Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
06/2008
06/19/2008DE112006001388T5 Produktionsbedingungs-Bestimmungsverfahren, Produktionsbedingungs-Bestimmungsvorrichtung, Montagegerät und Programm Production condition determining method, production condition determining apparatus, assembly and device program
06/19/2008DE102006057738A1 Preparing versatile circuit board for marking, assembly or testing, drills marker holes and covers them in predetermined, detectable pattern to determine selection of processing operations
06/18/2008EP1932409A1 Cover tape and method for manufacture
06/18/2008EP1932408A1 Cover tape and method for manufacture
06/18/2008EP1625780B1 Electronic component feeder and electronic component feeding method
06/18/2008CN101204127A Electronic component placement method
06/18/2008CN101203092A Difference pair identifying method
06/18/2008CN101203074A Ultra-alloy minitype heater and method for making
06/18/2008CN100395540C Optical inspection system having integrated component learning
06/12/2008WO2008068313A2 Method for adapting an electronic component for surface mounting
06/12/2008WO2008068026A1 Guide rail for electronic components
06/12/2008WO2008046754A3 Mechanical stopper and method for transporting substrates in automatic placement machines
06/12/2008DE102006058299A1 Handhabungswerkzeug für Bauelemente, insbesondere elektronische Bauelemente Handling tool components, in particular electronic components
06/11/2008EP1929851A1 Machine body and system for assembling electric component on a substrate
06/11/2008EP1928754A2 Grease-resistant pinch-bottom bag having adhesive closure, adhesive closure for bag, and related methods
06/11/2008EP1468591A4 Method and apparatus for mounting a component
06/11/2008CN201072409Y Circuit board soldering point scanning and testing apparatus
06/11/2008CN101199249A Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device
06/11/2008CN101198249A Product line balance method and readable storage medium of computer
06/11/2008CN101198248A Surface mounting apparatus
06/11/2008CN101198247A PCB plate pasting method and pasted device
06/11/2008CN101198246A Device for correcting pin planeness of electron device
06/11/2008CN101198217A Parts wiring system and method
06/11/2008CN100394832C Carrier for carrying electronic component with base pin
06/11/2008CN100394577C Alignment method and mounting method using the alignment method
06/11/2008CN100394572C System for processing electronic devices
06/11/2008CN100394538C Component mounting apparatus and component mounting method
06/05/2008WO2008066531A1 Application of a viscous medium onto an electronic substrate
06/05/2008US20080130258 Electronic Component and Electronic-Component Production Method
06/05/2008US20080127610 Device for Packaging an Electronic Component
06/05/2008DE112006001702T5 Massengut-Bauelementzufuhreinrichtung Bulk component feeder
06/05/2008DE102007026914A1 Transport system for temporary provision of printed circuit board in assembled area of mounting machine, has lifting device, where other printed circuit boards are transported along x-direction at lifting device
06/05/2008DE102006056609A1 Kapazitiver Winkelkodierer und Feedereinschub für Bestückungsmaschinen von Leiterplatten Capacitive angle encoders and feeder device for insertion machines PCBs
06/04/2008EP1928222A1 Packaging method of electronic component module, method for manufacturing electronic apparatus using it, and electronic component module
06/04/2008EP1928221A2 Accumulator device for electronic components
06/04/2008EP1248509B1 Part mounting method, part mounting device, and recording media
06/04/2008CN101194547A Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method
06/04/2008CN101194546A Tape feeder
06/04/2008CN101192736A Zif connector type board and testing method of the same
06/04/2008CN100393189C Method for adjusting barrel supports and barrel
06/04/2008CN100392842C Apparatus and method for picking up semiconductor chip
06/04/2008CN100392798C Device and method for separating thin crystalline grains
05/2008
05/29/2008DE102006052454B3 Bestückkopf mit Rückstelleinrichtung und Bestückautomat Placement with restoring device and automatic placement
05/28/2008EP1925023A1 Method and device for depositing electronic components on a substrate
05/28/2008EP1754402B1 Component mounting order deciding method and component mounting order deciding apparatus
05/28/2008EP1529424B1 Device and method for detecting whether or not component holder is good, and apparatus and method for mounting electronic component
05/28/2008CN201066684Y Absorption device for integrated circuit module
05/28/2008CN101188930A Supplying and reclaiming device for viscous electric material in electronic components mounting device
05/28/2008CN101188929A A method for preventing BGA welding from be invalid
05/28/2008CN101188928A Auxiliary equipment for working of feeding equipment
05/28/2008CN100391325C Board carrier, component mounter, and method for carrying board in component mounting
05/28/2008CN100390034C Material feeder and device and component assembling apparatus adopting said feeder
05/22/2008WO2008059227A1 Workpiece carrier and workpiece carrier loading/unloading system and method
05/22/2008WO2008058851A2 Method for setting up an automatic machine for mounting semiconductor chips
05/22/2008WO2008058674A1 Installation for producing a circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound
05/22/2008WO2008008177A3 Method and apparatus for clamping a substrate
05/21/2008EP1621058B1 Gluing method and device
05/21/2008EP1240813B1 Device for placing components on a carrier
05/21/2008DE202008004089U1 Vorrichtung zum Abbinden und Isolieren von elektrischen Leitern und/oder Bündeln von elektrischen Leitern Apparatus for bonding and insulating electrical conductors and / or bundles of electrical conductors
05/21/2008DE202008004088U1 Vorrichtung zum Abbinden und Isolieren von elektrischen Leitern und/oder Bündeln von elektrischen Leitern Apparatus for bonding and insulating electrical conductors and / or bundles of electrical conductors
05/21/2008DE202008004087U1 Vorrichtung zum Abbinden und Isolieren von elektrischen Leitern und/oder Bündeln von elektrischen Leitern Apparatus for bonding and insulating electrical conductors and / or bundles of electrical conductors
05/21/2008CN201063978Y Multi-head buried welding machine
05/21/2008CN201063977Y Holding device structure improvement of tin soldering machine
05/21/2008CN201063975Y Demolding device for printed circuit board shaping apparatus
05/21/2008CN201061885Y Packaging adhesion stick
05/21/2008CN101185387A Production condition determining method, production condition determining apparatus, mounter, and program
05/21/2008CN101185386A Method for determining arrangement of production facility
05/21/2008CN101183657A Method for combining two objects using four cameras
05/21/2008CN101183608A Belt electronic parts and manufacturing method thereof
05/20/2008US7376486 Board positioning device and board positioning method
05/20/2008US7375278 Mounting components to a hardware casing
05/15/2008WO2008056754A1 Method for component mounting
05/15/2008WO2008056721A1 Moving device and electronic component mounting apparatus
05/15/2008WO2008055861A1 Placement head for placing electrical components on a substrate, comprising a reciprocating rotary motor
05/15/2008WO2008055748A1 Placement head comprising a readjusting mechanism, and placement robot
05/15/2008US20080112126 Releasing device for releasing hard disk drive
05/15/2008DE112006001458T5 Bandzuführvorrichtung Band feeding
05/15/2008DE10129760B4 Schaltungsträger mit Fiducial sowie Verfahren zu dessen Herstellung und Verfahren zur Qualitätsprüfung Circuit carrier with fiducial and to processes for its preparation and procedures for auditing
05/14/2008EP1920646A2 Device for examining workpieces
05/14/2008EP1731008B1 Method and revolver-like equipping head for equipping substrates with electrical components
05/14/2008EP1652415B1 Device for equipping flat substrates with electrical components
05/14/2008CN101179925A Surface mounting device
05/14/2008CN101179924A Universal bilateral composite mold integrated circuit pin forming mechanism of nesting structure
05/14/2008CN101179923A Substrate transfer apparatus and method of driving the same
05/14/2008CN101179918A Method for manufacturing cooling device assembly
05/14/2008CN100388874C Component mounting order optimization method, and component mounting apparatus using the method
05/13/2008US7370407 Disc centering device
05/08/2008WO2008052879A1 Method and device for serial-production mounting and bonding of electronic components on substrates
05/08/2008WO2008031981A3 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other
05/08/2008US20080104831 Electronic Component Mounting Apparatus And method Of Mounting Electronic Components
05/08/2008DE19807580B4 Verfahren und Vorrichtung zur quantitativen Messung des Korrosionsvorgangs von auf der Oberfläche elektronischer Schaltungsbaugruppen vorhandenen Rückständen Method and device for the quantitative measurement of the corrosion process of present on the surface of electronic circuit modules residues
05/08/2008DE112006001104T5 Trägerbandeinheit zum Zuführen elektronischer Komponenten, Vorrichtung zum Zuführen elektronischer Komponenten, Verfahren zum Verwalten von Komponenteninformationen in einer Vorrichtung zum Zuführen elektronischer Komponenten, Bestückungsvorrichtung elektronischer Komponenten und Verfahren zum Verwalten von Komponenteninformationen in einer Bestückungsvorrichtung elektronischer Komponenten Carrier tape unit for supplying electronic components, apparatus for feeding electronic components, method of managing information components in an apparatus for supplying electronic components, electronic components placing apparatus and method for managing information in a component mounting apparatus of electronic components
05/08/2008DE102007052488A1 Component i.e. bulk cartridge component, attaching method, involves pivoting component around pivoting axis proximate to stop, where pivoting axis extends perpendicular to feeding direction and retaining direction
05/08/2008DE102006052457A1 Dreh-Hub-Motor und Bestückkopf Rotary Lift motor and placement
05/08/2008DE102006052455A1 Bestückkopf zum Bestücken von Substraten mit elektrischen Bauteilen mit einem Dreh-Hub-Motor Placement of fitting substrates with electrical components with a rotary lift motor
05/08/2008DE102006030135B4 Vorrichtung zur Montage von Stiften auf einer Leiterplatte Device for mounting of pins on a printed circuit board
05/08/2008DE102005013283B4 Bestückautomat zum Bestücken von Substraten mit elektrischen Bauelementen Placement machine for populating substrates with electrical components
05/07/2008EP1839472B1 Pick-and-place machine comprising a locking device for coupling a feeding unit to it
05/07/2008CN101176170A Electronic component and method for fixing the same
05/07/2008CN101175396A Double-side mounting apparatus and method of manufacturing electric apparatus
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