Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
03/2007
03/29/2007WO2007034626A1 Packaging method of electronic component module, method for manufacturing electronic apparatus using it, and electronic component module
03/29/2007WO2007033701A1 Method and device for depositing electronic components on a substrate
03/29/2007WO2007001176A3 Device and method for filling elongate holders with controllable numbers of electronic components
03/29/2007WO2006095841A3 Component mounting method and mounter
03/29/2007US20070073428 Method and device for deciding support portion position in a backup device
03/28/2007EP1768480A1 Device to orient a supporting plate with respect to a plurality of axes
03/28/2007EP1767079A1 Clip ribbon and apparatus for splicing surface mounted device carrier tapes
03/28/2007CN2884814Y Bracket for installing printed circuit boards
03/28/2007CN2884813Y Braket implement for bearing printed circuit boards
03/28/2007CN2884812Y Automatic stage feeder for electronic parts
03/28/2007CN1939109A Method and revolver-like equipping head for equipping substrates with electrical components
03/28/2007CN1939101A Circuit board, its manufacturing method, and joint box using circuit board
03/28/2007CN1937909A Installation system, installation method, installation programe and recording medium
03/28/2007CN1937908A Automatic assembling machine for microphone
03/28/2007CN1937887A Structure and method for reducing warp of substrate
03/28/2007CN1307860C Loader and unloader for workpiece
03/28/2007CN1307705C Thin film clamping device for keeping thin film planeness
03/28/2007CN1307703C Lead forming device of semiconductor element, lead forming system and method
03/28/2007CN1307683C Small gap non-binding electrostatic sealing process for sensor
03/28/2007CN1307390C Automatic assembling apparatus of electronic device of lighter
03/22/2007WO2007033349A1 Pick and place machine with improved component pick image processing
03/22/2007DE102004058702B4 Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat A method for the calibration of the gripping axis of the bonding head of an automatic machine for the mounting of semiconductor chips on a substrate
03/21/2007EP1765050A2 Feeding apparatus for electrical components
03/21/2007EP1764826A1 Device for measuring the positions of electronic components
03/21/2007EP1763843A1 Method of generating image of component
03/21/2007EP1413182B1 Device for supporting flat products
03/21/2007EP1181535B1 Method and apparatus for inspecting solder paste deposits on substrates
03/21/2007CN1934919A Method for gluing circuit components on circuit board
03/21/2007CN1933943A Vacuum suction unit
03/21/2007CN1933719A Method and device for checking result output
03/21/2007CN1933718A Part mounting apparatus
03/21/2007CN1933717A Feeding apparatus for electrical components
03/21/2007CN1933121A Adjustable tool holder
03/21/2007CN1932491A Substrate inspection system
03/21/2007CN1306605C Film carried belt for mounting electronic components thereon
03/21/2007CN1306396C Improved semi-automatic pick and place machine for assembly of components
03/20/2007US7192150 Work piece holding apparatus, work piece illumination apparatus and work piece inspection system
03/20/2007US7191512 Tray system for holding and positioning components
03/20/2007US7191511 Electronic component placement machine having camera units with vertically overlaid apertures
03/15/2007DE102005041464A1 Thermoden unit for joining and or electrically contacting many semiconductor elements with a common substrate or second element by warming adhesive under pressure has movable heating head and two heating plates
03/15/2007DE102005036821A1 Verfahren zum Transferieren und Vorrichtung zum Handhaben von elektronischen Bauelementen A method for transferring and apparatus for handling of electronic components
03/14/2007EP1380197B1 Device for characterising component stores and method for using said device
03/14/2007CN2879611Y High-speed pick and place machine utilizing multi-head turret mechanism
03/14/2007CN1929948A Repair soldering head having a supply channel for a heat transfer medium and a return channel for said heat transfer medium, and the use thereof
03/14/2007CN1929732A Belt type feed device and surface mounting machine
03/14/2007CN1305360C Method and device for searching standard and method for detecting standard position
03/13/2007US7190446 System for processing electronic devices
03/13/2007US7190393 Camera with improved illuminator
03/13/2007US7188781 Method and apparatus for detecting a liquid spray pattern
03/13/2007US7188409 Method for rejecting component during a placement cycle
03/08/2007WO2006112711A3 Method and device for displacing electronic components ordered in a rectangualr structure
03/08/2007WO2006081900A3 Positioning device provided with a linearly displaceable positioning unit
03/08/2007US20070052112 Support with solder ball elements and a method for populating substrates with solder balls
03/08/2007DE19932021B4 Bandförderer für eine Vorrichtung zum Montieren von Bauteilen Belt conveyors for an apparatus for mounting components
03/08/2007DE10393843T5 Zubringerwagen, verwendet zum Integrieren von Zubringermechanismen und Oberflächenmontagemaschinen verschiedener Typen Delivery trolleys used for integrating shuttle mechanisms and surface mounting machines of various types
03/08/2007DE10341046B4 Vakuumsaugvorrichtung und Betriebsverfahren hierfür Vacuum suction device and operating method therefor
03/07/2007EP1761123A2 Component mounting head for mounting electric components onto substrates, method of recharging and, mounting method
03/07/2007EP1759567A1 Apparatus for electronic component mounting
03/07/2007CN1926937A Linear driving mechanism and electronic component mounting apparatus using the same
03/07/2007CN1925729A Small-sized electric source module and assembling method therefor
03/07/2007CN1925704A Packaging equipment and its configuration
03/07/2007CN1303860C Working system for substrate
03/06/2007US7185424 Electronic component mounting method and apparatus
03/06/2007US7185422 Part mounting apparatus and part mounting method
03/01/2007WO2007023701A1 Component mounting method
03/01/2007WO2007023692A1 Electronic component mounting device and method
03/01/2007WO2007022835A1 Device and method for continuously producing a defective-free carrier strip
03/01/2007WO2006006509B1 Substrate processing apparatus and mounter
03/01/2007CA2620163A1 Device and method for continuously producing a defective-free carrier strip
02/2007
02/28/2007EP1758436A1 Electronic package and circuit board having segmented contact pads
02/28/2007EP1756683A1 Closed-loop reel setup verification and traceability
02/28/2007EP1756513A2 A method and a system for height triangulation measurement
02/28/2007EP1541002B1 Apparatus and method for inspecting cream solder printed on a substrate
02/28/2007EP1442646B1 Device for the transport of flexible planar material, in particular circuit boards
02/28/2007CN2875011Y Picking device for electronic element
02/28/2007CN2875010Y Support processing tool
02/28/2007CN2873673Y Package belt assembly for placing mounting part with hole surface
02/28/2007CN1922949A Support pin holding device and substrate supporting device
02/28/2007CN1922560A Line balance control method, line balance controller, and component mounting unit
02/28/2007CN1921749A Part mounting method and system
02/28/2007CN1921736A Method and system for creating B side and T side detailed list of veneer
02/28/2007CN1920868A 信息处理装置及信息处理方法 The information processing apparatus and information processing method
02/28/2007CN1920574A Solder material test apparatus, and method of controlling the same
02/28/2007CN1302279C System and method for analysing surface condition of printed circuit board using red, green and blue colours
02/27/2007US7181833 Method of mounting an electronic part
02/22/2007WO2007021026A1 Electronic component placement method
02/22/2007WO2007020761A1 Work fixing apparatus, method for positioning such work fixing apparatus, and image forming apparatus
02/22/2007DE102005055670A1 Inspection system e.g. for testing quality of connection points of electronic modules, includes optical system for recording image of tested connection point
02/22/2007DE102005035420A1 Modular aufgebaute Vorrichtung zum Bestücken von Substraten Modular device for populating substrates
02/22/2007DE102004055719B4 Vorrichtung zum Bestücken von Bauelementeträgern mit Bauelementen Apparatus for populating component carriers with components
02/21/2007EP1754402A2 Component mounting order deciding method and component mounting order deciding apparatus
02/21/2007CN2871457Y Automatic retracter of inclined printing circuit board
02/21/2007CN2871455Y Structure improvement of framed thin-plate inserted retracter
02/21/2007CN1918052A Information acquisition device for external mounting and method for external mounting
02/21/2007CN1917745A Soldering apparatus and soldering method
02/21/2007CN1917744A Method for assembling and positioning extended slot seat for interface card
02/21/2007CN1915779A Component feeder
02/21/2007CN1301614C Position regulating structure of sensitization element of scanner and its manufacturing method
02/21/2007CN1301402C Method for inspecting location of inspected device and object on printing circuit board
02/20/2007US7181307 Electronic circuit component mounting system, mounting control program, and system to prevent erroneous setting of electronic circuit components