 | EP0999733B1 Part mounting machine |
| 01/09/2008 | CN201004735Y Conveying device for soft circuit board |
| 01/09/2008 | CN201004457Y Carrying tray for shipment of electronic products |
| 01/09/2008 | CN101103663A Component mounting apparatus and method for determining component holding members |
| 01/09/2008 | CN101103662A Pick-and-place machine comprising a locking device for coupling a feeding unit to it |
| 01/09/2008 | CN101103656A Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 01/09/2008 | CN101102663A Double array direct insertion integrated pin shaping method and device |
| 01/09/2008 | CN101102662A Surface mounting structure for electronic component |
| 01/09/2008 | CN101102661A Micro modular pasting header for high speed fully automatic chip machine |
| 01/09/2008 | CN101102660A Pipette, segment and system consisting of pipette and segment for a mounting machine |
| 01/09/2008 | CN101102626A Metal heating plate |
| 01/09/2008 | CN100361565C Tape guide and magazine at a component machine |
| 01/09/2008 | CN100361564C Component belt conveyor wheel, component belt conveyor system and method for operating a component belt conveyor system |
| 01/09/2008 | CN100360274C Pallet feeder for feeding parts and picking up method for parts |
| 01/08/2008 | US7316060 System for populating a circuit board with semiconductor chips |
| 01/03/2008 | WO2008002044A1 System and methode for attaching coverlay |
| 01/03/2008 | WO2008001910A1 Surface mounting apparatus |
| 01/03/2008 | WO2008001654A1 Member supporting method |
| 01/03/2008 | WO2007128585A3 Workpiece carrier and workpiece positioning system and method |
| 01/03/2008 | US20080000077 Component Placement Apparatus |
| 01/03/2008 | DE102006030292A1 Electronic component classification method received by holding device particularly for accurate assembly of component carrier, involves comparing two reference value of misalignment and classifying received component |
| 01/03/2008 | DE102006030135A1 Pins array assembling device has body, which positively receives each end of pins spaced from printed board in direction of pins axis and in form fitting manner against tilting of pins axis, where body is pulled out after assembling pins |
| 01/03/2008 | DE102006027663A1 Optical inspection system for measuring e.g. unpacked electronic components, has endoscope with optical inlet and optical outlet arranged such that electronic component that is found in coverage penetrates under diagonal angle |